News – Page 2163 – EEJournal

Laird Technologies to Participate in Wearable Technologies Show at MEDICA 2011

November 3, 2011

St. Louis, Missouri, USA – October 26, 2011 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced it will be participating in the Wearable Technologies Show (WTshow) at MEDICA 2011. The show will take place in Düsseldorf, Germany, November 16-19, 2011. Laird Technologies can be found in hall #15, booth #C04.

Laird Technologies will highlight its Bluetooth® Enhanced AT Data Module (BTM44x series) with Health Device Profile (HDP). The BTM44x series provides an additional abstraction of the ISO/IEEE data … Read More → "Laird Technologies to Participate in Wearable Technologies Show at MEDICA 2011"

CISSOID Releases HADES®, a High Temperature and High Reliability Isolated Gate Driver for High Density Power Converters

November 3, 2011

Mont-Saint-Guibert, Belgium – November 3, 2011. CISSOID, the leader in high-temperature and high reliability semiconductor solutions launched HADES^®, the first isolated gate driver solution designed to drive high temperature power transistors, specifically (but not exclusively) Silicon carbide (SiC) and Gallium nitride (GaN) fast-switching devices.

With HADES^®, system engineers can develop power converters that are 5 times smaller and lighter than before, with better efficiency. They will also get power converters able to operate in high temperature ambiance if required. No matter what the ambient temperature is, the life time of the system … Read More → "CISSOID Releases HADES®, a High Temperature and High Reliability Isolated Gate Driver for High Density Power Converters"

Ziptronix Announces Industry’s Lowest Distortion Capability For Backside Illuminated Image Sensor Applications

November 3, 2011

RESEARCH TRIANGLE PARK, N.C. – Nov. 2, 2011 – Ziptronix Inc., the leading developer of direct bonding technology for advanced semiconductor applications, announced today that recent collaborations with major image-sensor manufacturers have shown that the Ziptronix ZiBond^TM direct bonding process contributes minimum distortion in backside illuminated (BSI) image sensors.

“In addition to confirming that the Ziptronix direct bonding technology delivers the lowest distortion of any process for manufacturing BSI image sensors, these results have tremendous bottom-line significance for image sensor makers,” said Ziptronix CEO Dan Donabedian. “Minimal … Read More → "Ziptronix Announces Industry’s Lowest Distortion Capability For Backside Illuminated Image Sensor Applications"

Tektronix Announces Industry’s Fastest Coherent Lightwave Signal Analyzer

November 3, 2011

BEAVERTON, Ore., Nov. 2, 2011 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced the OM4106D Coherent Lightwave Signal Analyzer – the first coherent test system with 33 GHz bandwidth support. This industry-fastest performance is achieved through tight integration with the DPO70000D Series oscilloscopes for exceptional real-time performance along with purpose-built algorithms with best laser phase tolerance, no pattern length limitation and insightful displays for fast analysis and … Read More → "Tektronix Announces Industry’s Fastest Coherent Lightwave Signal Analyzer"

Industry-First Xilinx 7-Series FPGA Network Processing Card

November 3, 2011

November 2^nd, 2011 – Nallatech, a leading supplier of high-performance COTS and custom FPGA solutions, announces the availability of the PCIe-287N. This network processing card is the industry’s first off-the-shelf solution to deliver Xilinx 7-Series performance for network processing, cyber security, and algorithm-acceleration applications.

Two user-accessible Kintex-7 FPGAs are directly coupled to four SFP+ ports to support 1GbE and 10GbE. Each FPGA utilizes multiple independent banks of high-bandwidth, QDR-II+ SRAM and DDR3 SDRAM to support random access and deep storage. A third, dedicated FPGA facilitates an 8-lane, PCIe Gen 2, host interface … Read More → "Industry-First Xilinx 7-Series FPGA Network Processing Card"

2nd Generation Intel® Core™ i7/i5 Mobile Processor Mini-ITX with Extended HD Graphics Performance

November 3, 2011

November 02, 2011, Irvine, California –Advantech, the embedded platform and integration services provider, is happy to announce AIMB-272, a new industrial-grade, Mini-ITX motherboard supporting the latest Intel^®Core™i7/i5/i3 and Intel^® Celeron^® mobile processors with FCPGA 988 socket. Intel^® Core™i7/i5/i3 and Intel^® Celeron^® mobile series processors … Read More → "2nd Generation Intel® Core™ i7/i5 Mobile Processor Mini-ITX with Extended HD Graphics Performance"

Xilinx Appoints Prevas as Advanced Training Provider for Nordic Region

November 2, 2011

STOCKHOLM, Nov. 2, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today announced that it has appointed technology specialist, Prevas AB, as its exclusive Authorized Training Provider (ATP) serving Xilinx customers throughout Denmark, Finland, Norway and Sweden.

The agreement makes Prevas the single point of reference for official Xilinx education in the Nordic area as part of Xilinx’s global network of appointed ATPs offering customer courses that address challenges such as FPGA design for performance, embedded hardware, software, connectivity and DSP. The courses use high-quality training materials developed by Xilinx and leverage the specialized knowledge of … Read More → "Xilinx Appoints Prevas as Advanced Training Provider for Nordic Region"

Microsemi Expands DDR3 SDRAM Family with 4GByte Solution for High-reliability Applications

November 2, 2011

ALISO VIEJO, Calif.—Nov. 2, 2011—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a DDR3 SDRAM memory device that is the first of its kind to be packaged in a single plastic ball grid array (PBGA) and offered as a compact x64/x72 unregistered dual in-line memory module (UDIMM )/small outline dual in-line memory module (SODIMM). The solution provides up to 4GByte compact memory densities that support high-performance processors and chipsets in mission-critical applications such as avionics, UAVs, missile systems and other defense applications that require high … Read More → "Microsemi Expands DDR3 SDRAM Family with 4GByte Solution for High-reliability Applications"

Crossing Automation Extends 450mm Product Portfolio

November 2, 2011

Fremont, Calif. – November 1, 2011 – Crossing Automation, Inc. (www.crossinginc.com), a leading designer and manufacturer of fab and tool automation products used by today’s foremost semiconductor device and equipment companies, today introduced the Crossing Spartan™ 450mm Development Platform and Crossing Certon™ 450 Loadport. The company has received orders for both products from leading original equipment manufacturers (OEMs). The Loadports are expected to ship in December, with the Development Platform shipping in the first quarter of 2012.

“There is no question that 450mm … Read More → "Crossing Automation Extends 450mm Product Portfolio"

octoScope’s Customers Use octoBox for Wireless Product Production Test; Demos Scheduled at RoboBusiness Leadership Summit

November 2, 2011

Boston, MA– RoboBusiness Leadership Summit–November 1, 2011–octoScope, Inc., a wireless solutions and services company, announced today that its wireless test product, octoBox& … Read More → "octoScope’s Customers Use octoBox for Wireless Product Production Test; Demos Scheduled at RoboBusiness Leadership Summit"