VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices
Taipei, Taiwan, November 2, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest Em-ITX form factor board, the VIA EITX-3002, which combines rich I/O with outstanding multimedia capabilities. Partnered with the new VIA AMOS-5002 industrial chassis kit, the VIA EITX-3002 provides the ideal solution for a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.
The VIA EITX-3002 combines the VIA VX900 … Read More → "VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices"

