News – Page 2162 – EEJournal

Latest addition to Hitachi’s growing Rugged+ TFT display line up

November 4, 2011

Maidenhead, UK. 2 November 2011. Hitachi Europe Ltd, Display Products Group (DPG) has announced the introduction of a new high performance 5.0” VGA TFT display module the TX13D04VM2CAA. The transmissive display module is the latest addition to Hitachi’s Rugged+ TFT product line up and provides VGA (640 x 480 pixels) resolution and exceptional optical performance. The new Rugged+ display module has been designed and developed to operate in demanding industrial and extreme environmental conditions.

Mark Stephenson, Product Marketing Manager, Hitachi DPG commented, “Harsh operating environments where extremes of temperature, … Read More → "Latest addition to Hitachi’s growing Rugged+ TFT display line up"

DesignArt Networks Selects Elliptic Technologies Embedded Security Engine for its 2nd Generation DAN3000 LTE Advanced Infrastructure SoCs

November 4, 2011

November 3, 2011 – Ottawa, Canada and Ra’anana, Israel: Elliptic Technologies, a leading global supplier of security IP and software, has joined forces with DesignArt Networks, a leading provider of highly integrated SoCs to integrate a comprehensive security solution targeting advanced 3GPP HetNet infrastructure products.

DesignArt Networks has licensed Elliptic’s high performance Security Protocol Accelerator for LTE (SPAcc-LTE) for use in its DAN3000 family of SoCs, targeting 3G and 4G base stations for the … Read More → "DesignArt Networks Selects Elliptic Technologies Embedded Security Engine for its 2nd Generation DAN3000 LTE Advanced Infrastructure SoCs"

Micron Debuts Industry’s Broadest Portfolio for Load Reduction Modules, Boosting DRAM Performance and Memory Capacity for Enterprise Server Applications

November 4, 2011

BOISE, Idaho, Nov. 3, 2011 (GLOBE NEWSWIRE) — Micron Technology, Inc., today announced a new portfolio of load reduced dual-inline memory modules (LRDIMMs) featuring a 64GB offering. In addition to the standard densities of 8GB, 16GB and 32GB, which are sampling in high volume to several customers, Micron is introducing a 64GB LRDIMM to meet the ever-growing density requirements of servers.

Micron continues its memory market leadership with modules that provide 50 percent higher memory capacity and a performance increase of 33 percent for server applications. Resulting improvements to system scalability can significantly enhance cloud computing, high-performance computing, Web servers, transactional databases, … Read More → "Micron Debuts Industry’s Broadest Portfolio for Load Reduction Modules, Boosting DRAM Performance and Memory Capacity for Enterprise Server Applications"

Agilent Technologies Launches ‘Test of Time’ Power Supply Contest

November 4, 2011

What: Around the world, engineers continue to use HP/Agilent power supplies that were built many years ago. Engineers who are still using a vintage instrument are invited to write a short biography of their DC power supply and tell how the instrument has been used over the years and how they are using it now to overcome test challenges.

“Agilent has 50 years of power supply expertise and more than 250 basic and high performance programmable DC power supplies designed to meet the needs of the many industries and applications,” said Kari Fauber, Marketing Manager, … Read More → "Agilent Technologies Launches ‘Test of Time’ Power Supply Contest"

Meggitt Sensing Systems Announces Global Market Launch of Endevco Subminiature Surface Mountable Shock Accelerometers

November 4, 2011

November 3, 2011 – San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco® model 71M series, a family of rugged, undamped subminiature surface mountable piezoresistive accelerometers, designed to support a variety of high-g shock measurement requirements.

With available g ranges of 2K, 6K, 20K and 60K, design of the Endevco® model 71M series features a patented, monolithic, four-active arm bridge circuit design (U.S. patent numbers 4,498, 229, 4,605,919 and 4,689,600) incorporating the use of Meggitt’s own proprietary sensing element, machined in-house from a single piece of silicon at its ISO9001 … Read More → "Meggitt Sensing Systems Announces Global Market Launch of Endevco Subminiature Surface Mountable Shock Accelerometers"

Xilinx Showcases Secure Products and Applications at MILCOM 2011

November 3, 2011

SAN JOSE, Calif., Nov. 3, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today announced participation at MILCOM 2011in Baltimore, from November 7-10, at the Baltimore Convention Center, Booth #914. Xilinx will show Android software running on the Zynq™-7000 EPP Emulation Platform, beam forming and digital pre-distortion (DPD) applications running on Virtex®-6 devices, as well as defense-grade and space-grade FPGAs.

What: MILCOM 2011

Where: Baltimore, MD, Baltimore Convention Center, Booth #914

When: Conference & Exhibits – November 7-10, 2011

Exhibition Demos

Monday – Thursday, November 7-10</ … Read More → "Xilinx Showcases Secure Products and Applications at MILCOM 2011"

Eurotech and IBM Contribute Software to Connect Next Generation of Wireless and Mobile Devices

November 3, 2011

LUDWIGSBURG, Germany, Nov. 3, 2011 /PRNewswire/ — IBM (NYSE: IBM) and Eurotech (ETH.MI) today announced that they are contributing software to accelerate and support the development of a new generation of smarter wireless and mobile devices. The technology, which could become the basis for a new standard of mobile connectivity and interoperability, will be contributed to the Eclipse Foundation open source community.

The Eclipse Foundation, … Read More → "Eurotech and IBM Contribute Software to Connect Next Generation of Wireless and Mobile Devices"

Microchip Announces Wider Temperature-Range Qualification for 32-bit PIC32 Microcontrollers

November 3, 2011

CHANDLER, Ariz., Nov. 2, 2011 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, today announced that the 32-bit PIC32 microcontrollers (MCUs) now operate from – 40°C to 105°C, enabling their use in a wide range of robust applications. Examples include applications in the communications, industrial, medical, Read More → "Microchip Announces Wider Temperature-Range Qualification for 32-bit PIC32 Microcontrollers"

Transonics new warehouse and logistics centre doubles component distribution capacity

November 3, 2011

Transonics plc. the London based leading supplier of electronic components and logistics solutions, have been distributing electronic components for over 35 years. Providing value added services including customised design solutions, dedicated buffer stocks, consignment stocking, Kanban, order scheduling, device programming, laser oblation and technical support Transonics offers its customers far more than the conventional broad line distributors”.

With the acquisition of Lewmax, one of Europe’s major independent device programming companies, in 2006 Transonics has been holding component stocks in two warehouses, one in London and the other in Leicestershire.

In order to … Read More → "Transonics new warehouse and logistics centre doubles component distribution capacity"

TowerJazz Reference Design Flow 2.0 Fully Qualifies Cadence Mixed-Signal Solution and Process Design Kit

November 3, 2011

SAN JOSE, CA–(Marketwire – November 03, 2011) – Cadence products are qualified at the world’s leading foundries, helping enable production of some of the most advanced and complex ICs, including mixed-signal chips that serve as the core of many of today’s most popular consumer electronics. The collaboration between Cadence and TowerJazz takes aim at accelerating design implementation while reducing risk and lowering overall development costs. The foundry’s Reference Design Flow 2.0 delivers both advanced mixed-signal methodology based on OpenAccess and SKILL-based process design kits (PDKs) to enable silicon success and faster time to market for customers.Cadence Design Systems, … Read More → "TowerJazz Reference Design Flow 2.0 Fully Qualifies Cadence Mixed-Signal Solution and Process Design Kit"

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