News – Page 2158 – EEJournal

Magma brings Silicon One Seminar Series to Europe

October 10, 2011

SAN JOSE, Calif., October 10, 2011 — Magma® Design Automation (Nasdaq: LAVA), a provider of chip design software, brings its Silicon One Seminar Series to Europe next month, with one-day seminars to be held in the UK and France. The European dates are part of a global roadshow which includes events in the US, Korea, China, Taiwan, Japan and Israel. Magma will host the France seminar on Tuesday 8th November at Sophia Antipolis, and on Thursday 10th November in London.

Each one-day seminar will comprise two technology tracks, entitled “Leading-Edge System-on-Chip Performance in Half … Read More → "Magma brings Silicon One Seminar Series to Europe"

Advantech-DLoG TREK-753 Mobile Data Terminal: Feature-Packed, Rugged Operation in a Friendly Design

October 10, 2011

Irvine, California, October 06, 2011 – Advantech-DLoG, a leading mobile computing platform provider, is pleased to announce the availability of TREK-753, a ruggedly designed mobile data terminal, suitable for in-vehicle applications in the harshest environments. The TREK-753 is feature-rich and ruggedized, with a friendly-to-use design; it can improve safety, security and efficiency in a variety of in-vehicle, vertical markets.

Supports a Variety of On-road Vehicles

TREK-753 is built tough. It has an EN 60721-3-5 certification, and meets military standards for vibration and shock. This ruggedness allows TREK-753 to boldly go where others dare not, … Read More → "Advantech-DLoG TREK-753 Mobile Data Terminal: Feature-Packed, Rugged Operation in a Friendly Design"

Cree’s New Z-Rec(TM) Silicon Carbide Schottky Diodes Improve Energy Efficiency in Solar Micro Inverter Designs

October 7, 2011

DURHAM, N.C., October 6, 2011 — Cree, Inc. (Nasdaq: CREE), a market leader in silicon carbide (SiC) power devices, continues its mission of advancing the adoption of SiC into mainstream power applications. Cree’s advances in SiC technology are setting new standards in energy efficiency while reducing system costs and improving reliability when compared to silicon-based power devices. Cree’s latest addition to its 1200V SiC Schottky diode product offering includes four new surface mount devices in 2A, 5A, 8A, and 10A current ratings and packaged in the industry-standard surface mount TO-252 D-Pak. … Read More → "Cree’s New Z-Rec(TM) Silicon Carbide Schottky Diodes Improve Energy Efficiency in Solar Micro Inverter Designs"

Rohde & Schwarz’s ZVH Series Analyzer Eases Installation, Maintenance & Analysis of Cable and Antenna Systems

October 7, 2011

Columbia, MD — October 6, 2011 — Rohde & Schwarz, a leading manufacturer of test & measurement, communications and broadcasting equipment, has developed a handheld cable and antenna analyzer that features an advanced set-up measurement “wizard” to simplify the user interface. Optimized for cable and antenna measurements, the handheld ZVH Series analyzer’s measurement wizard enables users to easily set up test parameters and execute all measurements with the touch of a single button.

Capable of multiple measurements, including reflection, cable loss, distance-to-fault and transmission measurements, the ZVH Series analyzer provides a high dynamic range of up to 100 dB for … Read More → "Rohde & Schwarz’s ZVH Series Analyzer Eases Installation, Maintenance & Analysis of Cable and Antenna Systems"

austriamicrosystems further extends its leading edge High-Voltage CMOS technology towards power grid applications

October 7, 2011

Unterpremstaetten, Austria (October 6, 2011) – austriamicrosystems’ (SIX: AMS) Full Service Foundry business unit today announced at the GSA (Global Semiconductor Alliance) Semiconductor Ecosystems Summit a further extension of its 0.35 µm High-Voltage CMOS technology portfolio. By introducing special inter-metal dioxide (IMD) layers, galvanic isolation is significantly improved to over several hundred volts.

In an increasing number of complex analog/mixed-signal applications, such as switching-mode-power-supplies (SMPS) and motor drivers, two individual ICs must operate together, even though they operate at significantly different voltage levels. In order to achieve synchronized performance, isolated communication between these two … Read More → "austriamicrosystems further extends its leading edge High-Voltage CMOS technology towards power grid applications"

Curtiss-Wright Controls Electronic Systems Introduces New Rugged Power and Control Module

October 7, 2011

LITTLETON, MA – October 6, 2011 — Curtiss-Wright Controls Electronic Systems, a business group of Curtiss-Wright Controls and a leading system integrator of rugged deployed integrated electronics for the aerospace, defense and industrial markets, has announced a new rugged Power and Control Module (PCM) board that provides high level control and bridging to a system host via Ethernet (IEEE 802.3), USB, RS-232 and CANbus. This rugged intelligent system monitor board’s onboard software and logic can easily be programmed to autonomously manage a computing enclosure or platform. The PCM … Read More → "Curtiss-Wright Controls Electronic Systems Introduces New Rugged Power and Control Module"

PICMG 1.3 Industrial SBC with Intel® Core™ i7/i5 Processor and Intel® QM57 Chipset

October 7, 2011

Munich, September 2011 – The new PICMG 1.3 industrial Slot-CPU 96M4371o from DSM Computer is based on the Intel^® QM57 power-saving mobile chipset and is making its debut appearance at the SPS/IPC/DRIVES in Hall 7, stand 150. The compact SBC features an Intel^® Core™ i7-620M processor with 2.66 GHz and 4 MB cache or i5-520M with 2.4 GHz and 3 MB cache. The budget variant incorporates the Intel^® Celeron^® P4500, running at 1.86 GHz. All three processor types come with two CPU … Read More → "PICMG 1.3 Industrial SBC with Intel® Core™ i7/i5 Processor and Intel® QM57 Chipset"

Micron and Samsung Launch Consortium to Break Down the Memory Wall

October 7, 2011

BOISE, Idaho and SEOUL, Korea, Oct. 6, 2011 (GLOBE NEWSWIRE) — Samsung Electronics Co., Ltd. and Micron Technology, Inc. (Nasdaq:MU), — world leaders in memory technology — today announced the creation of a consortium for OEMs, enablers and integrators that will collaborate in developing and implementing an open interface specification for an innovative new memory technology called the Hybrid Memory Cube (HMC).

Micron and Samsung are the founding members of the Hybrid Memory Cube Consortium (HMCC), and will work closely with fellow developers Altera Corporation, Open Silicon, Inc., and Xilinx, Inc. to collectively accelerate industry efforts in bringing to … Read More → "Micron and Samsung Launch Consortium to Break Down the Memory Wall"

Super Talent Introduces new Green-Line VLP for Servers

October 7, 2011

October 7, 2011 – Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design … Read More → "Super Talent Introduces new Green-Line VLP for Servers"

eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms

October 7, 2011

SUNNYVALE, CA – October 7, 2011 – eSilicon Corporation, the largest independent semiconductor value chain producer (VCP), and MIPS Technologies (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores, announced the tapeout of a high-performance, three-way microprocessor cluster on GLOBALFOUNDRIES’ leading-edge, low-power 28nm-SLP process technology. Wafers are currently running in GLOBALFOUNDRIES’ Fab 1 in Dresden, Germany, with silicon expected in early 2012. SoC designs can start immediately. MIPS provided the RTL based on its leading-edge MIPS32® 1074Kf™ Coherent Processing System (CPS), and eSilicon performed the synthesis and timing-driven layout, optimizing the design to achieve true worst-case … Read More → "eSilicon and MIPS Technologies Announce Tapeout of 28nm 1.5GHz Microprocessor Cluster for Embedded Platforms"

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