EMBEDDED TECHNOLOGY CONFERENCE, Tokyo, Japan, Nov. 17, 2009 – Mentor Graphics Corporation (NASDAQ: MENT), a leading provider of embedded Linux and Android solutions, today announced its delivery of the Android Development System for the Texas Instruments Incorporated (TI) OMAP35x processors based on ARM® Cortex™-A8 technology. Customers working on OMAP35x processor-based designs can leverage the Mentor Graphics version of the Android application framework to successfully deploy Android-based applications.

The Mentor Graphics solution for Android opens the door for OMAP35x developers designing medical, communication, industrial, instrumentation, home security and digital video applications. To get … Read More → "Mentor Graphics Delivers Optimized Android Development System for the OMAP35x Processors from Texas Instruments"

Offering Support for PROFINET Applications

DUSSELDORF (Germany), November 18, 2009 — NEC Electronics Europe today announced an addition to its family of development kits for the PROFINET industrial Ethernet controller, ERTEC (Enhanced Real-Time Ethernet Controller).This new, low cost ERTEC development kit delivers further choice to PROFINET application developers.

NEC Electronics’ development kit can be utilized as a low cost entry vehicle for developers that are beginning to evaluate PROFINET and ERTEC200. For those developers already familiar with PROFINET or those that are ready to begin their application development the standard ERTEC200 and … Read More → "NEC Electronics Europe Introduces Low Cost ERTEC Development Kit"

Scalable processor architecture provides lowest cost yet versatile and feature-rich solution that will secure customers’ design investments across a range of embedded applications

Wokingham, UK – November 17, 2009. EnSilica, a leading independent provider of front-end IC design services, has significantly enhanced its design service capability with the addition of three new, highly configurable and low-power soft processor cores – the eSi-1600, eSi-3200 and eSi-3250 – to its customer IP portfolio. The new processor cores are available immediately for deployment as part of EnSilica’s full specification-to-silicon design service through a number of leading foundries … Read More → "EnSilica boosts front-end IC design services with launch of new eSi-RISC configurable processor cores"

Demanding AMS project design and tapeout schedule met in 22 days

MOUNTAIN VIEW, Calif., November 16, 2009 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Digital Imaging Systems GmbH (DIS) has achieved first-pass silicon success using Synopsys’ Galaxy Custom Designer(TM) implementation solution and its unified suite of circuit simulation, extraction and physical verification tools for a custom integrated circuit (IC) used in DIS’ high performance, multi-megapixel camera modules. The productivity enhancements afforded by Custom Designer, combined with its interoperable and open environment, enabled DIS … Read More → "Digital Imaging Systems achieves first-pass silicon success with Synopsys Galaxy Custom Designer"

The new affordable modular desk HiL (Hardware-in-the-Loop) solution CompactHiL based on the ME-Neuron is available now.

MEILHAUS Electronic GmbH, located in Munich developed in cooperation with COSATEQ GmbH & Co. KG from Wangen an affordable modular desk Hardware-in-the-Loop (HiL) simulator solution. This system is a combination of the full CompactPCI based DAQ PC system – ME-Neuron and the real-time simulation environment SCALE-RT.

ME-Neuron and SCALE-RT combined offer a complete stand-alone “CompactHiL” system optimized for data acquisition, control, and real-time operations. The system includes perfectly matching components – starting with the … Read More → "COSATEQ presents new desk Hardware-in-the-Loop solution"

Campbell, CA – October 29, 2009 – Silicon Frontline Technology, Inc. (Silicon Frontline), an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that since the May introduction of the company and its first products, F3D (Fast 3D) for fast 3D extraction and R3D (Resistive 3D) for 3D extraction and analysis of large resistive structures, the company has achieved success and validated its position as a player in the post-layout verification and 3D extraction markets.

F3D is chosen for providing nanometer and Analog Mixed Signal (A/MS) … Read More → "Silicon Frontline Announces Success and Recognition; Post-Layout Verification Products Stand Out for Semiconductor Power Device, Nanometer and A/MS Design"

Washington DC, USA and Cheltenham, UK – 12th November 2009. Artisan® Software Tools, the world’s largest independent supplier of industrial-grade, collaborative modeling tools for complex, mission and safety-critical embedded systems and software, has announced that Bloor Research has published one of its “InDetail” research reports on Artisan Studio. The Report analyzes Artisan Studio’s capabilities and its importance as a standards-based, graphical systems and software engineering tool which, in their view, caters well for large, distributed teams working on mission and safety-critical projects involving the integration of software, hardware and human processes.

… Read More → "Bloor publishes in-depth Research Report on Artisan Studio"

Latest Additions Increase Efficiencies, Lower Cost, Address Requirements of the HDMI 1.4 Specification

SANTA CLARA, Calif., Nov. 9, 2009 — Agilent Technologies Inc. (NYSE: A) today announced that its enhanced High-Definition Multimedia Interface (HDMI) test solution portfolio is being demonstrated at the CEA 861/HDCP PlugFest13, Nov. 8-13, in Burlingame, Calif. The expanded solution enables engineers to test the new features introduced by the HDMI Specification 1.4 such as HEAC (HDMI Ethernet and Audio Return Channel) support or 4K x 2K and 3-D video format support. The test solution also increases efficiencies, reduces development costs and provides highly accurate test results.

NXP Rated #1 in Contactless Transaction IC Vendor Matrix for the third year in a row

Eindhoven, Netherlands, November 11th, 2009 – NXP today announced that it has maintained the number one slot in ABI Research’s Contactless Transaction IC Vendor Matrix rankings. The survey examines the contactless semiconductor market for payment, ticketing and Near Field Communication (NFC) applications and ranks each of the vendors according their ability to innovate and implement the technology.

In addition to holding the number one position in the overall ranking of contactless transaction IC vendors, analysts at ABI Research also … Read More → "ABI Research confirms NXP’s Leadership in Contactless IC market"

SANTA CLARA, Calif., and Nashua, NH, Nov. 9, 2009 — Agilent Technologies Inc. and Nexus Technology Inc. today made available DDR3-1867 DIMM and DDR3-1600 SODIMM slot interposer test solutions. These test solutions are the ideal tools for designers performing DDR3 DIMM or SODIMM validation, failure analysis, and bus functional-parametric validation in servers, supercomputing, desktops, laptops and computing applications.

The test solutions are comprised of the Agilent 16962A logic analyzer module and either a Nexus NT-DDR3DIHS or Nexus NT-DDR3SOIHS slot interposer for next-generation, double-data rate (DDR3) SDRAM buses.

The new interposers are designed for … Read More → "Agilent Technologies, Nexus Technology Deliver DDR3 Memory Bus Debug Solutions"