News – Page 2020 – EEJournal

High-End Fanless In-Vehicle Computer Features Intel Core i7 Technology

May 25, 2012

Acrosser, the leading industrial computer designer and manufacturer is pleased to announce the release of its fanless in-vehicle computer AR-V6100FL features Intel Core i7 technology. AR-V6100FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

AR-V6100FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, … Read More → "High-End Fanless In-Vehicle Computer Features Intel Core i7 Technology"

Silicon Frontline Adds New Capabilities; Focuses on Semiconductor Power Device Reliability and Efficiency, Accurate 3D Parasitic Extraction, Point-to-Point Resistance

May 25, 2012

Campbell, CA – May 24, 2012 – Silicon Frontline Technology, Inc. (SFT) an Electronic Design Automation (EDA) company, in the 3D parasitic extraction and analysis software market, announced new versions of its flagship products, F3D (Fast 3D) for fast 3D extraction and Read More → "Silicon Frontline Adds New Capabilities; Focuses on Semiconductor Power Device Reliability and Efficiency, Accurate 3D Parasitic Extraction, Point-to-Point Resistance"

Carbon Design Systems, Cadence Partner for IP Optimization

May 25, 2012

ACTON, MASS. –– May 24, 2012 –– Carbon Design Systems® Inc., a leading supplier of virtual prototype and secure model solutions, and Cadence Design Systems® announced today availability of a Carbon Performance Analysis Kit (CPAK) to accelerate the intellectual property (IP) benchmark process.

Triaxial acceleration sensor and gyroscope in a single package

May 25, 2012

More functionality in less space
Smallest Inertial Measurement Unit (IMU) available in the market
One-stop 6DoF sensor solution for mobile consumer electronics devices
Software tailored for IMU platform available

SANTA CLARA, CA/MEMS Business Forum—May 24, 2012—In a trend-setting move for the consumer electronics industry, Bosch Sensortec has integrated two triaxial MEMS sensors in a single package. This combination of an acceleration sensor and a gyroscope yields the BMI055, the smallest Inertial Measurement Unit in the market. The BMI055 is designed to meet the requirements of advanced consumer electronics … Read More → "Triaxial acceleration sensor and gyroscope in a single package"

Synopsys Hosts Special Events with Industry Leaders at DAC 2012

May 24, 2012

MOUNTAIN VIEW, Calif., May 24, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP used in the design, verification and manufacture of electronic components and systems, will host several special events at the Design Automation Conference, June 3 – 7 in San Francisco, Calif. The events will feature speakers from leading semiconductor companies, IP providers, foundries and Synopsys. These technical experts will describe the best practices, tools and methodologies they’re using to solve today’s design challenges, as well as discuss the emerging trends and advanced technology that will enable the next 25 years of semiconductor innovation.

X-FAB Offers Lowest Mask Count 700V CMOS Process in 0.35 Micrometer for Consumer-Based Power Conversion and Control Applications

May 24, 2012

Erfurt, Germany – May 24, 2012 – Supporting the global trend toward energy conservation, X-FAB Silicon Foundries today announced XU035 – a new CMOS-based process for ultra-high-voltage consumer applications such as AC LED lighting, chargers with no-load power consumption and other power conversion and control applications. The new XU035 process provides low specific On-resistance 700V power devices and the lowest mask count in the foundry industry, enabling the most cost-effective solutions for consumer applications. X-FAB will present a free webinar</ … Read More → "X-FAB Offers Lowest Mask Count 700V CMOS Process in 0.35 Micrometer for Consumer-Based Power Conversion and Control Applications"

Xilinx Kintex-7 FPGA Embedded Kit Accelerates Productivity and Programmable System Integration for FPGA-Based Soft Processor Systems

May 24, 2012

SAN JOSE, Calif., May 24, 2012 – Xilinx, Inc. (NASDAQ: XLNX) today announced the Kintex™-7 FPGA Embedded Kit, providing a ready-to-use development platform for system designers to quickly and easily implement programmable system integration for applications where the processor needs to control different data streams, such as in video and Ethernet switching, motor control, and medical imaging. As a Xilinx® 7 series FPGA, Kintex-7 devices offer the flexibility to support changing standards, parallel processing and customizable interfaces with integrated functions like high performance DSP, memory, analog and I/O interfaces, making it easier for designers to embed soft processors … Read More → "Xilinx Kintex-7 FPGA Embedded Kit Accelerates Productivity and Programmable System Integration for FPGA-Based Soft Processor Systems"

Leaders in Mobile Security and Virtualization to deliver High Assurance Platform for Secure Mobile Computing in the Workplace

May 24, 2012

Sterling, VA and Chicago – May 24, 2012 – Open Kernel Labs, the leader in mobile virtualization software for mobile and connected devices, and Fixmo, the mobile risk management (MRM) company, today unveiled a strategic partnership to deliver the first end-to-end Defense-Grade Mobile Platform for organizations that demand the highest levels of integrity assurance, data security and policy compliance. Built on the OK Labs High Assurance Framework and Fixmo MRM platform, the jointly developed solution … Read More → "Leaders in Mobile Security and Virtualization to deliver High Assurance Platform for Secure Mobile Computing in the Workplace"

Tanner EDA Announces Tanner Analog FastSPICE

May 24, 2012

MONROVIA, California – May 24, 2012 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs) and MEMS devices, announces the availability of Tanner Analog FastSPICE (T-AFS), offering the Berkeley Design Automation Analog FastSPICE™ Platform as an add-on to Tanner EDA’s full-flow HiPer Silicon design suite. HiPer Silicon gives designers a complete analog design flow from schematic capture and waveform probing to physical layout and physical verification.

Analog, mixed-signal, and RF designers have increasing requirements for circuit simulation performance and … Read More → "Tanner EDA Announces Tanner Analog FastSPICE"

Synopsys Honors Accellera Systems Initiative with 2012 Tenzing Norgay Interoperability Achievement Award

May 24, 2012

MOUNTAIN VIEW, Calif., May 24, 2012 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced that Accellera Systems Initiative will receive Synopsys’ twelfth annual Tenzing Norgay Interoperability Achievement Award for advancing industry standards that enable interoperable system design flows.

The Accellera Systems Initiative was formed in December 2011 through the merger of Open SystemC Initiative (OSCI) and Accellera. Since 2000, the two organizations have developed standards that are widely used in the semiconductor industry; Accellera developed SystemVerilog, Unified Power Format (UPF) and IP-XACT; and OSCI developed SystemC and TLM-2.0. These standards … Read More → "Synopsys Honors Accellera Systems Initiative with 2012 Tenzing Norgay Interoperability Achievement Award"