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Tanner EDA Announces Tanner Analog FastSPICE

MONROVIA, California – May 24, 2012 – Tanner EDA, the catalyst for innovation for the design, layout and verification of analog and mixed-signal integrated circuits (ICs) and MEMS devices, announces the availability of Tanner Analog FastSPICE (T-AFS), offering the Berkeley Design Automation Analog FastSPICE™ Platform as an add-on to Tanner EDA’s full-flow HiPer Silicon design suite. HiPer Silicon gives designers a complete analog design flow from schematic capture and waveform probing to physical layout and physical verification.

Analog, mixed-signal, and RF designers have increasing requirements for circuit simulation performance and capacity with nanometer SPICE accuracy. The Berkeley Design Automation Analog FastSPICE (AFS) Platformis the world’s fastest nanometer circuit verification platform for analog, RF, mixed-signal, and custom digital circuits. With Tanner Analog FastSPICE, Tanner EDA customers have access to foundry-certified nanometer SPICE accuracy 5x-10x faster than any other simulator on a single core and an additional 2x-4x performance uptick with multithreading. Tanner EDA users will be able to verify the most challenging analog/ RF circuits even as they have access to the latest foundry nanometer CMOS technology. For circuit characterization, the T-AFS Platform includes the industry’s only comprehensive silicon-accurate device noise analysis and delivers near-linear performance scaling with the number of cores.

“The availability of Analog FastSPICE as an add-on to Tanner EDA’s analog and mixed-signal design tools brings great benefit to Tanner EDA’s customers,” said Ravi Subramanian, president and CEO of Berkeley Design Automation. “Analog/ RF designers can realize the benefits of Tanner EDA’s full-flow analog design suite that is now bolstered by Analog FastSPICE, allowing verification of very complex analog/ RF circuits with nanometer SPICE-accurate results.”

“Tanner EDA is dedicated to providing our analog, custom, and mixed-signal design customers with the best possible price for performance and productivity,” said Greg Lebsack, Tanner EDA’s president. “Offering Analog FastSPICE as a complement to our T-SPICE simulator enables our customers to tackle complex analog/ RF circuit verification and delivers on our continued commitment to offer the widest possible choice of leading-edge technology.”

Availability and Pricing

The T-AFS add-ons can be purchased and added to existing HiPer tools. Each T-AFS token license will enable 50K element capacity, with users having the option to linearly scale tokens for larger designs. Multi-core is also supported and is scaled linearly (add one T-AFS token for every core). List pricing for token licenses: $30K per token/ year, 5 packs of tokens are $100K/ year, and 10 packs of tokens are $150K/ year. Transient noise tokens also can be added to any T-AFS package at a cost of $25K / token/ year.

Tanner EDA will be demonstrating the integrated flow in Booth # 1126 at DAC 2012 in the Moscone Center in San Francisco, California, from June 4th to 6th.

About Berkeley Design Automation

Berkeley Design Automation, Inc. is the recognized leader in nanometer circuit verification. The company combines the world’s fastest nanometer circuit verification platform, Analog FastSPICE, with exceptional application expertise to uniquely address nanometer circuit design challenges. More than 100 companies rely on Berkeley Design Automation to verify their nanometer-scale circuits. Berkeley Design Automation has received numerous industry awards and is widely recognized for its technology leadership and contributions to the electronics industry. The company is privately held and backed by Woodside Fund, Bessemer Venture Partners, Panasonic Corp., NTT Corp., IT-Farm, and MUFJ Capital.

About Tanner EDA

Tanner EDA provides a complete line of software solutions that drive innovation for the design, layout and verification of analog and mixed-signal (A/MS) integrated circuits (ICs) and MEMS. Customers are creating breakthrough applications in areas such as power management, displays and imaging, automotive, consumer electronics, life sciences, and RF devices. A low learning curve, high interoperability, and a powerful user interface improve design team productivity and enable a low total cost of ownership (TCO). Capability and performance are matched by low support requirements and high support capability as well as an ecosystem of partners that bring advanced capabilities to A/MS designs.

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