News – Page 19 – EEJournal

Rohde & Schwarz reshapes mid-range market with new 44 GHz FPL spectrum analyzer and 40 MHz real-time analysis

February 5, 2026

Rohde & Schwarz expands its portfolio of mid-range instruments with the launch of the R&S FPL1044 spectrum analyzer and a new 40 MHz real-time spectrum analysis (RTSA) option for the entire FPL family. The R&S FPL1044 is an industry first, delivering high-frequency performance up to 44 GHz at a price point previously unattainable in the market. The universal RTSA option empowers FPL users with powerful real-time analysis capabilities.

The new R&S FPL1044 from Rohde & Schwarz offers a frequency range of 10 Hz to 44 GHz. It is the first and only spectrum analyzer in … Read More → "Rohde & Schwarz reshapes mid-range market with new 44 GHz FPL spectrum analyzer and 40 MHz real-time analysis"

Curtiss-Wright and DDC-I introduce high-performance COTS solution for safety-critical avionics systems

Joint offering pairs Curtiss-Wright’s V3-1222 with DDC-I’s Deos and will accelerate safety certification and deployment of safety-critical computing applications

February 5, 2026

ASHBURN, Va. – Feb. 2, 2026 – Curtiss-Wright announced today a collaboration with embedded software solutions developer DDC-I to host the Deos real-time operating system (RTOS) on the Curtiss-Wright V3-1222, a safety-certifiable 3U VPX Intel Core i7 Avionics Processor Card, which will enable integrators to achieve and accelerate system safety certification up to Design Assurance Level (DAL) A for safety-critical airborne processing.

Curtiss-Wright’s V3-1222 avionics processor board combines the powerful 13 … Read More → "Curtiss-Wright and DDC-I introduce high-performance COTS solution for safety-critical avionics systems"

TDK launches stackable µPOL modules providing up to 200 A combined for vertical power delivery

February 5, 2026

µPOL module F1525 delivers 25 A each, up to 200 A when stacking multiple units, for a compact and low-height form factor in vertical power delivery designs
Ultra-fast transient response, ultra-low DC ripple, and low spectral noise
Integrates MOSFETs, inductors, and control in a thermally enhanced 3D structure with analog and digital interfaces

February 5, 2026

TDK Corporation (TSE: 6762) expanded its µPOL family of non-isolated DC-DC power modules by adding the FS1525. This just 3.82 mm high point-of-load (PoL) converter delivers up to 25 A … Read More → "TDK launches stackable µPOL modules providing up to 200 A combined for vertical power delivery"

Taoglas Unveils ‘World First’ AI-Driven Antenna Product Recommendation Engine

February 5, 2026

San Diego, CA, February 5, 2026 — Taoglas®, a trusted provider of advanced RF and antenna solutions, today announced the launch of the world’s first AI-driven Antenna Product Recommendation Engine, a groundbreaking platform set to revolutionize how engineers and organizations select antennas and RF components.

Now available worldwide, the tool empowers both experienced seasoned RF engineers and non-technical decision-makers with automated, intelligent guidance that accelerates informed choices, regardless of prior RF experience.

Early-stage antenna decisions can disproportionately impact system performance, cost, and time-to-market. Yet engineers often rely on datasheets, parametric searches, or manual cross comparison, a process … Read More → "Taoglas Unveils ‘World First’ AI-Driven Antenna Product Recommendation Engine"

Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity

The collaboration aims to evaluate and promote the adoption of advanced in-vehicle network technologies leveraging each company’s strengths

February 5, 2026

CHANDLER, Ariz., February 5, 2026 — Microchip Technology (Nasdaq: MCHP) today announced a collaboration with Hyundai Motor Group (HMG) to explore the adoption of advanced in-vehicle network solutions based on 10BASE-T1S Single Pair Ethernet (SPE) technology. This cooperation effort is intended to support the development of more efficient, reliable and scalable vehicle architectures that meet the evolving demands of future mobility.

The rapid advancement of Advanced Driver-Assistance Systems (ADAS) and connected vehicle features is driving the need for robust, high-performance in-vehicle networks. SPE serves as a foundational technology for modern automotive architectures, … Read More → "Microchip Technology and Hyundai Motor Group Collaborate to Explore 10BASE-T1S Single Pair Ethernet for Future Automotive Connectivity"

ASRock Industrial Launches IMB-X1904, a Flagship HPC Motherboard Powered by Intel® Xeon® 600 Processors

February 4, 2026

Taipei, Taiwan (February 3, 2026) – As AI workloads, industrial digitalization, and edge data centers continue to scale, industrial manufacturers are facing a fundamental shift in how high-performance computing platforms must be designed. Today’s systems must not only deliver extreme performance, but also ensure continuous uptime, remote operability, and long-term deployment stability in demanding production environment. In response to these demands, ASRock Industrial proudly announced the launch of IMB-X1904, a high-performance EATX motherboard powered by Intel® Xeon® 600 processors and the W890 chipset, designed to serve as a new backbone for AI computing, advanced industrial automation, and compute-intensive applications. Designed for manufacturers … Read More → "ASRock Industrial Launches IMB-X1904, a Flagship HPC Motherboard Powered by Intel® Xeon® 600 Processors"

Agentuity Launches V1 of Cloud Platform Built for AI Agents

Full-stack platform gives developers and AI agents the infrastructure to build, deploy, and scale agentic software, with built-in services, sandboxes, and deployment anywhere.

February 4, 2026

AUSTIN, Texas—February 3, 2026—Agentuity today announced the launch of V1 of its cloud platform built for AI agents. Now in general availability, Agentuity is a full-stack platform for developers of AI agents. The platform enables the streamlined creation of fully functional and easy-to-manage agents through purpose-built primitives for agentic software. These include built-in storage services, secure code execution sandboxes, production evaluations, and the ability to deploy anywhere from public cloud to on-premises infrastructure.

Agentuity’s debut is occurring at a time when the software industry and the corporate world in general are … Read More → "Agentuity Launches V1 of Cloud Platform Built for AI Agents"

Zapata Secures Foundational Patent for Interoperable Quantum Software Across Key Global Markets

New grants in four additional jurisdictions complete global patent protection for Quantum Intermediate Representation (QIR), a core enabler of hardware-agnostic quantum applications

February 4, 2026

Boston, MA – February 3, 2026 – Zapata Quantum (OTC: ZPTA) (“Zapata”, “Zapata Quantum” or the “Company”), a pioneer in quantum computing application and algorithm development, today announced that its patent for Quantum Intermediate Representation (QIR) has been granted in Canada, Europe, Israel and Australia, in addition to its earlier U.S. grant.

QIR is a hardware-agnostic translation layer that enables quantum applications to interoperate across distinct hardware platforms and programming frameworks. With global patent protection now in place, Zapata has secured exclusive rights to this capability, allowing developers to translate a program once into a universal representation, then execute it … Read More → "Zapata Secures Foundational Patent for Interoperable Quantum Software Across Key Global Markets"

Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems

Company announces breakthrough in memory efficiency and silicon readiness for next-gen AI data centers; 3nm Chip Tape-Out

February 4, 2026

Barcelona, Spain—February 3rd, 2026—Semidynamics today announced its expansion into full-stack AI infrastructure, unveiling a strategic roadmap to deliver high-performance inference silicon and vertically integrated systems. Building on its proprietary architecture, the company is developing chips, boards, and rack-level systems designed for the most demanding AI workloads in next-generation data centers

Breaking the Memory Wall and 3nm Milestone

Semidynamics’ entry into the silicon market is built on years of architectural innovation. The company’s silicon architecture features a new memory subsystem designed to overcome bandwidth bottlenecks and mitigate supply constraints tied to high-end … Read More → "Semidynamics Unveils 3nm AI Inference Silicon and Full-Stack Systems"

Samtec Showcases 224 and 448 Gbps High-Performance Interconnect Solutions at DesignCon 2026

February 3, 2026

New Albany, IN: Samtec, Inc., the service leader in the connector industry, announces it will showcase high-performance interconnect solutions and enabling technologies that support data rates up to 448 Gbps and signals up to 130 GHz in booth #939 at DesignCon 2026 in Santa Clara, CA on February 25-26. Attendees can register with the Samtec VIP code: INVITE373903 to receive a free Expo Pass or 15% discount for conference passes.

Visit Booth 939 Wednesday and Thursday

Samtec will be celebrating 50 years of Sudden Service^® in Booth #939. In-booth engineering experts can help attendees find the optimal … Read More → "Samtec Showcases 224 and 448 Gbps High-Performance Interconnect Solutions at DesignCon 2026"

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