News – Page 18 – EEJournal

TeraSignal Delivers Industry’s First Intelligent Redriver for 200G+ Copper Interconnects

Breakthrough CMOS device built on TeraSignal’s TSAFE™ analog front-end architecture integrates CMIS-based link training with Advanced Equalization to dramatically improve link margin, reach, and reliability in AI Scale-Up Networks

March 18, 2026

Los Angeles, Calif., March 17, 2026 – OFC 2026 – TeraSignal, a leader in intelligent interconnect technology today announced the TeraSignal TS5802, the world’s most advanced analog equalizer, implemented in advanced CMOS technology and engineered to extend reach and increase link margin for 200G and higher-speed interconnects. The TS5802 is built on TeraSignal’s proprietary TSAFE™ (TeraSignal Analog Front-End) technology, which tightly integrates the critical high-speed … Read More → "TeraSignal Delivers Industry’s First Intelligent Redriver for 200G+ Copper Interconnects"

TDK introduces rugged 60 and 80 Amp fast response ORing modules with efficiencies up to 99.5 %

March 17, 2026

TDK Corporation (TSE:6762) introduces the TDK-Lambda i1R ORing FET modules, capable of operating at 60 or 80 A with a maximum input voltage of 60 Vdc. These ORing modules are designed to replace traditional diodes in applications that require ORing functionality for power supply redundancy or parallel operation. The i1R series uses MOSFET-based circuitry to provide a superior level of performance while reducing reverse current transients.

Applications for the i1R modules include communications, test and measurement equipment, plus harsh Read More → "TDK introduces rugged 60 and 80 Amp fast response ORing modules with efficiencies up to 99.5 %"

Keysight Launches AI Inference Emulation Platform to Validate and Optimize AI Infrastructure

New platform validates and optimizes AI inference infrastructure at scale using real-world workload emulation; live demonstration at NVIDIA GTC in the NVIDIA DSX Air digital twin environment

March 17, 2026

Keysight Technologies, Inc. (NYSE: KEYS) today introduced Keysight AI Inference Builder (KAI Inference Builder), an emulation and analytics platform designed to validate inference-optimized AI infrastructure at scale. Keysight will demonstrate the solution at NVIDIA GTC, showcasing operation within Read More → "Keysight Launches AI Inference Emulation Platform to Validate and Optimize AI Infrastructure"

Samtec AcceleRate® Slim Cable Assemblies Available with New Signaling Options

AcceleRate Slim Cable Assemblies support high-density computing, FPGA prototyping and emulation, and MIPI protocols with new signaling options.

March 17, 2026

Samtec, Inc., the service leader in the connector industry, announces production quantity availability of single-ended and mixed single-ended / differential pair signaling options using AcceleRate^® Slim Cable Assemblies. … Read More → "Samtec AcceleRate® Slim Cable Assemblies Available with New Signaling Options"

Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows

March 17, 2026

Fuse EDA AI Agent autonomously orchestrates multi-agent workflows across Siemens’ complete electronic design automation (EDA) portfolio, from design conception through manufacturing sign-off, increasing engineering efficiency and design quality
Builds on top of the Fuse EDA AI system, which provides an advanced retrieval-augmented generation (RAG) framework, multimodal EDA data support, secure agentic orchestration with Model Context Protocol (MCP) and Agent Skills support, along with an open framework for third-party integration
Supports NVIDIA Agent Toolkit, Nemotron models and NVIDIA AI infrastructure for enhanced tool calling and reasoning capabilities

Siemens today announced the Fuse™ … Read More → "Siemens launches Fuse EDA AI Agent for automation across semiconductor, 3D IC and PCB system workflows"

NXP Delivers New Innovations for Advanced Physical AI with NVIDIA

March 16, 2026

Secure, reliable real-time data processing and transport solutions for next-generation physical AI applications, developed in collaboration with NVIDIA
NVIDIA humanoid robotics solutions integrated into NXP’s safe, secure edge portfolio cut development costs and speed time to market
First in a series of NXP’s foundational robotics solutions designed to accelerate physical AI development and deployment

SAN JOSE, California, March 16, 2026 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announcedRead More → "NXP Delivers New Innovations for Advanced Physical AI with NVIDIA"

STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module

March 16, 2026

Multimodal module combining 2D imaging, 3D depth sensing, and human-like motion perception
NVIDIA Holoscan Sensor Bridge ensuring multi-gigabit plug and play connectivity with Jetson platforms
Fully supported by NVIDIA Isaac open robot development platform

Geneva, March 16, 2026 – STMicroelectronics and Leopard Imaging^® have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and motion sensing with the NVIDIA Holoscan Sensor Bridge technology, the module integrates natively with NVIDIA Jetson and NVIDIA Isaac open robot development platform, simplifying and … Read More → "STMicroelectronics and Leopard Imaging accelerate robotics vision with NVIDIA Jetson-ready multi-sensor module"

Industry-Lowest RDS(on) 200V MOSFETs in Multiple Standard Power Packages Available from iDEAL Semiconductor

New SuperQ™ 200V MOSFETs deliver industry-lowest RDS(on) across multiple industry-standard power packages.

March 12, 2026

LEHIGH VALLEY, PA, March 2026 – iDEAL Semiconductor announces the expansion of its SuperQ™ 200V MOSFET portfolio, delivering industry-leading … Read More →

Salience Labs Launches Industry’s Highest Performing 32-Port All-Optical Silicon Photonic Switch to Transform the Networking Layer of AI Datacenter Infrastructure Share

Industry Collaborations and Product Roadmap Enhance Reliability and Future-Proof Technology to Meet Evolving Needs of Next Generation AI Datacenters

March 12, 2026

OXFORD, England-March 10, 2026-Read More → "Salience Labs Launches Industry’s Highest Performing 32-Port All-Optical Silicon Photonic Switch to Transform the Networking Layer of AI Datacenter Infrastructure Share"

HighTec Drives Automotive Software Development on Renesas RH850/U2x MCUs with LLVM-Based Rust and C/C++ Toolchains

March 12, 2026

Saarbruecken, Germany, March 9, 2026 – HighTec EDV-Systeme, a leading provider of automotive compiler solutions, closely cooperates with Renesas Electronics Corporation to further broaden its multi-architecture support by making the safety-qualified LLVM-based HighTec Rust and C/C++ compiler toolchain available for Renesas RH850/U2x microcontrollers. Embedded developers working on this high-performance 32-bit Automotive RH850 family from Renesas can now integrate memory-safe Rust with their existing C/C++ codebase. This hybrid approach enables fast innovation cycles in zone/domain controllers, powertrain, chassis or other safety-critical applications, especially in the context of software-defined vehicles ( … Read More →