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Microchip Expands Security Services in the Trust Platform to Help Manufacturers Meet Cybersecurity Regulations

CHANDLER, Ariz., March 10, 2026 — As cybersecurity regulations tighten worldwide, product manufacturers must embed security from the outset to meet compliance. To help developers address emerging requirements such as the EU Cyber Resilience Act (CRA), industrial and automotive cybersecurity standards, Microchip Technology (Nasdaq: MCHP) has expanded its Trust Platform with the TA101 TrustFLEX secure authentication integrated circuit (IC) and the … Read More → "Microchip Expands Security Services in the Trust Platform to Help Manufacturers Meet Cybersecurity Regulations"

Morse Micro Launches Morse Micro Design Partner Program at Embedded World 2026

Embedded World 2026, Nuremberg – March 9, 2026 – Morse Micro, the world’s leading Wi-Fi HaLow silicon provider, today launched the Morse Micro Design Partner Program, a global developer and design house initiative built to accelerate the commercialization of … Read More → "Morse Micro Launches Morse Micro Design Partner Program at Embedded World 2026"

Synaptics Introduces SYN765x, an Industry-Leading AI-Native Wi-Fi® 7 Solution for Integrated IoT Edge Applications

SAN JOSE, Calif., March 10, 2026 (GLOBE NEWSWIRE) — Synaptics® Incorporated (Nasdaq: SYNA) today announced the SYN765x, an AI-native wireless solution that redefines Edge intelligence. As an industry-leading single-chip device combining AI-optimized compute with integrated Wi-Fi®</ … Read More → "Synaptics Introduces SYN765x, an Industry-Leading AI-Native Wi-Fi® 7 Solution for Integrated IoT Edge Applications"

Nanopower announces volume production of Award Winning nPZero Power-Saving IC for battery-powered and energy harvested IoT

Nuremberg, Germany – 10th March 2026 — Nanopower Semiconductor, a European fabless semiconductor manufacturer, announces that their award winning nPZero power-saving integrated circuit (PSIC) is now in volume production enabling, original equipment manufacturers (OEMs) to move from evaluation to high-volume deployment in power-constrained Internet of Things (IoT) products. Nanopower’s nPZero is a power-saving integrated circuit (PSIC) designed to reduce the energy consumption of battery-powered applications by up to 90%. Samples and development kits are immediately available.

At Embedded World in Nuremberg, visitors can meet Nanopower Semiconductor at Hall 4 / Booth 4-460 to see nPZero in action and discuss design-in options and … Read More → "Nanopower announces volume production of Award Winning nPZero Power-Saving IC for battery-powered and energy harvested IoT"

STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand

  • PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in 2028
  • ST unveils PIC100 through-silicon via (TSV) upcoming technology roadmap
 
Geneva, Switzerland — March 9, 2026 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters. The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, … Read More → "STMicroelectronics enters high-volume production of its industry-leading silicon photonics platform to support AI infrastructure demand"

TASKING Accelerates the Development and Verification of Safety- and Security-Critical AUTOSAR Compliant Systems

MUNICH – March 9, 2026 – TASKING, a global leader in high-performance embedded software development tools, today announced expansion of the integrated TASKING toolchain to optimize AUTOSAR workflows for multicore automotive systems that must adhere to functional safety and security mandates. Example customer applications include software-defined vehicles, ADAS/ADS (automated braking, automated steering, infotainment, telematics, adaptive cruise control), zone controllers, central control units, battery management, chassis, and powertrain systems.

Enhancements to the toolchain include more efficient compilation, certified libraries, extensive debugging and profiling capabilities, and accurate, in-depth system analysis and verification. Together, these improvements create a best-in-class solution to build, … Read More → "TASKING Accelerates the Development and Verification of Safety- and Security-Critical AUTOSAR Compliant Systems"

NCDIT Cybersecurity Interns Help Stop Potential Threats to State Systems

RALEIGH – Two cybersecurity interns with the N.C. Department of Information Technology (NCDIT) are already helping protect state systems and the personal data of North Carolinians.

While working in NCDIT’s Enterprise Security and Risk Management Office (ESRMO), interns Jennifer Medina, a Wake Technical Community College graduate, and Jacob Wright, a student at Fayetteville Technical Community College, recently helped identify and mitigate potential cyber threats.

Medina flagged a suspicious email, initiated a systemwide purge, and blocked the associated malicious URL, preventing users from accessing it even if they had previously clicked the link.

Read More → "NCDIT Cybersecurity Interns Help Stop Potential Threats to State Systems"

FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders

GRENOBLE, France – March 9, 2026 at 4:30pm CET – The FAMES Pilot Line today launched its second Open-Access Call for European semiconductor stakeholders to join the groundbreaking EU initiative focused on new chip architectures to boost European tech sovereignty.  An online launch … Read More → "FAMES Announces 2026 Open-Access Call for Chip Industry Stakeholders"

MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform

  • Inova Semiconductors collaborate with MIPS to build reference Physical AI platform for secure architectures in Robotics applications
  • New platform will be a hardware-based custom SoC solution enacting sense-think-act-communicate signal chains to reduce size, weight and power constraints
  • Flexible and scalable architecture reduces software requirement for data communication, driving rapid development cycles and accelerating time-to-market for Robotics platforms

SAN JOSE, Calif., March 9th, 2026 – MIPS, a GlobalFoundries company, announced today a … Read More → "MIPS and INOVA Collaborate to put Physical AI into the palm of Robotic hands with new Reference Platform"

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