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Industry’s First Secure Clock IP Core

Austin TX, June 3, 2013 – Design Automation Conference – Analog Bits (www.analogbits.com) the leading supplier of mixed-signal IP (Intellectual Property), today disclosed a new family of ultra-secure clocking macros. These low-power IP cores are designed to increase a chip’s resistance to hacking and malicious attack without decreasing battery life or increasing heat.

“We are always looking for ways to better … Read More → "Industry’s First Secure Clock IP Core"

Synopsys Delivers Comprehensive Design Implementation Solution for Samsung’s Leading-Edge 14-Nanometer FinFET Process

MOUNTAIN VIEW, Calif., June 3, 2013 /PRNewswire/ —

Highlights:                           

  • Close collaboration on 3-D parasitic extraction and device simulation technologies
  • Industry-leading place and route solution for fast design closure at 14-nm geometry
  • Golden reference for 14-nm process development kit for IP, memory and library

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of a comprehensive design implementation solution for the … Read More → "Synopsys Delivers Comprehensive Design Implementation Solution for Samsung’s Leading-Edge 14-Nanometer FinFET Process"

mimoOn and Tektelic Introduce LTE Small Cell Reference Design

Duisburg, Germany, and Calgary, Canada, 3 June 2013 — mimoOn GmbH, a leading LTE software vendor for Small Cells and terminals, and TEKTELIC Communications, designer of leading edge 3G and 4G Small Cell Base Stations, Wireless Backhaul Systems, high power Radios and Power Amplifiers, will be demonstrating a complete LTE Small Cell Base Station at the Small Cell World Summit in London, UK from 4-6 June.

The TEKTELIC 2220 LTE micro eNodeB is a … Read More → "mimoOn and Tektelic Introduce LTE Small Cell Reference Design"

Cavium Announces New Low Power Dual and Quad Core OCTEON® III SoC Processors

  • New Low Power 28nm OCTEON® III CN70XX and CN71XX Families Provide
  • Unprecedented Compute Performance at Compelling Power and Cost Metrics
  • Extensive Integrated Hardware Acceleration including Hardware Virtualization, Packet
  • Processing, QoS, DPI and Security
  • Broad Range of Software, Hardware and ODM Partner Support

SAN JOSE, Calif. and TAIPEI, Taiwan, June 3, 2013 – Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking, communications and the digital home, today announced two new families of 28nm dual and quad core OCTEON® </ … Read More → "Cavium Announces New Low Power Dual and Quad Core OCTEON® III SoC Processors"

Forte Design Systems, CircuitSutra Partner on Design Services, IP Co-Development

SAN JOSE, CALIF., and NOIDA, INDIA –– May 31, 2013 –– Forte Design Systems™ (www.ForteDS.com), the #1 provider of software to enable design at a higher level of abstraction, and CircuitSutra(www.circuitsutra.com) announced today they will partner to provide design services throughout India … Read More → "Forte Design Systems, CircuitSutra Partner on Design Services, IP Co-Development"

TI delivers the industry’s highest voltage rating in next-generation automotive LED drivers for dashboard applications

DALLAS (May 28, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced the next-generation AEC-Q100 qualified automotive LED drivers, feature-packed with the industry’s highest voltage rating, thermal shutdown protection and optimized electromagnetic compatibility (EMC) performance. In harsh automotive environments, the electronics must endure high temperatures, high voltage transient and electromagnetic interference. It is crucial for the devices to survive such conditions while reducing electromagnetic emissions. The TLC6C598-Q1 and TLC6C5912-Q1 are monolithic, medium-voltage, low-current 8-bit/12-bit shift registers designed for use in systems that require relatively moderate load power, such as LEDs. The TLC6C598-Q1 and … Read More → "TI delivers the industry’s highest voltage rating in next-generation automotive LED drivers for dashboard applications"

GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology

Milpitas, Calif. — May 30, 2013 — At next week’s 50th Design Automation Conference (DAC) in Austin, Texas,GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC product development with its most advanced manufacturing processes. The sign-off ready flows, jointly developed with the leading EDA providers, offer robust support for implementing designs using sophisticated multi-die packaging techniques, leveraging through-silicon vias (TSVs) in 2.5D silicon interposers and new bonding approaches.

Multi-vendor support is available, with full implementation flows from Read More → "GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC technology"

Mentor Graphics and GLOBALFOUNDRIES Deliver 20nm Design Kits for Advanced Design Enablement

WILSONVILLE, Ore., May 30, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced it has collaborated with GLOBALFOUNDRIES to deliver 20nm design kits for the Olympus-SoC™ netlist-to-GDS platform. The design kit enables mutual customers to achieve the best performance, power and area with faster design closure times.

“Double patterning and timing closure at advanced nodes require a comprehensive suite of design tools and methodologies,” said Andy Brotman, vice president of design infrastructure at GLOBALFOUNDRIES. “Mentor solutions, including Olympus-SoC, help ensure that designs using our 20nm technologies perform and yield well by efficiently utilizing our DRC+ technology to … Read More → "Mentor Graphics and GLOBALFOUNDRIES Deliver 20nm Design Kits for Advanced Design Enablement"

Leti to Present Latest R&D Results in MEMS At Transducers’ 2013 in Barcelona

GRENOBLE, FRANCE – May 29, 2013 – CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

Workshop: 6:30-8 p.m., June 18, Rooms 118-119, CCIB Barcelona

The session features three brief presentations from 6:30-7:10 p.m.:

PMC Adopts Cadence Physical Verification System as Signoff Technology for Large Complex SoC

SAN JOSE, CA–(Marketwired – May 30, 2013) –

Cadence Design Systems, Inc. (NASDAQ: CDNS)

HIGHLIGHTSCadence Design Systems, Inc. (NASDAQ: CDNS)

  • PMC is producing working silicon on 65- and 40-nanometer designs, and is currently deploying the product for its 28-nanometer designs.
  • Technology chosen for turnaround time and ready foundry support
  • Physical Verification System signoff decks certified by major foundries

Cadence Design … Read More → "PMC Adopts Cadence Physical Verification System as Signoff Technology for Large Complex SoC"

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