News – Page 1830 – EEJournal

Robust CompactPCI PlusIO SBC with 3rd Generation Intel Core i7 Processor Available from MEN Micro

June 28, 2013

AMBLER, Pa. June 2013 – MEN Micro Inc., a world-renowned provider of embedded computing and I/O solutions for mission-critical industrial, mobile and harsh environment applications, has released the versatile, high-performance F22P, the latest CompactPCI PlusIO SBC (single board computer) that uses Intel’s 3^rd generation Core i7 processor.

Offering processing speeds of up to 3.3 GHz using Intel’s Turbo Boost technology, the low power … Read More → "Robust CompactPCI PlusIO SBC with 3rd Generation Intel Core i7 Processor Available from MEN Micro"

LDRA Expands Certification Management Market into Russia’s Safety-Critical Industries

June 28, 2013

Wirral, UK. June 28, 2013 — LDRA, the leading provider of automated software verification, source code analysis and test tools, today announced that it has chosen Softline to distribute theLDRA tool suite and LDRA’ … Read More → "LDRA Expands Certification Management Market into Russia’s Safety-Critical Industries"

DC-DC Converter from Diodes Incorporated Saves Space in LED Lighting Applications

June 28, 2013

Plano, Texas – June 27th, 2013 – Diodes Incorporated has introduced a miniature DC-DC converter supporting boost, buck and voltage-inverting circuit topologies for LED lighting and general-purpose power management applications. The AL8811 is available in the 3.0mm x 4.9mm x 1.1mm MSOP-8L package and requires minimal external components enabling significant reductions in both circuit footprint and BOM cost.

While the AL8811 is advantageous for many low-voltage LED lighting applications, dimmable MR16 lamps will particularly benefit from the new device. For example, using the AL8811 in boost mode in conjunction with an AL8807A buck LED driver … Read More → "DC-DC Converter from Diodes Incorporated Saves Space in LED Lighting Applications"

Ultra robust Dual band Wi-Fi streaming now possible with Frontier Silicon’s Venice 6.5 module solution

June 28, 2013

Frontier Silicon is proud to announce Venice 6.5 Dual Band, the first connected audio module with support for 2.4 and 5GHz frequency bands.

The proliferation of wireless-connected devices at home, from smartphones and tablets to games consoles and appliances, causes saturation in the 2.4GHz band, which is used by traditional Wi-Fi and Bluetooth products. In wireless audio, this affects the reliability of the connection, causes audio dropouts and other negative effects that degrade the listening experience.

Venice 6.5, the latest wireless audio module from Frontier Silicon, addresses these issues by incorporating a state-of-the-art Wi-Fi transceiver supporting both the … Read More → "Ultra robust Dual band Wi-Fi streaming now possible with Frontier Silicon’s Venice 6.5 module solution"

element14 gets into the fabric of technology with its latest challenge

June 27, 2013

27 June, 2013 – London, UK – As one of the hottest topics in global technology and with the first products starting to appear on the market, element14 is challenging engineers and developers to design and develop their own piece of wearable technology. The global competition will focus entirely on technology integrated within clothing and wearable accessories, and aims to encourage a deeper level of integration than those demonstrated by first-generation wearables such as the Pebble watch and Google Glass.

Market reports suggest we’ll spend between $6bn and $50bn* … Read More → "element14 gets into the fabric of technology with its latest challenge"

TI introduces most flexible, fully-integrated IO-LINK PHY with fault protection

June 27, 2013

DALLAS (June 27, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a new family of fully-integrated IO-LINK physical (PHY) layer devices, replacing discrete implementations and providing a great level of flexibility. The SN65HVD101 and SN65HVD102 provide higher output current and higher operating temperatures compared to the competition. This enables their use in point-to-point communication applications such as pressure, level, temperature or flow IO-LINK sensors and IO-LINK actuator drives and valves in harsh industrial applications. For more information and to order samples, visit Read More → "TI introduces most flexible, fully-integrated IO-LINK PHY with fault protection"

Imagination’s Ensigma Series4 universal communications IP cores shipping now to multiple licensees

June 27, 2013

London, UK – 27 June 2013 – Imagination Technologies (IMG.L), a leading multimedia, processor, communications and cloud technologies company, announces that its Ensigma Series4 radio processor unit (RPU) IP core family is now available for licensing, and has already been supplied to lead partners.

The new Series4 family of RPUs introduces a highly efficient and high-bandwidth architecture, enabling support for the most demanding communications standards such as 802.11ac 2×2 MIMO and DVB-T2 in an optimal and low-power implementation. By adding new highly-specialised data processors combined with a significantly upgraded internal data fabric, … Read More → "Imagination’s Ensigma Series4 universal communications IP cores shipping now to multiple licensees"

STMicroelectronics Launches Virtual Laboratory for Audio Innovators

June 27, 2013

Geneva, June 27, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is putting sophisticated audio design and evaluation capabilities within reach of all engineers using its SoundTerminal™ audio chips and digital MEMS microphones, by publishing a complete virtual audio laboratory that can be downloaded free of charge at www.st.com/apworkbench.

SEMATECH Advances Device Processing Techniques to Enable III-V Manufacturing

June 27, 2013

ALBANY, N.Y. – June 27, 2013 – SEMATECH announced today that researchers have made significant advances in post-epitaxial growth backside clean processing that will prepare III-V technology for high-volume manufacturing. The research leading to these accomplishments was conducted at SEMATECH’s facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, NY.

Following a two-year effort to improve process parameters and validating III-V on 200 mm Si VLSI process flows, technologists have identified the key mechanisms to enable a robust backside cleaning process and made significant progress in reducing the likelihood of process cross-contamination that could impact a high-volume … Read More → "SEMATECH Advances Device Processing Techniques to Enable III-V Manufacturing"

10A µModule Step-Down Regulator Delivers Full Current with 86% Efficiency at up to 83°C Ambient

June 27, 2013

MILPITAS, CA – June 27, 2013 – Linear Technology Corporation announces the LTM4649, a 10A step-down µModule® regulator with high operating efficiency and low temperature rise in a 9mm x 15mm x 4.92mm BGA (ball grid array) package. The LTM4649 requires no heat sink, airflow or output current derating at full power from 0°C to 83°C … Read More → "10A µModule Step-Down Regulator Delivers Full Current with 86% Efficiency at up to 83°C Ambient"