industry news
Subscribe Now

TI introduces most flexible, fully-integrated IO-LINK PHY with fault protection

DALLAS (June 27, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a new family of fully-integrated IO-LINK physical (PHY) layer devices, replacing discrete implementations and providing a great level of flexibility. The SN65HVD101 and SN65HVD102 provide higher output current and higher operating temperatures compared to the competition. This enables their use in point-to-point communication applications such as pressure, level, temperature or flow IO-LINK sensors and IO-LINK actuator drives and valves in harsh industrial applications. For more information and to order samples, visit www.ti.com/sn65hvd101-pr.

 Key features and benefits of the SN65HVD101 and SN65HVD102          

  • Integration slashes board space: The new IO-LINK PHY devices integrate a voltage regulator with the ability to supply up to 20 mA for local circuits, which reduces board area by 50 percent compared to discrete implementations and enables adaptation to existing 3.3-V or 5-Vcontrollers.
  • Survives cross-wire faults: These devices integrate up to 40-V, steady-state protection to prevent damage due to installation faults or cable breaks. Up to 50-V transient protection prevents damage from power surges on field voltages, eliminating the need for an external protection device.
  • Highest operating temperature: With an operating temperature range of -40 C to +105 C, the SN65HVD101 and SN65HVD102 are the only IO-LINK PHY devices with robust capability for use in harsh industrial applications.
  • Widest output current range: These ICs drive up to 480 mA for interoperability with a wide range of sensors and small actuators, while competitors drive at 300 mA or less. The output current can also be set with a single resistor to provide self-limiting for safe operation in lower-power applications.

Solutions utilizing IO-LINK require a microcontroller (MCU) in the slave device configuration of the standard. TI’s ultra-low power MSP430TM MCUs are the best fit for point-to-point communication and low-power operation. With up to 512KB of flash memory and integrated analog-to-digital converters (ADCs), these MCUs are equipped to quickly process data from various types of sensors.

Tools and support

The SN65HVD101EVM is available to evaluate device parameters while acting as a guide for board layout. It can be ordered today for US$79. 

Support is available on the Industrial Interface Forum in the TI E2E™ Community, where engineers can ask questions and get answers from TI experts.

Availability, packaging and pricing

The SN65HVD101 and SN65HVD102 are available in a 4-mm by 3.5-mm, 20-pin VQFN package. Suggested retail pricing in 1,000-unit quantities starts at US$2.23.

Learn more about TI’s line circuit interface portfolio by visiting the links below:

#  #  #

TI analog for industrial

TI is the industrial semiconductor leader, providing a diverse and readily available portfolio of analog integrated circuits (ICs) for a broad range of applications, including smart grid, factory automation, high-voltage power, LED lighting and control.  TI data converters, ampli?ers, interface, isolation, clocking, and power management devices enable customers to differentiate their products, while TI software, design tools and reference designs simplify and accelerate design cycles. Learn how TI analog innovations are improving industrial safety, efficiency and reliability at www.ti.com/industrial-pr.

About Texas Instruments

Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world’s brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

Leave a Reply

featured blogs
Apr 2, 2026
Build, code, and explore with your own AI-powered Mars rover kit, inspired by NASA's Perseverance mission....

featured paper

Quickly and accurately identify inter-domain leakage issues in IC designs

Sponsored by Siemens Digital Industries Software

Power domain leakage is a major IC reliability issue, often missed by traditional tools. This white paper describes challenges of identifying leakage, types of false results, and presents Siemens EDA’s Insight Analyzer. The tool proactively finds true leakage paths, filters out false positives, and helps circuit designers quickly fix risks—enabling more robust, reliable chip designs. With detailed, context-aware analysis, designers save time and improve silicon quality.

Click to read more

featured chalk talk

Connecting the World Through Space
Sponsored by Mouser Electronics and Qorvo
In this episode of Chalk Talk, Ryan Jennings from Qorvo and Amelia Dalton explore the critical components and design challenges inherent in LEO satellite infrastructure and how Qorvo’s solutions are enabling the next generation of space-based connectivity. 
Mar 30, 2026
22,275 views