News – Page 1831 – EEJournal

Zuken improves design productivity and IP management with CR-8000 2013

June 26, 2013

25 June 2013 – Munich, Germany and Westford, MA, USA – Zuken addresses the needs of global design teams and their downstream partners with new versions of its Design Force and Design Gateway software, part of the CR-8000 multi-board design solution. With an emphasis on productivity enhancements and new intellectual property (IP) management capabilities, hardware engineers and PCB designers can collaborate efficiently and securely with all project participants. Design Force includes new embedded permission controls for … Read More → "Zuken improves design productivity and IP management with CR-8000 2013"

Cost-Efficient COM Express™ Type 6 Modules with Celeron CPUs

June 26, 2013

Stutensee, Germany – MSC Vertriebs GmbH has expanded its high-end MSC C6B-7S COM Express™ Type 6 module family based on third generation Intel^® Core™ processors (Ivy Bridge) with cost-efficient Celeron^®variants.

MSC offers MSC C6B-7S modules with three different Celeron^®processors and integrated Intel^®HD Graphics: The Intel^®Celeron^® CPU 1047UE with 1.4 GHz has two cores and 2 MB cache. The single-core Intel^®Celeron^®< … Read More → "Cost-Efficient COM Express™ Type 6 Modules with Celeron CPUs"

Leti Develops Lens-Free Imaging Technique that Dramatically Extends Research Capabilities into Cells, Bacteria and Viruses

June 26, 2013

GRENOBLE, France – June 26, 2013 – CEA-Leti today introduced a new video lens-free imaging technique that redefines bio imaging, provides significant advantages over traditional microscopy, and opens a new range of capabilities for researchers, such as real-time monitoring of cell cultures.

Announced at the start of Leti Innovation Days in Grenoble, the lens-free microscope can perform live capture and reach micron-size objects across a very large field of view (24mm2). In addition, the technique enables time-lapse imaging of cell cultures over extended periods.

The technique provides multi-scale observation capability across two orders of magnitude, allowing researchers to differentiate … Read More → "Leti Develops Lens-Free Imaging Technique that Dramatically Extends Research Capabilities into Cells, Bacteria and Viruses"

Agilent Technologies Introduces FPGA Development Kit for High-Speed Digitizers Powered by Mentor Graphics

June 26, 2013

SANTA CLARA, Calif., June 25, 2013 – Agilent Technologies Inc. (NYSE: A) today introduced the U5340A FPGA development kit, powered by a customMentor Graphics design engine, for high-speed digitizers.

The U5340A enables customers to deploy advanced real-time signal processing into the FPGAs on board Agilent high-speed digitizers. The development kit leverages the full density and speed of the FPGA while ensuring the digitizer’s outstanding multi-gigasample-per-second performance.

The FPGA development kit enables original equipment manufacturers and researchers to easily design in high-speed signal acquisition … Read More → "Agilent Technologies Introduces FPGA Development Kit for High-Speed Digitizers Powered by Mentor Graphics"

Synopsys and UMC Collaborate to Accelerate Development of UMC’s 14-nm FinFET Process

June 26, 2013

HSINCHU, Taiwan and MOUNTAIN VIEW, Calif., June 26, 2013 /PRNewswire/ —

Highlights

First collaboration milestone speeds validation of IP and design correlation on UMC’s 14-nm FinFET process
Process qualification vehicle validates key process and IP test structures
Tapeout helps accelerate adoption of the UMC FinFET process for faster and more power efficient system-on-chips (SoCs)

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, … Read More → "Synopsys and UMC Collaborate to Accelerate Development of UMC’s 14-nm FinFET Process"

IAR Systems launches updated version of tools for Renesas M16C and R8C

June 26, 2013

Uppsala, Sweden—June 26, 2013—Today, IAR Systems® releases a new version of its development toolchain IAR Embedded Workbench® for Renesas M16C and R8C. Developers working with microcontrollers based on these cores will now benefit from working with IAR Systems’ new user-friendly editor and source browser, as well as several new debugging features and integration with the version control system Subversion.

The text editor introduced in this version adds user-friendly features such as auto-completion, parameter hints, code folding, block select and indent, bracket … Read More → "IAR Systems launches updated version of tools for Renesas M16C and R8C"

TI introduces SafeTI™ Compiler Qualification Kit to help ease functional safety development for industrial, automotive and medical products

June 26, 2013

DALLAS, TX (June 26, 2013) – Adding to its SafeTI™ design packages, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduces its new SafeTI™ Compiler Qualification Kit. The SafeTI™ Compiler Qualification Kit assists customers in their efforts to qualify their use of the TI ARM^® C/C++ compiler to functional safety standards such as IEC 61508 and ISO 26262 while helping maximize its functionality and performance. This kit, a component of the SafeTI design packages, was developed primarily for use with TI ARM … Read More → "TI introduces SafeTI™ Compiler Qualification Kit to help ease functional safety development for industrial, automotive and medical products"

Innovative Smart-Meter Device from STMicroelectronics Simplifies Interoperability, Enabling Massive Roll-Outs by Utilities

June 26, 2013

Geneva, June 26, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the world’s first smart-meter integrated circuit (IC) with built-in support for the METERS AND MORE^{® ^[1]} open communication standard, which enables widespread interoperability among smart metering equipment using Power Line Communication (PLC). This will help to maximize smart-grid benefits for the environment, consumers and utility companies.

Tektronix to Adopt IBM’s 9HP SiGe Technology in Next Generation 70GHz Oscilloscopes

June 25, 2013

BEAVERTON, Ore., June 25, 2013 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that its next generation of high performance real-time oscilloscopes will incorporate IBM’s latest 9HP silicon-germanium (SiGe) chip-making process. This fifth generation of IBM’s semiconductor technology along with other advances such as patent pending Asynchronous Time Interleaving announced previously will result in oscilloscopes with bandwidth capability of 70 GHz and improvements in signal fidelity.

Operating at speeds up to 350 GHz, 9HP is the first SiGe technology in the industry featuring the density of 90nm BiCMOS and delivers higher performance, lower power and higher … Read More → "Tektronix to Adopt IBM’s 9HP SiGe Technology in Next Generation 70GHz Oscilloscopes"

Microchip’s New Family of High-Speed CAN Transceivers Are Low Power and Highly Robust

June 25, 2013

CHANDLER, Ariz., June 24, 2013 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced a new family of High-Speed (HS) CAN transceivers, the MCP2561/2. These new devices serve as an interface between a CAN protocol controller and the physical two-wire CAN bus. The new family of transceivers meet CAN specification requirement “GIFT ICT Group Conformance Test Specification V1.0” as verified by C&S Group GmbH in addition to other global automotive Electromagnetic Compatibility (EMC) requirements such as “Hardware Requirements for LIN, CAN and … Read More → "Microchip’s New Family of High-Speed CAN Transceivers Are Low Power and Highly Robust"

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