Taipei, Taiwan, May 3, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest addition in the growing VIA Modular Solutions portfolio, the VIA COMe-8X91. The modular design approach allows for short time-to market, application-specific customization, simplified development, high stability and long life cycles for customers to rapidly develop new and exciting devices.
Measuring 84mm x 55mm, the VIA COMe-8X91 is based on the industry standard Computer-on-Module (COM) Express Mini form factor with type 10 pin-outs. The VIA COMe-8X91 module combines an 800MHz VIA EdenTM X2 dual core processor and … Read More → "VIA Announces Latest Computer-on-Module Solution, the VIA COMe-8X91"