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STMicroelectronics and X2 Biosystems Celebrate Shipment of 5,000th Concussion Sensor System

September 6, 2013

Geneva, Switzerland, Seattle, WA, September 6, 2013 – As millions of fall sports participants take to the field to kick off the 2013 sports season, players in a wide range of activities are wearing electronic head-impact monitoring patches (“xPatches”) developed by X2 Biosystems with advanced technology from STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications.

In addition to surpassing the milestone of 5,000 xPatch sensor systems shipped, the X2 Biosystems’ Integrated Concussion Exam (ICE) software has been adopted by a broader audience. This customer list includes the NFL (National Football League), which has mandated the … Read More → "STMicroelectronics and X2 Biosystems Celebrate Shipment of 5,000th Concussion Sensor System"

Multi format 180 Watt 93% efficient power supply from XP Power

September 5, 2013

XP Power today announced additions to its GCS series of single output high efficiency “green” AC-DC power supplies with both ITE and Medical safety approvals. Complementing the GCS150 150 Watt models, the GCS180 range extends the power output capability up to 180 Watts. All models in the range have a no load input power of less than 0.5W and a typical efficiency of 93%. The GCS180 series is available in multiple mechanical formats giving the designer several mounting configurations to choose from to suit the end application. Convection cooled formats, providing up to 150 Watt output, are in an industry standard 3 x 5 … Read More → "Multi format 180 Watt 93% efficient power supply from XP Power"

Lattice Semiconductor Selects Silicon Frontline for Electrostatic Discharge (ESD) Analysis

September 5, 2013

Campbell, CA – September 5, 2013 – Silicon Frontline Technology, Inc. (SFT) an Electronic Design Automation (EDA) company in the post-layout verification market, announced today that Lattice Semiconductor, Inc. ( NASDAQ: LSCC), the provider of innovative FPGA and PLD semiconductor solutions, picked Silicon Frontline’s ESRA (ElectroStatic discharge Reliability Analysis) software for fast, full-chip ESD (ElectroStatic Discharge) analysis. ESRA improves the reliability and quality of semiconductors offered by Lattice.

“Lattice is focused on … Read More → "Lattice Semiconductor Selects Silicon Frontline for Electrostatic Discharge (ESD) Analysis"

Synopsys Launches DesignWare HDMI 2.0 TX/RX Controller and PHY IP for Ultra High-Definition Multimedia Experience

September 5, 2013

MOUNTAIN VIEW, Calif., Sept. 5, 2013 /PRNewswire/ —

Highlights:

Imagination’s Flow platform to deliver new licensable consumer music and radio streaming solution

September 5, 2013

London, UK – 5th September, 2013 – Imagination Technologies (IMG.L), a leading multimedia, processor, communications and cloud technologies company, introduces FlowAudio, a licensable cloud-based music and radio service that provides subscription access to over 24 million music tracks as well as hundreds of thousands of radio stations, on-demand programmes and podcasts.

FlowAudio is a comprehensive platform for delivering audio and creating seamless interaction between chips and devices enabled by Imagination’s IP, streaming Apps, and cloud based services.

Manufacturers can integrate the FlowAudio streaming music service and … Read More → "Imagination’s Flow platform to deliver new licensable consumer music and radio streaming solution"

20VIN 1A High Power Density LDO Features 40µVRMS Noise with H-Grade Temperature Range up to +150°C

September 5, 2013

MILPITAS, CA – September 5, 2013 – Linear Technology Corporation announces a new H grade, wider temperature range version of the LT1965 a 1A LDO with high power density. The IC features low dropout voltage of only 300mV at full load, wide VIN capability of 1.8V to 20V and an adjustable output from 1.2V to 19.5V. Low output … Read More → "20VIN 1A High Power Density LDO Features 40µVRMS Noise with H-Grade Temperature Range up to +150°C"

First DDC™ Transistor-Based Chip Enters Volume Production

September 4, 2013

LOS GATOS, Calif., and YOKOHAMA, JAPAN, September 3, 2013 — SuVolta, Inc. and Fujitsu Semiconductor Limited today announced volume production of the first Deeply Depleted Channel™ (DDC) transistor-based chip, MB86S22AA Milbeaut® image processor integrated circuit (IC). Manufactured on “CS250S” technology, which combines Fujitsu Semiconductor’s 55nm process with DDC technology, the IC has 30 percent lower power consumption and roughly twice the processing performance compared to the existing products, despite the new product having  considerably more circuits with enhanced processing performance. MB86S22AA represents the culmination of a successful joint development program between the companies. Together, … Read More → "First DDC™ Transistor-Based Chip Enters Volume Production"

Miniature SIP Ac-Dc Power Supplies Maximize Board Space

September 4, 2013

TUALATIN, Ore. — September 03, 2013 — Today, CUI Inc launched their smallest ac-dc power supplies yet with the release of the PBK ultra-compact SIP series. Available in 1 W, 3 W, and 5 W families, the modules measure as small as 1.38 x 0.43 x 0.94 in. (35 x 11 x 24 mm), occupying less pcb real-estate than other conventional ac-dc power supplies, thus allowing designers to fully maximize space where on-board ac-dc power conversion is required.

The high density PBK series is offered in single output voltages of 3.3, 5, 9, 12, 15, and 24 Vdc and can operate at ac input voltages between 85~264 Vac.  For high voltage dc-dc applications, the … Read More → "Miniature SIP Ac-Dc Power Supplies Maximize Board Space"

Advancing Graphene for Post-Silicon Computer Logic

September 4, 2013

RIVERSIDE, Calif. (www.ucr.edu) — A team of researchers from the University of California, Riverside’s Bourns College of Engineering have solved a problem that previously presented a serious hurdle for the use of graphene in electronic devices.

Graphene is a single-atom thick carbon crystal with unique properties beneficial for electronics including extremely high electron mobility and phonon thermal conductivity. However, graphene does not have an energy band gap, which is a specific property of semiconductor materials that separate electrons from holes and allows a transistor implemented with a given material to be completely switched off.
… Read More → "Advancing Graphene for Post-Silicon Computer Logic"

Programming on-board flash and EEPROM memory at SPI bus speeds from an FPGA explained in new eBook

September 4, 2013

Richardson, TX (Sept. 4, 2013) ? Designers and manufacturing engineers face challenges when it comes to programming flash and EEPROM memories that are already soldered to a circuit board. Often, the software or firmware content of these memories has not yet been completed when hardware prototypes are being validated and tested prior to volume manufacturing. As a result, the memories must be programmed and sometimes reprogrammed in-system and as quickly as possible, especially in manufacturing. 

A new eBook by ASSET® InterTech (Read More → "Programming on-board flash and EEPROM memory at SPI bus speeds from an FPGA explained in new eBook"

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