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Cima NanoTech and Fujimori Kogyo team up in strategic partnership for commercial production of SANTE® Films

September 4, 2013

August 29 2013, Tokyo, Japan – Cima NanoTech, a smart materials company and developer of the SANTE® Self-Assembling Nanoparticle Technology, and Fujimori Kogyo, a top manufacturer of high quality opto-electronic films and materials, today announced their partnership and successful commercial mass production of SANTE® Films. This partnership establishes Fujimori Kogyo as the leading global manufacturer of Cima NanoTech’s silver nanoparticle-based SANTE® Films. 

The partnership is a strong strategic fit which leverages on Cima NanoTech’s strength in its proprietary SANTE® Technology and Fujimori Kogyo’s leadership in manufacturing opto-electronic films and materials. With this partnership, Cima NanoTech … Read More → "Cima NanoTech and Fujimori Kogyo team up in strategic partnership for commercial production of SANTE® Films"

16th International VDI Congress “Electronic Systems for Motor Vehicles”

September 4, 2013

Karlsruhe (Germany) September 4, 2013 – At the 16th International VDI Congress “Electronic Systems for Motor Vehicles” on October 16 to 17, 2013 in Baden-Baden (Germany), the MOST Cooperation (MOSTCO) will exhibit the latest technology highlights at Stand F. Besides celebrating the ongoing rollout of MOST150, the standardization organization for the leading automotive multimedia network Media Oriented Systems Transport (MOST) will present a slim and low-cost HD multimedia network solution that especially targets the high-volume medium- and small-sized vehicle market. … Read More → "16th International VDI Congress “Electronic Systems for Motor Vehicles”"

Altera and Micron Lead Industry with FPGA and Hybrid Memory Cube Interoperability

September 4, 2013

San Jose, Calif., and Boise, Idaho, September 4, 2013—Altera Corporation (NASDAQ: ALTR) and Micron Technology, Inc. (NASDAQ: MU) (“Micron”) today announced they have jointly demonstrated successful interoperability between Altera Stratix® V FPGAs and Micron’s Hybrid Memory Cube (HMC). This technology achievement enables system designers to evaluate today the benefits of HMC with FPGAs and SoCs for next-generation communications and high-performance computing designs. The demonstration provides an early proof point that production support of HMC will be delivered with Altera’s Generation 10 portfolio, in alignment with market … Read More → "Altera and Micron Lead Industry with FPGA and Hybrid Memory Cube Interoperability"

TI introduces RS-485 transceiver with fastest automatic polarity correction

September 4, 2013

DALLAS (Sept. 3, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a low-power, half-duplex RS-485 transceiver with the fastest automatic bus-polarity correction time. In many industrial applications, such as e-metering networks, DMX512 networks, industrial automation, HVAC systems and process control, it is easy to connect wires incorrectly, which can cause system failure. For large networks, miswiring without quick correction can cause production delays, resulting in significant revenue loss. When hot-plugged, the SN65HVD888 provides cross-wire immunity 80 percent faster than the competition, detecting and correcting the bus polarity within 76 milliseconds of bus idling. For more information and to order samples, visit Read More → "TI introduces RS-485 transceiver with fastest automatic polarity correction"

SMIC Adopts Cadence Digital Flow with Advanced Features for Improving Area, Power and Performance

September 4, 2013

Highlights:

  • SMIC’s new 40nm Reference Flow 5.1 incorporates the state-of-the-art Cadence CCOpt and GigaOpt technology and the Tempus Timing Signoff Solution
  • The new RTL-to-GDSII digital flow supports the Cadence hierarchical low-power flow and the latest version of the Common Power Format (CPF)

SAN JOSE, Calif., Sept. 4, 2013—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981), mainland China’s largest and most advanced semiconductor … Read More → "SMIC Adopts Cadence Digital Flow with Advanced Features for Improving Area, Power and Performance"

Sand 9 Challenges Dominance of Quartz Timing Devices in Mobile Applications

September 3, 2013

CAMBRIDGE, Mass. – September 3, 2013 – Sand 9, Inc., today announced the first micro-electromechanical systems (MEMS) timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications such as 3G/4G cellular and GPS/GNSS as well as low-power wireless connectivity applications such as Bluetooth® Smart. Sand 9’s TM361 and TM061 are also the only timing products that support integration with mobile and wireless connectivity chipsets, conserving board space and reducing bill of materials.

“Our vision is to disrupt the timing market by completely eliminating … Read More → "Sand 9 Challenges Dominance of Quartz Timing Devices in Mobile Applications"

+36dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain

September 3, 2013

MILPITAS, CA – September 3, 2013 – Linear Technology announces the LTC5551, an ultrahigh dynamic range RF down-converting mixer for applications that demand the very best in performance. The LTC5551 offers very high linearity of +36dBm IIP3, (input third-order intercept), and low 9.7dB noise figure comparable to the highest IIP3 passive mixers available. Unlike passive mixers which typically have 7dB to 9dB of conversion loss, the LTC5551 boasts 2.4dB of conversion gain, substantially improving … Read More → "+36dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain"

MEMS and Sensors Summit Brings Industry Leaders Together to Share Opportunities to Shape the Future of Electronics

September 3, 2013

Geneva, September 3, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is joining with sponsors Berkeley Sensor and Actuator Center, EEWeb, Electronic Engineering Journal, MEMS-Exchange, MEMS Industry Group, MEPTEC and Mouser Electronics to host a one-day interactive summit to discuss theFuture of MEMS and Sensors. The conference will be held on September 10, 2013 at the Marriot Hotel in Santa Clara, California.

The summit will feature more than 25 distinguished panelists and speakers, including business leaders and top technologists who will demonstrate how they are adopting sensors to enable applications, augment the user experience, … Read More → "MEMS and Sensors Summit Brings Industry Leaders Together to Share Opportunities to Shape the Future of Electronics"

Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013

September 3, 2013

Regensburg, Germany, 03 September 2013 — Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year’s Semicon West to demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus. Amicra will exhibit at TWTC Nangang Exhibition Hall in Booth 1024.

Amicra’s high-accuracy NOVA Plus and AFC system are perfectly suited for die and flip-chip processing including 3D and stack-die, covering the full scope of high-volume micro/nano assembly applications. They are … Read More → "Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013"

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