EEJournal

industry news archive
Subscribe Now

Marvell Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure

Marvell Structera S Delivers 2x the Lane Density of Competitive Offerings, Expanding Marvell End-to-End PCIe Product Portfolio and Redefining PCIe Scale-up Performance
March 20, 2026

Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced Marvell® Structera™ S 60260, the industry’s first 260-lane PCIe 6.0 switch. Leveraging industry-leading interconnect solutions through the recent acquisition of XConn Technologies, the new industry’s highest-radix PCIe switch extends the Marvell end-to-end PCIe portfolio, offering unique levels of scale-up AI data center performance and design flexibility.

As AI servers integrate increasing numbers of GPUs and accelerators, PCIe scale-up fabrics have become critical to maximizing compute density and resource utilization. Traditional switches require multiple devices to achieve scale, resulting in … Read More → "Marvell Launches Industry’s First 260-lane PCIe 6.0 Switch for AI Data Center Scale-up Infrastructure"

Qnity Collaborates with NVIDIA to Accelerate Innovation for Semiconductor and Advanced Electronics Materials

Collaboration brings accelerated computing to materials research across the semiconductor value chain
March 20, 2026

WILMINGTON, Del.–(BUSINESS WIRE)–Qnity Electronics, Inc. (“Qnity”) (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced a collaboration with NVIDIA to accelerate AI-driven innovation using open NVIDIA Nemotron 3 Nano, ALCHEMI BMD NIM, LAMMPS Kokkos, and CUDA-X accelerated Abaqus for modeling and simulation technologies. The collaboration is focused on advancing materials research and development to support next-generation AI, high-performance computing, and advanced packaging technologies. Maintaining signal integrity at higher speeds and densities is critical to system performance and reliability.

“As AI … Read More → "Qnity Collaborates with NVIDIA to Accelerate Innovation for Semiconductor and Advanced Electronics Materials"

Teradyne Introduces Photon 100

Comprehensive Automated Test Platform Accelerates High-Volume Silicon Photonics and Co-Packaged Optics Manufacturing
March 20, 2026

Teradyne, Inc. (NASDAQ: TER), a leading provider of automated test equipment and advanced robotics, today announced the launch of the Photon 100, a comprehensive opto-electric automated test platform purpose-built to accelerate high-volume silicon photonics (SiPh) and co-packaged optics (CPO) manufacturing.

As demand for high-speed, energy-efficient optical interconnects surges, driven by AI and next-generation data centers, manufacturers face challenges in scaling SiPh and CPO to high volume manufacturing. By integrating industry-leading optical and electrical instrumentation with Teradyne’s proven Read More → "Teradyne Introduces Photon 100"

Infineon accelerates deployment of robots with improved safety and security features using digital twins in collaboration with NVIDIA

March 20, 2026
  • Infineon to accelerate next-generation humanoid robots enabled by digital twins in collaboration with NVIDIA
  • Scalable deployment of humanoid robots through reference designs integrating Infineon smart actuators with NVIDIA Jetson Thor and NVIDIA Halos AI Systems Inspection Lab to advance safety and security for robots
  • Infineon enables the key functional blocks in humanoid robots with a broad portfolio of dedicated products, and an estimated per-unit semiconductor content of USD 500

 Infineon Technologies AG (FSE: IFX / … Read More → "Infineon accelerates deployment of robots with improved safety and security features using digital twins in collaboration with NVIDIA"

STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads

Tiny footprint, low BOM, 93% efficiency, with light-load and noise-sensitive options
March 19, 2026

Capable of supplying 3A from a 3mm x 1.6mm footprint, STMicroelectronics’ DCP3603 monolithic buck converter simplifies design, saves PCB space, accelerates time to market, and enhances system reliability. With a 3.3V-to-36V input-voltage range, this convenient miniature converter can power equipment such as smart meters, domestic appliances, and industrial 24 … Read More → "STMicroelectronics’ single-chip buck converter packs 3A power for appliances and industrial loads"

Imec receives the world’s most advanced High NA EUV system

A major milestone in propelling industry into the ångström era
March 19, 2026

LEUVEN (Belgium), MARCH 18, 2026— Today, imec, a world-leading research and innovation hub in advanced semiconductor technologies, announces the arrival of the ASML EXE:5200 High NA EUV lithography system, the most advanced lithography tool available today. With this strategic milestone, imec reinforces its position as the industry’s launchpad into the ångström era, giving its global partners ecosystem unparalleled early access to the next generation of chip-scaling technologies. Integrated directly with a comprehensive suite of patterning and metrology tools and materials, the High NA EUV system will empower imec and its ecosystem partners to unlock the performance needed to pioneer … Read More → "Imec receives the world’s most advanced High NA EUV system"

Robots and AI are tackling some of the biggest challenges in construction

March 19, 2026

Each year, the construction industry builds $2.1 trillion worth of structures in the U.S., and more than three-quarters of those projects face delays, according to the Associated General Contractors of America.

One solution could be robots.

Virginia Tech researchers, in collaboration with Procon Consulting, are developing a coordinated team of robots, drones, and technology such as artificial intelligence (AI) sensing and computer vision designed to enable continuous, remote monitoring of construction sites. This coordinated effort — named by researchers Multi-Agent Robotic System for Inspection On Site, or MARIO — could not only minimize the impact of labor … Read More → "Robots and AI are tackling some of the biggest challenges in construction"

featured blogs
Sci-Fi and Fantasy Books They Should Make into Movies
May 6, 2026
Hollywood has struck gold with The Lord of the Rings and Dune'”so which sci-fi and fantasy books should filmmakers tackle next?...
More from Max's Cool Beans...