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Infineon and DG Matrix leverage silicon carbide technology to advance power infrastructure for AI data centers

March 25, 2026
  • Infineon and DG Matrix are partnering to drive solid-state transformer technology for AI data centers and industrial power applications
  • Solid-State Transformers (SSTs) are advanced power conversion devices that replace conventional transformers with semiconductor-based electronics for more efficient power transformation
  • Infineon’s silicon carbide power semiconductors will enhance efficiency, power density and reliability of DG Matrix’s solid-state transformer platform

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and DG Matrix, a global leader in Solid-State … Read More → "Infineon and DG Matrix leverage silicon carbide technology to advance power infrastructure for AI data centers"

DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration

Free, browser-based design environment streamlines engineering workflows from simulation to BOM export and purchasing
March 24, 2026

DigiKey, the global distribution leader of electronic components and automation products, announces the availability of an enhanced eDesignSuite experience, developed through a collaboration with Read More → "DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration"

Curtiss-Wright Enhances Electronic Warfare Information Dominance With a New Tactical Software Integration

CESMO integration into TCG LinkPRO allows near-real-time detection and identification of electromagnetic signals and data sharing across U.S. and NATO networks
March 24, 2026
 Curtiss-Wright announced today a breakthrough in battlefield communication by integrating the Cooperative Electronic Support Measure Operations (CESMO) protocol directly into its flagship Read More → "Curtiss-Wright Enhances Electronic Warfare Information Dominance With a New Tactical Software Integration"

Advanced Energy Launches AIF13WAC, 600 W Full-Brick 48 V AC-DC Supply with up to 94% Peak Efficiency

Delivers 20% higher output with 14% lower losses
March 24, 2026
Advanced Energy Industries, Inc. (Nasdaq: AEIS), a global leader in highly engineered, precision power conversion, measurement and control solutions, has extended its range of AIF full-brick board-mounted AC-DC power supplies for telecom and industrial applications with the AIF13WAC, 48 V 600 W, with a peak efficiency of up to 94%.
Unlike most available devices of this type, the new AIF13WAC integrates full digital control and monitoring (via PMBus) and active current sharing along with internal inrush limiting functionality.
Compared to the previous generation, the AIF13WAC increases output power by 20% in the … Read More → "Advanced Energy Launches AIF13WAC, 600 W Full-Brick 48 V AC-DC Supply with up to 94% Peak Efficiency"

NXP’s Third-Generation Radar Transceiver Delivers High-Performance Imaging Radar in Mass Production For Level 2+ to Level 4 Autonomous Driving

RFCMOS automotive radar transceiver with 8-transmit and 8-receive channels enables new generation of imaging radar sensors with up to 576 antenna channels for advanced ADAS and automated driving applications.
March 24, 2026

NXP Semiconductors today announced its third-generation RFCMOS automotive radar transceiver TEF8388, a highly integrated 8-transmit/8-receive (8T8R) device designed to unlock the full potential of imaging radar for L2+ to L4 ADAS and automated driving systems. In the era of software‑defined vehicles, advanced perception systems have become key enablers, with high‑resolution radar sensing as a foundational technology. Radar sensors must deliver higher resolution, enhanced dynamic range and longer detection range while remaining feasible for large volume production.

This new transceiver is a key building block in NXP’s Read More → "NXP’s Third-Generation Radar Transceiver Delivers High-Performance Imaging Radar in Mass Production For Level 2+ to Level 4 Autonomous Driving"

OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY

OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY OPEX Corporation, a leading global provider of automation and manufacturing solutions, is working closely with ONEKEY to prepare for compliance with the Cyber Resilience Act (CRA).
March 23, 2026

The European Union is introducing the Cyber Resilience Act (CRA), establishing comprehensive, binding cybersecurity requirements for connected products. For many organizations, this marks the beginning of a new phase of regulatory readiness. To support this transition, ONEKEY offers a structured Read More → "OPEX Corporation Successfully Completes CRA Fast Start Readiness Assessment with ONEKEY"

CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line

Successful HZO Ferroelectric Wafer Loops Confirm Functionality Across FAMES Sites, And Advance Europe’s Collaborative Platform for Next-Generation Non-Volatile Memory
March 23, 2026

CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European platform for advanced embedded non-volatile memory (NVM) technologies. Launched in December 2023 and coordinated by CEA-Leti, the five-year initiative has demonstrated the viability of circulating complex material stacks across some of its leading research fabs.

The collaboration initially focused on the processing and electrical characterization of hafnium-zirconium oxide (HZO) ferroelectric capacitor stacks. Utilizing the combined 300 mm CMOS cleanroom capabilities of both institutes, they circulated the wafers … Read More → "CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line"

1200 V QSiC™ Dual3 Modules Enable Power Converters with Industry-Leading Conversion Efficiency and Power Density

Half-bridge series for data center cooling and industrial drivers includes 1, 1.4 and 2 mΩ RDSon SiC MOSFETs and parallel SiC diodes for best-in-class high power conversion efficiency
March 23, 2026
 SemiQ Inc, a designer, developer, and global supplier of superior silicon carbide (SiC) solutions for ultra-efficient, high-performance, and high-voltage … Read More → "1200 V QSiC™ Dual3 Modules Enable Power Converters with Industry-Leading Conversion Efficiency and Power Density"

Renesas Unveils First Bidirectional 650V-Class GaN Switch For Solar Power Inverters, AI Data Centers and More

March 23, 2026
  • First-of-its kind bidirectional GaN technology with DC blocking dramatically reduces switch count needed for power conversion topologies
  • Compatible with standard gate drivers
  • Soft- and hard-switching capable, with fast, clean transitions

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking both positive and negative currents in a single device with integrated DC blocking. Targeting single-stage solar microinverters, AI data centers and onboard electric vehicle chargers, the high-voltage TP65B110HRU dramatically simplifies power … Read More → "Renesas Unveils First Bidirectional 650V-Class GaN Switch For Solar Power Inverters, AI Data Centers and More"

New superconducting chip could enable breakthrough Nondestructive terahertz imaging

View in Browser News Release Monday 23 March 2026 New superconducting chip could enable breakthrough Nondestructive terahertz imaging A tiny crystal chip which uses terahertz radiation to see clearly through a wide range of materials could find applications in healthcare, biological research, and security screening.
March 23, 2026

Researchers from Scotland and Japan have developed the lightweight superconducting chip, which they say could unlock the full potential of terahertz imaging technologies and lead to the development of more poweful and portable devices.

Terahertz radiation lies between the microwave and infrared frequencies of the electromagnetic spectrum. It passes easily and harmlessly through a wide range of materials, and can be used to identify the characteristic ‘fingerprint’ of molecules and biological materials as it does so, allowing them to be detected and analysed.

Although terahertz imaging technologies are already in use in some research devices, … Read More → "New superconducting chip could enable breakthrough Nondestructive terahertz imaging"

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