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Smaller, Tougher 650V and 800V MOSFETs from STMicroelectronics Leverage Power Package Innovation

February 3, 2014

Geneva, January 30, 2014 – STMicroelectronics is expanding three of its advanced high-voltage power MOSFET families with the introduction of two new power packages, making energy-conscious equipment such as battery chargers, solar microinverters and computer power supplies even more compact, robust and reliable.

ST’s advanced PowerFLAT™ 5×6 HV and PowerFLAT 5×6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650V or 800V, within the same 5mm x 6mm footprint of a standard 100V PowerFLAT 5×6. This is 52% smaller than the popular DPAK footprint. In addition, the package is only 1mm high and features a … Read More → "Smaller, Tougher 650V and 800V MOSFETs from STMicroelectronics Leverage Power Package Innovation"

Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High Temperature Materials for High-Speed Telecommunication Industries and Bendable Electronic Devices

February 3, 2014

Peapack, NJ, Basel, Switzerland, January 27, 2014 —  Novoset, LLC and Lonza are pleased to announce the introduction of PrimasetTM ULL-950 and PrimasetTM HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries. These thermoset resins are based on Cyanate ester (CE) chemistry. PrimasetTM ULL-950 is suitable for high-performance applications such as power amplifiers for 4G LTE and 4G LTE advanced base stations for smartphones, internet infrastructure and high-layer count servers for “cloud computing”. Low dielectric properties coupled with high Glass transition temperature (T … Read More → "Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High Temperature Materials for High-Speed Telecommunication Industries and Bendable Electronic Devices"

Fujitsu Semiconductor and Synopsys Deliver an Optimized and Predictable Customized SoC (ASIC) Design Flow

January 31, 2014

MOUNTAIN VIEW, Calif., Jan. 28, 2014 /PRNewswire/ —

Highlights:

  • Early design exploration accelerates creation of high-quality RTL and floorplan
  • Monotonic area optimization improves design utilization and lowers power consumption
  • Placement- and congestion-aware synthesis enables a convergent handoff flow
  • New predictable flow expedites final layout

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced, through joint collaboration with Fujitsu Semiconductor Limited, a faster, area-optimized and highly predictable Customized SoC (ASIC) design flow for … Read More → "Fujitsu Semiconductor and Synopsys Deliver an Optimized and Predictable Customized SoC (ASIC) Design Flow"

ANSYS Debuts New Electromagnetic Simulation Suite For Printed Circuit Board Design

January 31, 2014

PITTSBURGH and SANTA CLARA, Calif., Jan. 29, 2014 /PRNewswire/ — Designing and optimizing complex high-speed electronic devices from end-to-end is faster, easier and more accurate thanks to an expanded suite and new functionality for ANSYS®(NASDAQ: ANSS) SIwave™.  ANSYS’ electromagnetic (EM) simulation suite for the design of high-speed printed circuit boards (PCB) and integrated circuit (IC) packages is now available via three targeted products, SIwave-DC, SIwave-PI, and SIwave. Users can quickly identify potential power and signal integrity problems with increased flexibility and easier access to a complete set of analysis capabilities that can be leveraged throughout the PCB design flow. </ … Read More → "ANSYS Debuts New Electromagnetic Simulation Suite For Printed Circuit Board Design"

Latest Release of Design Compiler Adds Technologies to Reduce Area and Accelerate Design Schedules

January 31, 2014
  • 10% reduction in area and leakage power at all process nodes
  • RTL analysis and cross-probing for faster debugging and creation of high-quality design data
  • Early congestion detection and optimization for faster design closure

The 2013.12 release of Synopsys’ Design Compiler® family, a key component of Synopsys’ Galaxy™ Implementation Platform, is now available. New innovations in this release reduce both design area and leakage power by 10 percent, while additional new capabilities accelerate design cycles by enabling faster debugging of design data and speeding design closure.

Design Compiler 2013.12 includes new optimizations … Read More → "Latest Release of Design Compiler Adds Technologies to Reduce Area and Accelerate Design Schedules"

IAR Systems boosts ease of use for embedded development of Renesas SuperH-based applications

January 31, 2014

Uppsala, Sweden—January 31, 2014—As being committed to supplying world-leading, high-class development tools for all Renesas MCUs, IAR Systems® is today proud to announce a new version of its complete embedded development toolchain IAR Embedded Workbench® for Renesas SuperH. This new edition provides several new features to boost ease of use as well as improved optimizations, updated device support and example projects.

To make the work for developers of SuperH-based applications easier and more efficient, the text editor and the source browser has gained new functionality in this version of IAR Embedded Workbench for SuperH. … Read More → "IAR Systems boosts ease of use for embedded development of Renesas SuperH-based applications"

Mentor Graphics acquires Mecel Picea AUTOSAR Development Suite

January 31, 2014

WILSONVILLE, Or., January 31st, 2014—Mentor Graphics Corporation (NASDAQ: MENT) today announced it has strengthened its automotive software solution by purchasing the AUTOSAR assets, including the Mecel Picea AUTOSAR Development Suite, from Mecel AB. The acquired assets complement the existing automotive software solution from Mentor including the Volcano™ AUTOSAR products,   Mentor® Embedded Hypervisor, and Mentor Automotive Technology Platform (ATP), which enables Linux®-based automotive solutions, including GENIVI-compliant infotainment (IVI) solutions.   The Mentor automotive software solutions enable a wide range of subsystems, including secure, homogenous and heterogeneous multicore … Read More → "Mentor Graphics acquires Mecel Picea AUTOSAR Development Suite"

New in ITTIA DB SQL 6.0: Smart Data Discovery for Embedded Systems and Devices

January 31, 2014

January 29, 2014 — Bellevue, WA — ITTIA introduces version 6.0 of its flagship database software, ITTIA DB SQL, which brings new intelligence to data management on embedded systems and devices with true peer-to-peer replication. As the Internet of Things (IoT) will soon comprise billions of connected devices, discovery of proximate devices is a key component of new applications. By advertising and discovering nearby database replication services, ITTIA DB SQL 6.0 greatly simplifies interoperability between home automation systems, automotive entertainment systems, mobile handsets, and more.

In this new hyper-connected world, devices can relate information to each other indirectly through cloud-based services on the … Read More → "New in ITTIA DB SQL 6.0: Smart Data Discovery for Embedded Systems and Devices"

CEVA Utilizes Synopsys’ Design Compiler Graphical to Achieve Higher Frequency and Smaller Area for its DSP Cores

January 31, 2014

MOUNTAIN VIEW, Calif., Jan. 29, 2014 /PRNewswire/ —

Highlights:

  • Predictable flow with minimum iterations through tight correlation with Synopsys’ IC Compiler™ place-and-route solution
  • Delivers 5 percent higher frequency and 7 percent smaller area

Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems today announced that CEVA, Inc. (NASDAQ:CEVA), a leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions, has utilized Synopsys’ Design Compiler® Graphical RTL synthesis solution to accelerate the implementation of … Read More → "CEVA Utilizes Synopsys’ Design Compiler Graphical to Achieve Higher Frequency and Smaller Area for its DSP Cores"

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