News – Page 1689 – EEJournal

ADLINK Announces Inclusion of Powerful New Time-Frequency Analysis Application With USB-2405 USB 2.0 Digital Signal Analyzer

February 14, 2014

SAN JOSE, CA – February 11, 2014 – ADLINK Technology, Inc. is pleased to announce its new packaging of the value-added Visual Signal DAQ Express time-frequency analysis (TFA) application with our USB-2405 24-bit USB 2.0 dynamic signal acquisition (DSA) module for integrated electronic piezoelectric (IEPE) accelerometer and microphone-based vibration measurement. Inclusion of the application helps to provide a complete solution and improves user experience in machinery vibration analysis environments.

Visual Signal DAQ Express is an easy-to-use application with powerful functionality and interactive user interface that simplifies acquisition and analysis of noise and … Read More → "ADLINK Announces Inclusion of Powerful New Time-Frequency Analysis Application With USB-2405 USB 2.0 Digital Signal Analyzer"

Revised PMBus™ Power System Management Protocol Specification V1.3 to be Introduced at APEC 2014

February 14, 2014

Richardson, TX, February 4, 2014 — On Tuesday, March 18, 2014 between 8:30AM and 12 noon, during the Applied Power Electronics Conference and Exposition (APEC) held at the Fort Worth Convention Center, the revised PMBus Power System Management Protocol Specification V1.3 will be introduced. Power Electronics Standards session IS2-1-5, “An Introduction to Revision 1.3 of the PMBus Specification” will be presented by Travis Summerlin from Texas Instruments and Mike Jones from Linear Technology. At 4PM that afternoon, a one hour follow-up session entitled “Live Q&A: Find Out More About Revision 1.3 of the PMBus Specification” … Read More → "Revised PMBus™ Power System Management Protocol Specification V1.3 to be Introduced at APEC 2014"

STMicroelectronics’ Galileo-Compatible Satellite-Tracking Chips Are Ready for eCall Approval

February 14, 2014

Geneva, February 13, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronic applications, today announced that it had released its Teseo II single-chip satellite-tracking IC to the European Space Agency (ESA) and the European Commission Joint Research Center (JRC) for testing for eCall approval. The testing campaign is coordinated by the European GNSS (Global Navigation Satellite System) Agency (GSA) as part of its effort to accelerate Galileo adoption.

The Galileo tests … Read More → "STMicroelectronics’ Galileo-Compatible Satellite-Tracking Chips Are Ready for eCall Approval"

Lattice Semiconductor Demonstrating New USB3 and HMI Solutions, Presenting Papers on MIPI Interfacing at Embedded World

February 14, 2014

HILLSBORO, OR – February 12, 2014 – Lattice Semiconductor Corporation (NASDAQ: LSCC) will demonstrate new USB3 and Human Machine Interface (HMI) solutions, and address how embedded designers can use low-power, low-cost FPGAs (Field Programmable Gate Arrays) to overcome the challenges of implementing MIPI interfaces at the Embedded World Exhibition and Conference taking place in Nuremberg, Germany, Feb. 25-27.

HMI-on-a-Chip (HOC) is a complete Lattice FPGA-based single chip HMI reference design demonstrating touch screen based HMI solutions. The solution is scalable and can be implemented using Lattice’s family of Read More → "Lattice Semiconductor Demonstrating New USB3 and HMI Solutions, Presenting Papers on MIPI Interfacing at Embedded World"

MSC Technologies presents Qseven 2.0 Baseboard

February 14, 2014

Stutensee, Germany – MSC Technologies presents its embedded platform MSC Q7-MB-EP6 which is MSC Technologies’s first baseboard designed for the new Rev. 2.0 of the popular Qseven™ standard for computer-on-modules (COMs). The versatile carrier board can be used for the development of embedded systems, but is also well suited as Qseven™ application board for small and medium production volume. With its compact size and universal interface set it saves system designers the time and effort to develop their own baseboard to provide the infrastructure for the compact Qseven™ module.

The platform board MSC … Read More → "MSC Technologies presents Qseven 2.0 Baseboard"

Integrated High Voltage Regulator from Diodes Incorporated Boosts Power Density

February 14, 2014

Plano, Texas – February 13, 2014 – Diodes Incorporated has introduced a pair of high voltage linear regulators suiting 48V DC power systems in telecom, networking and Power-over-Ethernet equipment. Integrating several components into TO252-4 and PowerDI5060-8 packages, the ZXTR1005K4 and ZXTR1005PD8 help minimize circuit footprint while providing a fixed 5V (+/-2%) output and a high drive capability of 50mA.

For high voltage regulation tasks, where industry standard linear regulators can’t be used, the ZXTR1005 provides a cost effective alternative that offers a significant improvement in supply reliability. The regulated 5V output enables microcontrollers … Read More → "Integrated High Voltage Regulator from Diodes Incorporated Boosts Power Density"

Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X

February 14, 2014

SAN JOSE, Calif., February 13, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the availability of Cadence® Tensilica® HiFi Audio Tunneling for Android?. As the industry’s first Android-compatible technology for a licensed digital signal processor (DSP), Tensilica HiFi Audio Tunneling for Android takes full advantage of enhancements in the recent KitKat release to prolong battery life in smartphones and mobile devices. The solution can cut audio processing power by up to 14X, which results in double the smartphone playback time. KitKat audio tunneling was developed based on input from the Low … Read More → "Cadence Tensilica HiFi Audio Tunneling for Android Cuts Audio Processing Power by Up to 14X"

Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP

February 14, 2014

GRENOBLE, France – February 14, 2014 – CEA-Leti and STMicroelectronics have presented the successful demonstration of an ultra-wide-voltage range (UWVR) digital signal processor (DSP), based on 28nm ultra-thin body buried-oxide (UTBB) FD-SOI technology.

The device, produced by ST in their 28nm UTBB fully depleted SOI process technology, allows body-bias-voltage scaling from 0V to +2V, decreases minimum circuit operating voltage, and supports clock-frequency operation of 460MHz at 400mV.

The demonstrator achieves UWVR, greater energy efficiency, and unprecedented levels of efficiency in voltage and frequency using a combination of design techniques. ST and Leti developed and optimized standard cells libraries over … Read More → "Leti and STMicroelectronics Demonstrate Order-of-Magnitude-Faster FD-SOI Ultra-Wide-Voltage Range DSP"

New, Intelligent System for Machine Vision

February 13, 2014

February 11, 2013, Irvine, CA – Advantech, a global embedded computing leader who provides embedded and intelligent platform solutions across multiple vertical markets, has just released the AIIS-1240 & AIIS-1440, new PoE and USB3 camera controllers for vision inspection. AIIS, abbreviated from Advantech Intelligent Inspection System, is Advantech’s newest dedicated solution aiming automated optical inspection (AOI), including packaging inspection, label inspection, wafer inspection, alignment inspection, and other applications that rely heavily on machine vision. These self-contained PoE and USB3 controllers feature performance computing with Power over Ethernet (PoE)/USB3.0, a rich I/O interface, plus extended product longevity, all in a … Read More → "New, Intelligent System for Machine Vision"

Jumpstart IoT Application Designs with NFC Discovery Kit from STMicroelectronics

February 13, 2014

Geneva, February 13, 2014 – At Embedded World 2014, STMicroelectronics will unveil an easy-access development platform for its M24SR dynamic NFC tags that are now entering volume production in all memory densities and package options. Accelerating the design of IoT applications, ST’s M24SR Discovery Kit contains everything engineers need to start adding NFC connectivity to any kind of … Read More → "Jumpstart IoT Application Designs with NFC Discovery Kit from STMicroelectronics"

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