Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs
San Jose, Calif. And Hsinchu, Taiwan, R.O.C., April 21, 2014 – Altera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have worked together to bring TSMC’s patented, fine-pitch copper bump-based packaging technology to Altera’s 20 nmArria®10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera’s 20 nm device family.
“TSMC has provideda very advanced and robust integrated package solution for … Read More → "Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs"

