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Compact and Low Cost Single Output Switching Power Supplies from 25-100W now available from Stadium Power

The JSF series of single output enclosed switched mode power supplies from Stadium Power, the leading UK based provider of power supply solutions, now offer a compact and low cost power supply with a high operating temperature up to 70°C for industrial, instrumentation, telecoms and IT systems.

The JSF series is available with output power ratings of 25W, 50W, 75W and 100W with a 3 year warranty.

Output voltage is specified as 3.3, 5, 9, 12, 15, 24 and 48VDC and all models offer a wide input voltage range (universal input voltage or user selectable voltage depending on model). Other key specifications … Read More → "Compact and Low Cost Single Output Switching Power Supplies from 25-100W now available from Stadium Power"

MOST Cooperation Welcomes Commitment from Microchip Technology to Release MOST150 Data Link Layer Specification

Karlsruhe (Germany) February 28, 2014 – The MOST® Cooperation – standardization organization for the leading automotive multimedia network technology Media Oriented Systems Transport (MOST) – welcomes Microchip Technology’s decision to make its MOST150 Data Link Layer Specification available for license on a royalty-bearing basis, as announced in a press release on November 13, 2013. “In October 2007, SMSC and Harman/Becker started opening the data link layer by announcing that a detailed Data Link Layer specification for the first generation, MOST25, had been made available and could be requested,” stated Rainer Klos, MOST Cooperation Administrator. “MOSTCO very much appreciates that Microchip is now continuing this … Read More → "MOST Cooperation Welcomes Commitment from Microchip Technology to Release MOST150 Data Link Layer Specification"

More Memory and Lower Power Enhance New Ultra-Low-Power STM32 Microcontrollers from STMicroelectronics

Geneva, March 4, 2014 – STMicroelectronics has extended its STM32 L1 series of ultra-low-power ARM® Cortex®-M3 32-bit microcontrollers with new 512KB flash devices. The L1 series now includes more than 70 part numbers in three lines that offer the market-unique combination of ultra-low power consumption and memory size up to 512KB of Flash and 80KB of RAM.

Offering outstanding low-power operation via ST’s new, proprietary ultra-low-leakage 110nm CMOS process and optimized architecture, the new devices target cost-efficient embedded designs in … Read More → "More Memory and Lower Power Enhance New Ultra-Low-Power STM32 Microcontrollers from STMicroelectronics"

Synopsys Introduces Verification Compiler to Enable 3X Productivity

MOUNTAIN VIEW, Calif.March 4, 2014 — Synopsys, Inc. (Nasdaq:SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the availability of Verification Compiler™ solution, a new product that represents a compelling vision in the industry for system-on-chip (SoC) verification technology and verification roadmaps. Verification Compiler is a complete portfolio of integrated, next-generation verification technologies that include advanced debug, static and formal verification, simulation, verification IP and coverage closure. Together these technologies offer a 5X performance improvement and a substantial increase in debug … Read More → "Synopsys Introduces Verification Compiler to Enable 3X Productivity"

University of Toronto and Sendyne to Present Innovative Power Supply Design for Mobile Devices at the IEEE Applied Power Electronics Conference

New York, New York, March 4, 2014 – A joint collaboration between the University of Toronto and Sendyne Corp. has yielded a new circuit that enables a smaller, lighter battery and power subsystem for tablet PCs and other portable devices. 

The volume occupied by the power supply circuit has been a limiting factor for  miniaturization of the electronics in mobile devices. Current power supply designs occupy anywhere between 20% and 80% of the volume of such devices, depending on the application. A significant portion of this volume is determined by the size of inductors and capacitors used in such power supply circuits.</ … Read More → "University of Toronto and Sendyne to Present Innovative Power Supply Design for Mobile Devices at the IEEE Applied Power Electronics Conference"

AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE

March 3, 2014, San Jose, CA – AMIQ EDA, a pioneer in integrated development environments (IDEs) for hardware design and verification, today announced the release of version 3.5 of the Design and Verification Tools (DVT) IDE. This version brings enhanced compilation, improved UVM support, a streamlined GUI, and capabilities that simplify DVT deployment.

The DVT IDE is a complete and powerful code development environment for the design and verification languages e, SystemVerilog, Verilog, VHDL. It is built on the Eclipse Platform and includes an IEEE standard-compliant parser, which continuously runs in the background. The tool integrates within a single window a … Read More → "AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE"

AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE

March 3, 2014, San Jose, CA – AMIQ EDA, a pioneer in integrated development environments (IDEs) for hardware design and verification, today announced the release of version 3.5 of the Design and Verification Tools (DVT) IDE. This version brings enhanced compilation, improved UVM support, a streamlined GUI, and capabilities that simplify DVT deployment.

The DVT IDE is a complete and powerful code development environment for the design and verification languages e, SystemVerilog, Verilog, VHDL. It is built on the Eclipse Platform and includes … Read More → "AMIQ EDA Releases Version 3.5 of the Design and Verification Tools (DVT) IDE"

Sonics Augments SpyGlass® IP Kit Verification Flow with SpyGlass Constraints

SAN JOSE, Calif. – March 3, 2014 – Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, along with Sonics, Inc., the world’s foremost supplier of on-chip network technologies and services, today announced that Sonics has adopted Atrenta’s SpyGlass Constraints tools to enhance its semiconductor intellectual property (IP) signoff flow. This addition will ensure that Sonics continues to provide the highest quality IP including fully verified timing exceptions, false … Read More → "Sonics Augments SpyGlass® IP Kit Verification Flow with SpyGlass Constraints"

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