industry news
Subscribe Now

University of Toronto and Sendyne to Present Innovative Power Supply Design for Mobile Devices at the IEEE Applied Power Electronics Conference

New York, New York, March 4, 2014 – A joint collaboration between the University of Toronto and Sendyne Corp. has yielded a new circuit that enables a smaller, lighter battery and power subsystem for tablet PCs and other portable devices. 

The volume occupied by the power supply circuit has been a limiting factor for  miniaturization of the electronics in mobile devices. Current power supply designs occupy anywhere between 20% and 80% of the volume of such devices, depending on the application. A significant portion of this volume is determined by the size of inductors and capacitors used in such power supply circuits.

The circuit to be presented at APEC 2014 addresses these issues. This topology consumes less power than would normally be required to maintain stable DC bus voltage output of the battery subsystem in portable devices, and achieves a 9X reduction in size and cost of the output capacitor.  As the trend in new device design is to utilize dual cell batteries for optimization of power delivery and cell life, the new architecture also provides for inexpensive, lossless balancing of the batteries in dual cell systems.  Experimental results obtained from an 8-12 V, 20 W, 250 KHz prototype demonstrate a peak efficiency of 93.4%. 

The new topology will be presented at the IEEE Applied Power Electronics Conference (APEC) and Exhibition in Fort Worth, Texas, on Thursday, March 20th, 2014.  IEEE APEC is considered the world’s premier power electronics event.  The presentation is entitled, “Assisting Converter Based Integrated Battery Management System for Low Power Applications.”

Leading the project team is Professor Aleksandar Prodic, from the Electrical and Computer Engineering (ECE) Department of the University of Toronto.  He is the founder of the Laboratory for Power Management and Integrated SMPS, where the development is taking place.  Dr. Prodic, a recipient of several IEEE awards and distinctions, is an expert in power system design. During APEC 2014 he will offer a seminar on design of high power density switch-mode power supplies.

About Sendyne

Sendyne develops key semiconductor components and advanced circuits for the management of battery systems used for grid storage and EVs, as well as innovative tools for battery system design and optimization.

About the University of Toronto

The University of Toronto has assembled one of the strongest research and teaching faculties in North America, presenting top students at all levels with an intellectual environment unmatched in breadth and depth on any other Canadian campus.

University of Toronto faculty co-author more research articles than their colleagues at any university in the US or Canada other than Harvard. As a measure of impact, U of T consistently ranks alongside the top five U.S. universities whose discoveries are most often cited by other researchers around the world.  The University of Toronto faculty is also widely recognized for their teaching strengths and commitment to graduate supervision.

Established in 1827, the University of Toronto today operates in downtown Toronto, Mississauga and Scarborough, as well as in nine renowned academic hospitals.

Leave a Reply

featured blogs
Apr 23, 2024
The automotive industry's transformation from a primarily mechanical domain to a highly technological one is remarkable. Once considered mere vehicles, cars are now advanced computers on wheels, embodying the shift from roaring engines to the quiet hum of processors due ...
Apr 22, 2024
Learn what gate-all-around (GAA) transistors are, explore the switch from fin field-effect transistors (FinFETs), and see the impact on SoC design & EDA tools.The post What You Need to Know About Gate-All-Around Designs appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured chalk talk

Optimize Performance: RF Solutions from PCB to Antenna
Sponsored by Mouser Electronics and Amphenol
RF is a ubiquitous design element found in a large variety of electronic designs today. In this episode of Chalk Talk, Amelia Dalton and Rahul Rajan from Amphenol RF discuss how you can optimize your RF performance through each step of the signal chain. They examine how you can utilize Amphenol’s RF wide range of connectors including solutions for PCBs, board to board RF connectivity, board to panel and more!
May 25, 2023
37,471 views