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IC Plus Selects Berkeley Design Automation Analog FastSPICE™ Platform for Mixed-Signal Circuit Verification

SANTA CLARA, CA, — March 11, 2014— Berkeley Design Automation, Inc., provider of the world’s fastest nanometer circuit verification, today announced that IC Plus Corporation, a communication and networking IC design company has selected the Analog FastSPICE Platform for full-circuit verification of their mixed-signal integrated circuits.

“Our stringent verification flow requires full-circuit verification of our mixed-signal designs with nanometer SPICE accuracy,” said Albert Liu, VP of R&Dat IC Plus Corporation. “The Analog FastSPICE Platform has the accuracy, performance, and capacity to handle our full-circuit verification requirements. The AFS Platform provides nanometer SPICE accuracy significantly faster than alternative … Read More → "IC Plus Selects Berkeley Design Automation Analog FastSPICE™ Platform for Mixed-Signal Circuit Verification"

Big Performance, Small Package – Akustica’s Newest MEMS Microphones Target Smartphones and Wearables

  • Four new HD voice MEMS microphones deliver superior voice capture for multi-microphone applications
  • New line-up features AKU346, the only MEMS microphone to achieve a 64dB SNR in a tiny 6mm2 footprint
  • Akustica/Bosch in-house MEMS design and manufacturing capability enables more rapid product generations

PITTSBURGH – Akustica, Inc., a Bosch Group company and leading provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, … Read More → "Big Performance, Small Package – Akustica’s Newest MEMS Microphones Target Smartphones and Wearables"

Synopsys Announces STMicroelectronics’ Adoption of IC Compiler for CPU and GPU Implementation

MOUNTAIN VIEW, Calif., March 11, 2014 /PRNewswire/ —

Highlights:

  • STMicroelectronics completes standardization on IC Compiler for all general-purpose and graphics-processor implementations
  • High-performance/low-power optimizations help meet aggressive design goals and time-to-market schedules
  • Key enabling technologies in IC Compiler include concurrent clock and data optimization, layer-aware optimization, physical datapath, and comprehensive support for hierarchical and low-power design

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that STMicroelectronics, a global semiconductor leader serving … Read More → "Synopsys Announces STMicroelectronics’ Adoption of IC Compiler for CPU and GPU Implementation"

X-FAB to Exhibit Ultra-High-Voltage Process and New Analog Building Blocks for AC/DC Converters and AC LED Applications Available for Designers of Power Electronics at APEC 2014 Conference and Exposition

ERFURT, Germany – Mar. 12, 2014 –

Who

X-FAB Silicon Foundries, the leading analog/mixed-signal foundry and expert in “More than Moore” technologies

What

Will exhibit its high-performance power management solutions in 0.18 and 0.35 micrometer technologies at the Applied Power Electronics (APEC) 2014 Conference and Exposition in Fort Worth, Texas, next week. These solutions include its ultra-high-voltage CMOS process and a new analog cell library available in its XU035 process that helps engineers design monolithic … Read More → "X-FAB to Exhibit Ultra-High-Voltage Process and New Analog Building Blocks for AC/DC Converters and AC LED Applications Available for Designers of Power Electronics at APEC 2014 Conference and Exposition"

Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications

Highlights:

  • Cadence speeds up and expands Interconnect Workbench solution for ARM® CoreLink™ 400 interconnect IP-based systems to deliver faster performance verification and analysis
  • Cadence now provides ARM Fast Models combined with the Palladium® XP II platform to support ARMv8-based system embedded OS verification
  • Verification IP supporting the ARM AMBA® 5 CHI protocol for advanced networking, storage and server systems is now available for simulation and the Palladium XP II platform

SAN JOSE, Calif., March 12, 2014—Cadence … Read More → "Cadence Expands ARM-based System Verification Solution, Reducing Time-to-Market for Mobile, Networking and Server Applications"

Programmable Buck Converter from Diodes Incorporated Helps Reduce Solution Size

Plano, Texas – March 12, 2014 – Diodes Incorporated has introduced the AP3440, a PWM synchronous buck DC-DC converter for low-voltage, high-density power systems.  With its switching frequency programmable over the range 200kHz to 2MHz, the device enables a reduction in the size of external inductors and capacitors and simplification of power supply design.

The buck converter’s operating frequency is set using a timing resistor and is also easily synchronized with an external system clock applied to the same resistor input pin.  A wide supply … Read More → "Programmable Buck Converter from Diodes Incorporated Helps Reduce Solution Size"

51st Design Automation Conference Announces the 2014 A. Richard Newton Young Student Fellow Program

LOUISVILLE, Colo. – March 12, 2014 — In honor of the memory of Dr. A. Richard Newton, the Design Automation Conference(DAC) is sponsoring an expanded Young Student Fellow Program. The Newton Young Student Fellow Program actively supports the next generation by enabling young students at the beginning of a career to enter the dynamic world of design and automation of electronic systems. Each Young Student Fellow will actively engage in DAC through a … Read More → "51st Design Automation Conference Announces the 2014 A. Richard Newton Young Student Fellow Program"

STMicroelectronics Reveals Climate-Saving Power Devices with High-Temperature Performance Edge

Geneva, March 12, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed an advanced new product family enabling power supply designers to drive up energy efficiency in applications such as solar inverters and electric vehicles, enterprise computing, and industrial motor drives.

ST is among the first companies to produce this type of device, a high-voltage silicon carbide (SiC) power MOSFET, and has achieved the industry’s highest temperature … Read More → "STMicroelectronics Reveals Climate-Saving Power Devices with High-Temperature Performance Edge"

Altera Introduces OTN Solutions for 400G and Beyond at OFC 2014

San Francisco, Calif., OFC 2014 – March 11, 2014 – Altera Corporation (Nasdaq: ALTR) today announced two new SoftSilicon® FPGA platforms that provide optical equipment manufacturers with standards-based OTN solutions beyond 100 Gigabit/s (B100G). The platforms feature an FPGA in combination with a fully integrated IP solution that reduces design time, integration processes and test phases, allowing customers to focus more on value-add technology differentiation. The new products are the Altera SoftSilicon 400G Transponder/Muxponder (TPO516) and the Altera SoftSilicon single-chip 20-channel any-rate mapper with segmentation and reassembly (SAR) (TPOC226), … Read More → "Altera Introduces OTN Solutions for 400G and Beyond at OFC 2014"

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