News – Page 1650 – EEJournal

Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance

May 1, 2014

SAN JOSE, Calif., May 1, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that its Kintex® UltraScale™ FPGAs are the first 20nm devices to achieve PCI Express® compliance and are now listed on the PCI-SIG® integrator’s list. The Kintex UltraScale FPGAs, with integrated Endpoint blocks for PCI Express enabling high performance applications, passed rigorous electrical, protocol, and interoperability tests at the latest PCI-SIG event held … Read More → "Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance"

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

May 1, 2014

Indium Corporation’s Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

The oxidation-inhibiting properties of Indium10.1 promote industry-leading head-in-pillow and graping resistance, with complete coalescence, even after long reflow profiles. The exceptional soldering ability of Indium10.1 makes it the best solution for components with less-than-ideal solderability and challenging RF shield metallizations.

Indium10.1 enables the lowest cost of ownership to PCB assembly manufacturers through an all-around balanced performance in both high … Read More → "Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes"

Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation

May 1, 2014

SANTA CLARA, Calif., April 30, 2014 – Agilent Technologies Inc. (NYSE: A) today announced its acquisition of electrothermal analysis technology from Gradient Design Automation, the maker of HeatWave electrothermal analysis software. Agilent EEsof EDA now has sole ownership of Gradient’s core technology and will serve customers of both the integrated Advanced Design System software solution and Gradient’s HeatWave solution.

The electrothermal analysis technology allows designers to identify and correct thermal problems during integrated circuit development.

“Thermal management is one of the toughest challenges facing modern IC … Read More → "Agilent Technologies Acquires Electrothermal Analysis Technology from Gradient Design Automation"

TI delivers most robust single- and dual-channel gate drivers for automotive applications with Industry’s fastest propagation delays

May 1, 2014

DALLAS (April. 30, 2014) – Texas Instruments (TI) (NASDAQ:TXN) today introduced six, AEC-Q100-qualified gate drivers with industry’s fastest propagation delays of less than 15 nanoseconds. The UCC275xx-Q1 family of single- and dual-channel gate drivers provides the highest power efficiency, reliability and flexibility compared to existing solutions for automotive applications, such as powertrain, bi-directional converters (12- to 48-V and 12- to 400-V input), onboard charging, traction inverters, advanced driver assistance systems (ADAS), safety, headlamps and instrumentation clusters. For more information and samples, visit: www.ti.com/ucc27531q1-pr</ … Read More → "TI delivers most robust single- and dual-channel gate drivers for automotive applications with Industry’s fastest propagation delays"

Industrial-grade gigabit Ethernet switches with ultra-robust performance

May 1, 2014

Brighton, UK, 1^st May 2014 – Amplicon has introduced the new EDS-G500E series to its ever expanding portfolio of Industrial Ethernet switches. The EDS-G500E series is designed for use in large-scale networks to converge field applications in extreme industrial environments. In addition to Level 4 EMS protection, severe shock/vibration resistance, and a new thermal fin design that can reduce switch temperatures (5°C or more), the EDS E series has many user-centric features to significantly improve network manageability.

The EDS-G500E series offers various copper and fibre slot combinations with up to 16 gigabit Ethernet ports to … Read More → "Industrial-grade gigabit Ethernet switches with ultra-robust performance"

Avnet Abacus enhances interconnect offering with introduction of connector application tooling products

May 1, 2014

Poing, Germany, 1 May, 2014: Avnet Abacus, one of Europe’s leading interconnect, passive, electro-mechanical and power distributors and a business unit of Avnet Electronics Marketing EMEA, a business region of Avnet, Inc. (NYSE: AVT), is now stocking hundreds of standard connector application tooling products from Molex and TE Connectivity (TE), and can offer a minimum order quantity (MOQ) of one piece on all application tooling from both manufacturers with lead times of typically less than two weeks.

This new offering from Avnet Abacus … Read More → "Avnet Abacus enhances interconnect offering with introduction of connector application tooling products"

Mellanox Technologies Standardizes on Synopsys’ Design Compiler Graphical

May 1, 2014

MOUNTAIN VIEW, Calif., May 1, 2014 /PRNewswire/ —

Highlights:

Design Compiler Graphical delivers 10 percent faster timing and tight correlation to IC Compiler
Mellanox widely deploys Design Compiler Graphical to achieve challenging design goals within schedule

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced that Mellanox Technologies, a leading supplier of high-performance, end-to-end interconnect solutions for data center servers and storage systems, has standardized … Read More → "Mellanox Technologies Standardizes on Synopsys’ Design Compiler Graphical"

System marginality validation explained in new eBook by ASSET InterTech

May 1, 2014

Richardson, TX (May 1, 2014) ? Taking into account the operating margins on a circuit board design has emerged as a better predictor of the design?s performance over its life cycle than plotting signal integrity on a few buses with an oscilloscope. A new eBook published by ASSET® InterTech (www.asset-intertech.com) explains how system marginality validation (SMV) is performed and its many advantages over legacy design validation methods.

?Manufacturers want to minimize … Read More → "System marginality validation explained in new eBook by ASSET InterTech"

Car Radio Processor from STMicroelectronics Makes Visteon’s New Connected Audio Products Sing

April 30, 2014

Geneva, April 30, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced its automotive microprocessor for car radio and display audio has been selected by Visteon Corporation’s Chinese joint venture, Yanfeng Visteon Electronics (YFVE). YFVE is using ST’s car radio processor in its new Connected Audio Products, which are in production with a major global OEM on several vehicle lines.

Visteon’s “Connected Audio Solution” incorporates ST’s Automotive-grade cost-optimized Car Radio Processors. The ST processor family features multicore processors (ARM^®-core processors and an application-specific … Read More → "Car Radio Processor from STMicroelectronics Makes Visteon’s New Connected Audio Products Sing"

Sidense 1T-OTP NVM Qualified in Second-Generation TSMC 180nm BCD Process

April 30, 2014

Ottawa, Canada – (April 30, 2014) – Sidense Corp., a leading developer of non-volatile memory OTP IP cores, today announced that the Company’s 1T-OTP macros for TSMC’s 180nm BCD 1.8/5.0V Gen 2 process have met all TSMC9000 Assessment program requirements. Sidense OTP macros, at this process node, support applications such as automotive and industrial electronics that require reliable operation and long-life data retention in high-temperature environments. Customers are using Sidense Automotive Grade OTP in a wide range of devices, including power-management ICs, sensors and microcontrollers for applications in automotive, industrial, mobile and consumer devices and systems.

“In April … Read More → "Sidense 1T-OTP NVM Qualified in Second-Generation TSMC 180nm BCD Process"

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