industry news
Subscribe Now

Xilinx Kintex UltraScale FPGAs are First 20nm Devices to Achieve PCI Express Compliance

SAN JOSE, Calif.May 1, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced that its Kintex® UltraScale™ FPGAs are the first 20nm devices to achieve PCI Express® compliance and are now listed on the PCI-SIG® integrator’s list. The Kintex UltraScale FPGAs, with integrated Endpoint blocks for PCI Express enabling high performance applications, passed rigorous electrical, protocol, and interoperability tests at the latest PCI-SIG event held on April 3, 2014.

The UltraScale family supports Gen3 (8 Gb/s) speeds with up to x8 links and up to six integrated PCIe® blocks to enable high throughput applications such as wireline and data center  applications requiring SRIOV with expandable physical and virtual functions. Design engineers can meet the high system bandwidth and programmable system integration needed in a variety of applications with no-cost integrated PCIe blocks.

“Xilinx delivers another industry first milestone with our Kintex UltraScale FPGAs achieving PCI-SIG compliance,” said Ketan Mehta, PCI Express product marketing manager at Xilinx. “With the industry’s most robust tranceivers and Vivado® Design Suite IP Integrator for accelerated integration of hierarchical and third-party blocks, our customers can realize the fastest time to differentiation.”

About 20nm UltraScale Family

Xilinx 20nm UltraScale devices deliver an ASIC-class advantage with the industry’s only ASIC-class programmable architecture coupled with the Vivado ASIC-strength design suite and UltraFast™ design methodology. The UltraScale product portfolio extends Xilinx’s market leading Kintex® and Virtex® FPGA and 3D IC families, based on the UltraScale architecture and TSMC 20nm SoC process. UltraScale devices enable 1.5x to 2x realizable system performance and integration, and consume up to half the power, relative to currently available solutions. These devices deliver next generation routing, ASIC-like clocking, and enhancements to logic and fabric to eliminate interconnect bottlenecks while supporting consistently high device utilization without performance degradation. With footprint compatibility between families, Kintex UltraScale FPGAs provide a clear migration path to Virtex UltraScale devices.

Availability

The Kintex UltraScale devices are sampling today, for more information, visit www.xilinx.com. Designers can learn more about Xilinx’s PCI Express solution, including demonstration videos, targeted reference designs (TRDs), and boards and kits by visiting http://www.xilinx.com/pciexpress.

About Xilinx

Xilinx is the world’s leading provider of All Programmable FPGAs, SoCs and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
9,539 views