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Aeroflex Introduces the 8800 Analog and Digital Radio Test Set

July 28, 2014

WICHITA, KS-July 9, 2014- Aeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), announced today the introduction of the new 8800 Radio Test Set; a high performance, economical radio test system for Analog AM and FM; and Digital P25, DMR, dPMR, NXDN™, and ARIB T98 technologies. The 8800 is equipped with the industry’s largest touch-screen color display, and a new hybrid portable design that provides bench-level test features while maintaining the low weight, ruggedness, and 2.5 hour internal battery required for field testing. With a measurement range of -140 dBm to 500 W, the 8800 is a breakthrough in radio test … Read More → "Aeroflex Introduces the 8800 Analog and Digital Radio Test Set"

ProTek Devices Intros TVS Arrays for Board-Level Circuit Protection in Wireless, Telecom Equipment

July 28, 2014

TEMPE, Ariz. – July 28, 2014 – ProTek Devices has introduced a new family of multi-line low-capacitance (5pF) transient voltage suppressor (TVS) arrays that provide board-level circuit protection in applications including wireless and telecommunications equipment, customer premise equipment (CPE), T1/E1, and more.

The SMP6LLC05-2P – SMP6LLC12-2P series consist of three TVS array components offered with three varying minimum breakdown voltages. The SMP6LLC05-2P has a minimum breakdown voltage of 6.0 volts while the SMP6LLC6.5-2P and SMP6LLC12-2P provide minimum breakdown voltages of 7.2 and 13.3 volts, respectively. These transient voltage suppressors … Read More → "ProTek Devices Intros TVS Arrays for Board-Level Circuit Protection in Wireless, Telecom Equipment"

New 1U MicroTCA Chassis Platform From VadaTech Maximizes Computing Density with Full Redundancy

July 28, 2014

Henderson, NV – July 28, 2014 – VadaTech, a manufacturer of embedded boards and complete application-ready platforms, now offers a 1U MicroTCA chassis platform with several unique design features that allow more slots in a front-to-rear cooled solution while maintaining full redundancy.

The VT840 employs several design concepts to maximize computing density.   Offering front-to-rear cooling and full redundancy takes up slot space.  The VadaTech chassis combines the fan trays and power supplies on the rear of the chassis, allowing 6 AMC slots in the single module size.  VadaTech also provides dual integrated shelf managers on the 1U chassis platform.  The mezzanine approach … Read More → "New 1U MicroTCA Chassis Platform From VadaTech Maximizes Computing Density with Full Redundancy"

STMicroelectronics Opens MEMS Microphone Lab in Taiwan to Enhance Excellence in Audio Performance

July 25, 2014

Taipei, Taiwan, July 25, 2014 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has opened a new MEMS Microphone Lab (Anechoic Chamber) in Taiwan to test and analyze high-performance audio applications built with ST’s MEMS microphones.

ST’s new advanced MEMS Microphone lab will focus on all-level audio performance testing from components (microphone or acoustic components) to modules and systems, including smart phones, tablets, notebooks, TVs, and remote controls, ensuring superior recording and sound quality, shorter debugging period, and faster time to market for end applications.

“ … Read More → "STMicroelectronics Opens MEMS Microphone Lab in Taiwan to Enhance Excellence in Audio Performance"

Ultra-Low Power ‘Whisper’ Architecture Raises the Bar for Connectivity IP in IoT, Wearables and More

July 24, 2014

LONDON, July 24, 2014 (GLOBE NEWSWIRE) — Imagination Technologies (IMG.L) announces the new Ensigma Series4 ‘Whisper’ low-power radio processing unit (RPU) architecture, designed to drive a new generation of wearables, IoT and other connected devices where ultra-low power consumption and low cost points are key.

Tomorrow’s IoT, wearables and other connected embedded devices demand more than the evolution of existing connectivity chipsets; they … Read More → "Ultra-Low Power ‘Whisper’ Architecture Raises the Bar for Connectivity IP in IoT, Wearables and More"

Cadence Introduces Three New OrCAD PCB Products Targeting Emerging Electronic Product Design Challenges

July 24, 2014

San Jose, Calif., July 23, 2014—Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced three new additions to its OrCAD® product line to accelerate the mainstream PCB design process and provide a significant boost to productivity and efficiency. The new OrCAD products include OrCAD Engineering Data Management (EDM), a comprehensive collaboration and management environment for OrCAD Capture; OrCAD Library Builder, a rapid automated part builder; and OrCAD Documentation Editor, an intelligent, automated PCB documentation environment.

OrCAD EDM enables efficient schematic design collaboration and management among engineering teams within the … Read More → "Cadence Introduces Three New OrCAD PCB Products Targeting Emerging Electronic Product Design Challenges"

Cornell University Autonomous Underwater Vehicle Powered by ADLINK’s Express-HL COM Express® Module Attempts Three-peat

July 24, 2014

ADLINK Technology, a leading global provider of cloud-based services, intelligent gateways, and embedded building blocks for edge devices that enable the Internet of Things (IoT), today announced its sponsorship of the Cornell University Autonomous Underwater Vehicle (CUAUV) team’s entry into next week’s 17th Annual International RoboSub competition held at the Space and Naval Warfare Command Research facility in San Diego, CA, from Monday, July 28, through Sunday, August 3.

The CUAUV’s Gemini submarine is powered by ADLINK’s Express-HL COM Express® computer-on-module, featuring a 4th generation quad-core Intel® Core™ i7 processor with Mobile … Read More → "Cornell University Autonomous Underwater Vehicle Powered by ADLINK’s Express-HL COM Express® Module Attempts Three-peat"

Introducing Thread: A New Wireless Networking Protocol for the Home

July 23, 2014

SAN RAMON, Calif. – July 15, 2014 – Recognizing the need for a new and better way to connect products in the home, seven companies today announced that they’ve joined forces to form the Thread Group (www.threadgroup.org) and develop Thread, a new IP-based wireless networking protocol. The charter of the Thread Group is to guide the adoption of the Thread protocol. Thread Group founding members consist of industry-leading companies including Yale Security, Silicon Labs, Samsung Electronics, Nest Labs, Freescale® Semiconductor, Big Ass Fans and ARM.

While currently available 802.15.4 networking technologies have their own advantages, each also has critical … Read More → "Introducing Thread: A New Wireless Networking Protocol for the Home"

Mentor Graphics Launches New Xpedition Data Management Design Solution to Ensure Flow-Wide PCB Data Accuracy, Integrity, and Security for the Enterprise

July 23, 2014

WILSONVILLE, Ore., July 23, 2014 —Mentor Graphics Corporation (NASDAQ: MENT), the market and technology leader in printed circuit board (PCB) design solutions, today announced its next  offering in the new Xpedition® platform, the  Xpedition Data Management (xDM) product suite. The xDM Design product suite provides a flow-wide information hub that manages the PCB design data that is created, reused, imported, or released from the Mentor Graphics® Xpedition Enterprise platform.  As a single, comprehensive data management solution, the xDM Design solution manages design data for work-in-progress designs, and library … Read More → "Mentor Graphics Launches New Xpedition Data Management Design Solution to Ensure Flow-Wide PCB Data Accuracy, Integrity, and Security for the Enterprise"

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