News – Page 1480 – EEJournal

Tiny Footprint, Dual 130mA Low-Dropout Regulator from Diodes Incorporated Targets Fingerprint Recognition Modules

September 2, 2015

Plano, Texas – September 2nd, 2015 – The AP7346 dual low-dropout (LDO) regulator introduced by Diodes Incorporated has been designed to provide the power and I/O supplies for fingerprint recognition modules used in smart phones, tablet computers and similar consumer electronic products. The device’s low quiescent current and high efficiency under light loads minimizes power consumption in these types of portable battery-operated equipment, while a tiny 1.2mm x 1.2mm footprint package with a height of just 0.4mm saves space.

A wide 1.7V to 5.25V input voltage range allows the regulator to operate over a full … Read More → "Tiny Footprint, Dual 130mA Low-Dropout Regulator from Diodes Incorporated Targets Fingerprint Recognition Modules"

STMicroelectronics Keynotes on the Next MEMS Wave at MIG Conference Asia

September 2, 2015

Shanghai, China, September 2, 2015 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, a top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the world’s leading supplier of MEMS for consumer and mobile applications, today announced that Benedetto Vigna, Executive Vice President and General Manager of ST’s Analog, MEMS and Sensors Group, will deliver a keynote at the MEMS Industry Group (MIG) Conference Asia in Shanghai, China.

Held in partnership with the Shanghai Institute of Microsystem and Information Technology (SIMIT) and the Shanghai Industrial Technology Research (SITRI), the four-day event combines … Read More → "STMicroelectronics Keynotes on the Next MEMS Wave at MIG Conference Asia"

World’s First Integrated Thermocouple Electromotive Force to Degrees Celsius Converter From Microchip Saves Design Effort, Space and Cost

September 1, 2015

CHANDLER, Ariz., Aug. 31, 2015 — Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the MCP9600—the world’s first thermocouple-conditioning integrated circuit to combine precision instrumentation, a precision temperature sensor and a precision, high-resolution analog-to-digital converter (ADC), in addition to a math engine preprogrammed with the firmware to support a broad range of standard thermocouple types (K, J, T, N, S, E, B and R). Thermocouples are one of the most ubiquitous temperature-measurement devices, due to their robustness and accuracy in harsh, high-temperature environments, and their ability to measure temperature over an … Read More → "World’s First Integrated Thermocouple Electromotive Force to Degrees Celsius Converter From Microchip Saves Design Effort, Space and Cost"

Synopsys Announces Availability of Logic Library and Embedded Memory IP for Mie Fujitsu Semiconductor 40-nm Low-Power Process

September 1, 2015

Synopsys, Inc. (Nasdaq:SNPS) today announced the availability of DesignWare® Logic Library and Embedded Memory IP for the Mie Fujitsu Semiconductor 40-nanometer low-power (40LP) process. Designers using the Mie Fujitsu Semiconductor 40LP process can integrate DesignWare Logic Library and Embedded Memory IP to optimize the power efficiency and performance of their designs. The IP is made available through Synopsys’ Foundry-Sponsored IP Program, which enables designers to license the DesignWare Logic Library and Embedded Memory IP at no cost.

“The availability of DesignWare Logic Library and Embedded Memory IP on the Mie Fujitsu Semiconductor 40LP process enables our … Read More → "Synopsys Announces Availability of Logic Library and Embedded Memory IP for Mie Fujitsu Semiconductor 40-nm Low-Power Process"

Pre-amplifiers extend digitizers dynamic range and sensitivity

September 1, 2015

Grosshansdorf, Germany – 1 September 2015 – For applications where low-level electronic signals need to be acquired and analyzed, Spectrum has added a range of pre-amplifiers that can be used to boost signal levels. When combined with a Spectrum digitizer these low noise pre-amplifiers can greatly increase the measurement systems overall dynamic range and sensitivity. The new pre-amplifiers are designed to compliment the built-in amplifiers of the digitizer, effectively extending the available input ranges, and allowing the detection and measurement of much smaller signals.

Seven different … Read More →

Plessey wins £6.7m grant for LED production expansion

September 1, 2015

PLYMOUTH, ENGLAND — 1st September 2015 – Plessey announced today that the Regional Growth Fund (RGF) has officially granted £6.7 million towards the expansion of the Plessey LED manufacturing facility in Plymouth, England.

Solid state lighting forms a significant part of global efforts to reduce energy consumption and greenhouse gas emissions. According to a new market research report*, the solid state lighting market size is projected to reach $22.2 billion by 2020, growing at a compounded annual growth rate of 7.31% from 2015 to 2020. The market will be driven … Read More →

High Voltage Boost & Inverting Charge Pumps Deliver Low Noise Dual Outputs with Post-Regulating ±50mA LDOs

August 31, 2015

MILPITAS, CA – August 31, 2015 – Linear Technology Corporation announces the LTC3265, a high voltage, highly integrated, low noise dual output power supply which takes a single positive input supply (VIN_P) and generates low noise bipolar rails up to ±2•VIN_P without any inductors. The device includes a boost doubling charge pump, an inverting charge pump and two low dropout (LDO) regulators. The boost charge pump has a wide 4.5V to 16V input range and powers the positive LDO post regulator from its output, VOUT+. The inverting charge pump has an even … Read More → "High Voltage Boost & Inverting Charge Pumps Deliver Low Noise Dual Outputs with Post-Regulating ±50mA LDOs"

BeSpoon’s Position-tracking System Captures and Displays Real-Time Data to Improve Sports Teams’ Performance

August 31, 2015

LE BOURGET DU LAC, France – Aug. 31, 2015 – BeSpoon SAS today launched BeSpoon Sport Edition, an ultra-precise position-tracking system that allows teams to measure and analyze player movement in three dimensions and provide immediate feedback to improve performance.

Designed for professional and other high-level competitive teams, BeSpoon Sport Edition generates key metrics such as distance run faster than 7km/h, average acceleration and jump height in real time. These next-generation statistics immediately give coaches, players and fans new insight into the action on the field.

BeSpoon’s impulse radio ultra-wideband (IR-UWB) technology, which can track individuals’ or … Read More → "BeSpoon’s Position-tracking System Captures and Displays Real-Time Data to Improve Sports Teams’ Performance"

Synopsys Named a Visionary in Gartner’s Magic Quadrant for Application Security Testing

August 31, 2015

MOUNTAIN VIEW, Calif., Aug. 31, 2015 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), today announced that it has been has been positioned by Gartner, Inc. in the Visionaries quadrant of the 2015 Magic Quadrant for Application Security Testing*. Gartner defines application security testing (AST) as products and services designed to analyze and test applications for security vulnerabilities, ideally using multiple approaches, including static AST (SAST), dynamic AST (DAST), interactive AST (IAST) and mobile AST. The full report can be downloaded Read More → "Synopsys Named a Visionary in Gartner’s Magic Quadrant for Application Security Testing"

Lime Microsystems and ZyXEL Partner to Deliver Open Source Solutions for Next Generation Wireless Mobile Networks

August 31, 2015

Lime Microsystems, the leading supplier of Field Programmable RF Transceiver (FPRF) ICs, and ZyXEL, a global leader in broadband networking technologies, are to collaborate in developing open source implementations for next generation wireless mobile networks.

The collaboration between Lime and ZyXEL is an important milestone in the adoption of open source ideology by major corporations. It is envisaged that this collaboration will lead to a more diverse, creative and cooperative way of developing technology and that this will result in greater interoperability and scalability in the deployment of wireless mobile networks.

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