Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High Temperature Materials for High-Speed Telecommunication Industries and Bendable Electronic Devices
Peapack, NJ, Basel, Switzerland, January 27, 2014 — Novoset, LLC and Lonza are pleased to announce the introduction of PrimasetTM ULL-950 and PrimasetTM HTL-300 ultra-low loss and high temperature thermoset materials for the telecommunication and advanced semiconductor packaging industries. These thermoset resins are based on Cyanate ester (CE) chemistry. PrimasetTM ULL-950 is suitable for high-performance applications such as power amplifiers for 4G LTE and 4G LTE advanced base stations for smartphones, internet infrastructure and high-layer count servers for “cloud computing”. Low dielectric properties coupled with high Glass transition temperature (T … Read More → "Novoset, LLC and Lonza Announce the Introduction of New, Ultra-Low Dielectric Loss and High Temperature Materials for High-Speed Telecommunication Industries and Bendable Electronic Devices"