News – Page 1415 – EEJournal

Pentek Introduces Onyx Virtex-7 Transceiver 3U VPX Rugged Board for Communication and Radar Systems

May 26, 2014

UPPER SADDLE RIVER, NJ–Pentek, Inc., today announced the newest member of its highly popular Onyx® family: the Model 52751, a two-channel, wideband transceiver 3U VPX board, based on the Xilinx Virtex-7 FPGA. The Model 52751 is suitable for connection to HF or IF ports of communication or radar systems. Its built-in data capture and generation features make it an ideal turnkey solution without the need to develop additional FPGA IP.

The Model 52751 includes two 500 MHz 12-bit A/Ds followed by two DDCs, and … Read More → "Pentek Introduces Onyx Virtex-7 Transceiver 3U VPX Rugged Board for Communication and Radar Systems"

Soitec and Simgui announce major partnership to produce 200-mm SOI wafers in China for RF and power semiconductor markets

May 26, 2014

Bernin (Grenoble), France and Shanghai, China, May 26 , 2014 — Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co., Ltd. (Simgui), a Chinese silicon-based semiconductor materials company, have formed an international partnership to address both China’s growing demand and limited worldwide production capacity for 200-mm silicon-on-insulator (SOI) wafers used in fabricating semiconductors for radio-frequency (RF) and power applications. In addition to giving Soitec its first wafer production capability in China, the agreement boosts the industrial manufacturing capacity … Read More → "Soitec and Simgui announce major partnership to produce 200-mm SOI wafers in China for RF and power semiconductor markets"

Xilinx Highlights All Programmable and Smarter Vision Solutions at Embedded Vision Summit West 2014

May 23, 2014

SAN JOSE, Calif., May 22, 2014 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX), will highlight its All Programmable and Smarter Vision solutions at the Embedded Vision Summit West, May 29, 2014 inSanta Clara, CA. Xilinx technology experts will present and demonstrate Xilinx’s capabilities and solutions portfolio for smarter embedded vision systems. Xilinx® All Programmable devices, coupled with Xilinx’s hardware-optimized OpenCV libraries, ASIC-strength Vivado® Design Suite, and SmartCORE™ IP, enable the rapid design and implementation … Read More → "Xilinx Highlights All Programmable and Smarter Vision Solutions at Embedded Vision Summit West 2014"

TI introduces fastest Hercules™ MCUs targeted at developers’ functional safety industrial, medical, automotive and transportation designs

May 23, 2014

Houston, TX (May 22, 2014) – Adding to its portfolio of SafeTI™ design components, today Texas Instruments Incorporated (TI) (NASDAQ: TXN) introduces its latest 32-bit dual-core lockstep Hercules™ RM57Lx and TMS570LCx microcontrollers (MCUs) for developers’ functional safety applications. Unique to the Hercules MCU platform, these two new floating-point devices offer a 50 percent increase in computational performance over any of TI’s current ARM^® Cortex™-R MCUs, allowing system designers to utilize … Read More → "TI introduces fastest Hercules™ MCUs targeted at developers’ functional safety industrial, medical, automotive and transportation designs"

Pentek Introduces GSM Monitoring Receiver for Government, Military and Homeland Security Systems

May 23, 2014

ORLANDO, FL, AUVSI–May 13, 2014–Pentek, Inc., today announced the newest member of its highly popular Cobalt^® family: the Model 52663, the industry’s first full spectrum GSM channelizer 3U VPX module. Using a highly-optimized IP core for the Xilinx Virtex-6 FPGA, the 52663 is ideal for mobile monitoring systems that must capture some or all of the 1100 uplink and downlink signals in both upper and lower GSM bands. This full global system for mobile communications spectrum monitoring targets homeland security, government and military applications.

“Platform developers now have a single, … Read More → "Pentek Introduces GSM Monitoring Receiver for Government, Military and Homeland Security Systems"

Avnet Electronics Marketing Design Expert to Co-Present Workshop Featuring the FinBoard Embedded Vision Starter Kit in Conjunction with the Embedded Vision Summit

May 22, 2014

PHOENIX—May 21, 2014 — Avnet Electronics Marketing, an operating group of Avnet, Inc</ … Read More → "Avnet Electronics Marketing Design Expert to Co-Present Workshop Featuring the FinBoard Embedded Vision Starter Kit in Conjunction with the Embedded Vision Summit"

Digia updates Qt Enterprise Embedded to deliver enhanced development and deployment experience for embedded device creation

May 22, 2014

May 22, 2014 — Digia has released an update to Qt Enterprise Embedded, the fully-integrated solution that enables users to get started immediately with embedded device creation with a tailored user experience ready to address the Internet of Things connected device trend. Today’s release includes the latest Qt 5.3 libraries, Qt WebEngine, Qt Quick Compiler, integration to the Qt Cloud and several other improvements. It contains all the tools needed for fast, easy, fully-integrated embedded device application development and deployment – further increasing developer efficiency, application and device performance, and shortening the development time … Read More → "Digia updates Qt Enterprise Embedded to deliver enhanced development and deployment experience for embedded device creation"

Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning

May 22, 2014

SAN JOSE, Calif., May 21, 2014—Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut down die-package interconnect planning time by reducing iterations between silicon and package design teams. The solution, built on Cadence® OrbitIO™ technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system.

Building on its leadership position for co-design in the implementation stage, Cadence OrbitIO technology is used earlier in the design cycle to provide … Read More → "Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning"

Pulsic Introduces First Complete Automated Layout System for Transistor-Level Analog and Custom-Digital Design: Animate

May 21, 2014

SAN JOSE, CA – May 21, 2014 — Existing approaches to automating analog and custom digital integrated circuit (IC) designs have attempted to improve on portions of the design flow, but have not managed to generate “manual quality” layout without significant user intervention. Pulsic, the premier provider of innovative physical design tools for custom design automation, has drawn on over a decade of experience helping leading-edge customers with physical design challenges to deliver a completely automated solution that overcomes the problem of ‘not-as-good-as-manual’ analog and custom design layout.

Pulsic Animate™ is the first complete automated layout system built ‘from the ground … Read More → "Pulsic Introduces First Complete Automated Layout System for Transistor-Level Analog and Custom-Digital Design: Animate"

ASSET and Synopsys collaborate on proof-of-concept demonstrating an IEEE P1687 IJTAG tools flow

May 21, 2014

Richardson, TX (May 21, 2014) ?ASSET® InterTech (www.asset-intertech.com), the leading supplier of tools for embedded instrumentation, today announced it has collaborated with Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, on a proof-of-concept case study demonstrating the viability of an IJTAG tools ecosystem. Tools are needed to insert and synthesize IEEE P1687 IJTAG embedded instruments into chips and then access those instruments to operate … Read More → "ASSET and Synopsys collaborate on proof-of-concept demonstrating an IEEE P1687 IJTAG tools flow"

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