News – Page 1415 – EEJournal

Exablaze Announces ExaNIC X10, First Network Card to Break Microsecond Barrier for TCP/UDP

February 11, 2016

MELBOURNE, Australia, Feb. 11, 2016 /PRNewswire/ — Exablaze, a leading developer and manufacturer of ultra-low-latency network devices, today publicly announced the release of its next generation ExaNIC X10 network card. The ExaNIC X10 boasts an industry-leading half-round-trip latency of 780 nanoseconds. This is the time measured from the wire to a software application and back to the wire, for raw frames.

Users can accelerate their existing network applications with the provided Exasock software to enable sub-microsecond TCP/UDP performance. Exasock allows standard Linux sockets applications to transparently bypass the kernel resulting in dramatic latency reduction without having to even recompile code. … Read More → "Exablaze Announces ExaNIC X10, First Network Card to Break Microsecond Barrier for TCP/UDP"

New STM32L4 Microcontrollers from STMicroelectronics Extend Choices, Deliver Best Energy Efficiency in ARM® Cortex®-M4 Class

February 11, 2016

Geneva, February 11, 2016 – STMicroelectronics has taken microcontroller power savings and performance to new heights with its latest STM32L4 series devices. The new microcontrollers also introduce peripheral and package configurations that simplify design and increase flexibility.

According to the EEMBC^® ULPBench™ tests for low-power microcontrollers, the new STM32L4 devices achieve 176.70 ULPMark™-CP ^{^[1]}, vaulting over the scores of other major brands, without the help of a buck converter that adds external … Read More → "New STM32L4 Microcontrollers from STMicroelectronics Extend Choices, Deliver Best Energy Efficiency in ARM® Cortex®-M4 Class"

Synopsys’ IC Validator Certified by Samsung Foundry 14-nm Process for Signoff Physical Verification

February 11, 2016

MOUNTAIN VIEW, Calif., Feb. 11, 2016 /PRNewswire/ —

Highlights:

Fully signoff-certified 14-nm runsets are available for DRC, LVS and metal fill
Samsung Foundry-certified runsets include support for In-Design physical verification within Synopsys’ IC Compiler II place-and-route system
Ongoing collaboration targets expanded coverage for leading Samsung Foundry process technologies

Synopsys, Inc. (Nasdaq:SNPS) today announced that Synopsys’ IC Validator physical verification product has been certified by Samsung Foundry for all designs using its 14-nanometer (nm) manufacturing processes, … Read More → "Synopsys’ IC Validator Certified by Samsung Foundry 14-nm Process for Signoff Physical Verification"

Building the Car of the Future Today – Cadence Showcases Automotive Solutions at embedded world 2016

February 10, 2016

FELDKIRCHEN, Germany, 08 Feb 2016 – Under the theme of building the car of the future today, Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it plans to demonstrate its latest solutions for advanced driver assistance systems (ADAS), infotainment, electronic control unit (ECU) design, automotive Ethernet, early software development, and verification and debugging of embedded systems at embedded world Conference 2016 in Nuremberg, Germany. To see demonstrations on how to improve features, performance, efficiency, reliability and safety of future cars, visit http://www.cadence.com/cadence/events/Pages/event.aspx?eventid=1036.

WHEN February 23-25, 2016

WHERE

embedded … Read More → "Building the Car of the Future Today – Cadence Showcases Automotive Solutions at embedded world 2016"

EtherCAT® implementation made easy and cost-efficient with XMC4300 microcontrollers

February 10, 2016

Munich, Germany – February 9, 2016 – EtherCAT® implementation complexity and cost can be reduced with the XMC4300 microcontroller series of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY). Without compromise to EtherCAT communication features, the XMC4300 has been specifically developed for cost-sensitive industrial applications that also make high demands on design flexibility, connectivity and real-time performance. Target applications comprise factory automation, industrial motor control, I/O modules and robotics.The XMC4300builds on the XMC4800 series, which … Read More → "EtherCAT® implementation made easy and cost-efficient with XMC4300 microcontrollers"

Vector Fabrics Slashes Development Time and Cost of Complex Embedded Systems Using Dynamic Analysis

February 10, 2016

Zaltbommel, The Netherlands – February 10, 2016 – Today, Vector Fabrics announced the full release of Pareon Verify, a dynamic analyzer that detects hard-to-find errors that appear only in the execution of an application. Due to their sensitivity to changes in timing and environment, run-time errors tend to be missed by traditional testing and have a greater likelihood of not being found until they cause problems in the field. At this point, however, the error may have resulted in serious injury, loss of life, … Read More → "Vector Fabrics Slashes Development Time and Cost of Complex Embedded Systems Using Dynamic Analysis"

3.3V/5V 20Mbps RS-485 Transceiver Family Provides ±60V Fault Protection for Improved System Reliability

February 10, 2016

Fremont, CA – February 10, 2016 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, introduces a new family of ±60V fault protected RS-485/RS-422 (TIA-485/TIA-422) transceivers able to withstand direct shorts and achieve overvoltage protection with no external components. Designed for improved performance in noisy industrial environments and increased tolerance to system faults, these transceivers simplify design in building automation, HVAC networks, energy metering, process control and other industrial automation applications.

At initial … Read More → "3.3V/5V 20Mbps RS-485 Transceiver Family Provides ±60V Fault Protection for Improved System Reliability"

RUTRONIK SMART: New low power Bluetooth module from Panasonic for IoT applications

February 10, 2016

Cleveland / Ispringen (Germany), February 10, 2016 – The new PAN1760 Series Bluetooth Smart module v4.1 with integrated antenna and embedded GATT profile is a cost-effective, low-power, true system-on-chip (SoC) solution. This nanopower module for the Internet of Things, launched by Panasonic Automotive & Industrial Systems, is available at distributor Rutronik.

The PAN1760 module is suitable for low energy Bluetooth applications such as data transfer to smartphones and tablets, wireless health monitoring, smart home, general industry, and portable applications without host … Read More → "RUTRONIK SMART: New low power Bluetooth module from Panasonic for IoT applications"

Orbotech Collaborates with Nippon Mektron to Optimize Digital Flexible Printed Circuit Board Manufacturing

February 10, 2016

YAVNE, Israel, February 10, 2016 ? ORBOTECH LTD. (NASDAQ: ORBK) today announced that, Nippon Mektron Mektec, the world’s most dominant maker of flexible printed circuit boards (FPCBs), is deploying Orbotech direct imaging (DI) and automated optical inspection (AOI) systems in multiple factories. These systems will significantly improve current and future smartphone manufacturing by facilitating the creation of flex inspections and high-throughput production capability.

< … Read More →

Open Interconnect Consortium Helps Developers Tackle Internet of Things with New Developer Toolkit

February 10, 2016

February 10, 2016. Portland, Oregon – Today, the Open Interconnect Consortium (OIC) announced the availability of an important update for developers that will help organizations swiftly navigate the OIC’s resources to quickly take advantage of the technologies and infrastructure developed, furthering standardization for the Internet of Things (IoT).

“IoT puts a lot of pressure on developers to create applications that work seamlessly. IoT technologies can be tricky and difficult to implement in a real world use case,” said Mike Richmond, executive director at the Open Interconnect Consortium. “With this updated developer … Read More → "Open Interconnect Consortium Helps Developers Tackle Internet of Things with New Developer Toolkit"

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