industry news
Subscribe Now

Open Interconnect Consortium Helps Developers Tackle Internet of Things with New Developer Toolkit

February 10, 2016. Portland, Oregon – Today, the Open Interconnect Consortium (OIC) announced the availability of an important update for developers that will help organizations swiftly navigate the OIC’s resources to quickly take advantage of the technologies and infrastructure developed, furthering standardization for the Internet of Things (IoT).

“IoT puts a lot of pressure on developers to create applications that work seamlessly. IoT technologies can be tricky and difficult to implement in a real world use case,” said Mike Richmond, executive director at the Open Interconnect Consortium. “With this updated developer toolkit, the OIC is making the process significantly easier. As we continue to streamline specification development for the next generation of IoT-connected devices, this is an important step.”

The updated developer tool offering includes oneIoTa – a new resource model tool that allows developers to quickly download OIC resource models to use in their own product development; it contains both OIC and UPnP Forum resource models in both JSON and RAML formats.

Released along with oneIoTa is the API Designer console, a graphical, web based tool from MuleSoft that syncs with oneIoTa to document the APIs in a human friendly interactive console and make it easy to engage fellow application developers.

Both tools join the latest version of IoTivity, OIC’s reference implementation. The combined tools are a quick way for companies to gain the benefits of OIC’s common connectivity framework and are easily implemented into products.

The OIC is also excited to announce it has now reached 158 members, including two new board members from Arris and CableLabs, who will join executives from leading technology companies including Samsung, Intel, GE Digital and Cisco. 

If you’re interested in seeing the IoTivity code in action, OIC will be hosting several demonstrations with products from the smart home and industrial vertical markets; and UPnP to IoTivity.  In addition, we will be showing demonstrations with our liaison partners including EEBus, the EnOcean Alliance and the ULE Alliance. Be sure to stop and see us during Mobile World Congress at booth Hall 8.0 stand8.0C35.

About Open Interconnect Consortium

Open Interconnect Consortium (OIC) is a standard and open source project that delivers “just-works” interconnectivity for developers, manufacturers and end users.  OIC was formed by leading technology companies with a goal of defining the connectivity requirements and ensuring interoperability of the billions of devices that make up the emerging Internet of Things (IoT), across multiple operating systems and network protocols.  With over 150 members and the recent asset transfer from UPnP, OIC continues to strive to deliver products working together using OIC standards and running IoTivity open source software. For more information please visithttp://openinterconnect.org and https://www.iotivity.org/

 

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Enabling the Evolution of E-mobility for Your Applications
The next generation of electric vehicles, including trucks, buses, construction and recreational vehicles will need connectivity solutions that are modular, scalable, high performance, and can operate in harsh environments. In this episode of Chalk Talk, Amelia Dalton and Daniel Domke from TE Connectivity examine design considerations for next generation e-mobility applications and the benefits that TE Connectivity’s PowerTube HVP-HD Connector Series bring to these designs.
Feb 28, 2024
7,953 views