News – Page 1332 – EEJournal

Zuken Plays Key Role in Innovation Award Win for Electric Vehicle Research Collaboration

December 19, 2014

19 December 2014 – Munich, Germany and Westford, MA, USA – Zuken is pleased to announce that the electric vehicle research project in which they are a partner – EM4EM (ElectroMagnetic Reliability and Electronic Systems for Electro Mobility) – has won a European innovation award.

The project was presented with the CATRENE Innovation Award for “Most Innovative Project in 2014” at the Read More → "Zuken Plays Key Role in Innovation Award Win for Electric Vehicle Research Collaboration"

Real Intent Joins IEEE P2415™ Unified Hardware Abstraction and Layer Working Group

December 18, 2014

SUNNYVALE, Calif. – December 16, 2014 – Real Intent, Inc., whose RTL verification solutions accelerate electronic design sign-off, eliminate complex failures in SoCs, and lead the market in performance, capacity, accuracy and completeness, today announced it has joined the IEEE P2415™ Unified Hardware Abstraction and Layer working group.

The proposed IEEE P2415 “Standard Project for Unified Hardware Abstraction and Layer for Energy Proportional Electronic Systems” is intended to define the syntax and semantics for energy-oriented descriptions of hardware, software and … Read More → "Real Intent Joins IEEE P2415™ Unified Hardware Abstraction and Layer Working Group"

Cypress Introduces Industry’s Smallest USB 3.0 Hub Controller

December 18, 2014

SAN JOSE, Calif., December 17, 2014 – Cypress Semiconductor Corp. (NASDAQ: CY) today announced a small package option for its EZ-USB^® HX3™ USB 3.0 hub controller. The 6 mm x 6 mm ball grid array (BGA) package saves board space for Ultrabook™ devices, tablets, portable port replicators, and other mobile and consumer devices, adding to the HX3 controller’s best-in-class feature set that includes robust interoperability, extensive charging support and full configurability.

The versatile EZ-USB HX3 USB 3.0 hub controller offers full configurability via I²C EEPROM, I² … Read More → "Cypress Introduces Industry’s Smallest USB 3.0 Hub Controller"

Microchip Announces Qobuz Connect Support in JukeBlox® Platform

December 18, 2014

CHANDLER, Ariz., Dec. 17, 2014 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the support of Qobuz Connect in the Microchip JukeBlox® Platform. The combined solution delivers HD and true CD quality audio directly to wireless speakers and AV receivers for an enjoyable music listening experience.

The key benefit of Qobuz Connect is that once a track has been selected, the audio stream is delivered directly from Qobuz’s cloud servers … Read More → "Microchip Announces Qobuz Connect Support in JukeBlox® Platform"

Nordic Semiconductor IPv6 over Bluetooth Smart protocol stack for nRF51 Series SoCs enables small, low cost, ultra-low power Internet of Things applications

December 18, 2014

Now available for download, the nRF51 IoT Software Development Kit (SDK) is a complete IPv6-ready Internet Protocol Suite for Nordic’s market-leading nRF51 Series Bluetooth Smart SoCs. The SDK enables native and interoperable IP-based connectivity between a Bluetooth Smart ‘thing’ and a cloud service. It also enables Bluetooth Smart to be used in large, distributed, cloud-connected, heterogeneous networks such as home, industrial, and enterprise automation

Oslo, Norway – December 18, 2014 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces the launch of … Read More → "Nordic Semiconductor IPv6 over Bluetooth Smart protocol stack for nRF51 Series SoCs enables small, low cost, ultra-low power Internet of Things applications"

Allegro MicroSystems, LLC Announces New Sensorless BLDC Controller

December 18, 2014

Worcester, MA – December 17, 2014 – Allegro MicroSystems, LLC announces a new three-phase, sensorless, brushless DC (BLDC) motor controller for use with external complementary P-channel and N-channel power MOSFETs. Reliable sensorless startup and run commutation can quickly be customized for individual motors and loads with adjustment of a few simple default parameters saving considerable design time. The A4963 fits a wide range of applications since … Read More → "Allegro MicroSystems, LLC Announces New Sensorless BLDC Controller"

LED Driver from Diodes Offers High E-Transformer Compatibility in Non-Dimmable MR16 Lamp Design

December 18, 2014

Plano, Texas – December 18th, 2014 – The AL8820 LED driver converter from Diodes Incorporated is a compact, two-stage, boost/buck non-dimmable MR16 lamp design solution, that is simultaneously characterized by high power factor, low total harmonic distortion (THD) and low-output current ripple. For example, in a 6W MR16 application, the device operates flicker-free with most common LED lighting transformers at a power factor of 0.9 and THD of 30%.

Combining two DC-DC regulators in the 5mm x 6mm SO-8EP package, the AL8820 operates in continuous-current … Read More → "LED Driver from Diodes Offers High E-Transformer Compatibility in Non-Dimmable MR16 Lamp Design"

Imec Presents Ultralow Power RFID Transponder Chip in Thin-Film Transistor Technology on Plastic at IEDM 2014

December 18, 2014

IEEE International Electron Devices Meeting (IEDM) 2014 (San Francisco)—Dec. 17, 2014 — At this week’s IEDM 2014, held in San Francisco, California, nanoelectronics research center imec demonstrated an ultra-low power RFID transponder chip. Operating at sub 1V voltage and realized in thin-film transistor technology (TFTs) on plastic film, the chip paves the way for universal sensing applications, such as item level RFID tagging, body area networks (BAN) and environmental monitoring, that require prolonged remote autonomy, and ultimate thinness, flexibility and robustness.

One of the major drivers of the semiconductor industry is the Internet of Things (IoT). Market … Read More → "Imec Presents Ultralow Power RFID Transponder Chip in Thin-Film Transistor Technology on Plastic at IEDM 2014"

Econais Rolls Out New WiSmart EC19W01 Wi-Fi Software, Modules and Development Kits

December 18, 2014

SAN JOSE, Calif., Dec 18, 2014 — Econais Inc. (www.econais.com), the technology leader in smart Wi-Fi module solutions for the Internet of Things, today announced large-scale availability of the newest EC19W01 WiSmart software, modules and development kits.

The newest EC19W01 802.11b/g/n Wi-Fi modules offer lower power drain (12.33uA) and feature a fully integrated 32 bit MCU, Wi-Fi, cloud connectivity, flash memory and antenna certified for FCC, EC, IC, and RoHS/REACH.

For ease of use and configuration, the EC19W01 modules now support Apple … Read More → "Econais Rolls Out New WiSmart EC19W01 Wi-Fi Software, Modules and Development Kits"

Spansion and Sensoplex Launch High-Performance, Low-Power Wearable Development Platform

December 17, 2014

SUNNYVALE, Calif., Dec. 16, 2014 /PRNewswire/ — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions and Sensoplex, a world leader in the design and production of high performance wearable devices for sports, fitness, wellness and mHealth companies, today announced a partnership to jointly develop and market an evaluation and development kit platform (EVK and SDK) that will allow customers to quickly develop innovative wearable applications that can combine inertial, bio and environmental sensors, Bluetooth Low Energy (BLE), and ANT+[1] wireless protocols with ultra low-power processing. The companies will … Read More → "Spansion and Sensoplex Launch High-Performance, Low-Power Wearable Development Platform"

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