News – Page 1331 – EEJournal

New Microchip GestIC® Controller Enables One-step Design-in of 3D Gesture Recognition in Embedded Devices

January 20, 2015

CHANDLER, Ariz., Jan. 20, 2015 [NASDAQ: MCHP] — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced the second member of its award-winning and patented GestIC^® family. The new MGC3030 3D gesture controller features simplified user-interface options focused on gesture detection, enabling true one-step design-in of 3D gesture recognition in consumer and embedded devices. Housed in an easy-to-manufacture SSOP28 package, the MGC3030 expands the use of highly sought after 3D gesture … Read More → "New Microchip GestIC® Controller Enables One-step Design-in of 3D Gesture Recognition in Embedded Devices"

Flexible FPGA Chip with Integrated AFDX Protocol Available from MEN Micro

January 20, 2015

BLUE BELL, Pa. January 2015 – MEN Micro Inc., a world-renowned provider of embedded computing and I/O solutions for mission-critical industrial, mobile and harsh environment applications, has released the CS1, anFPGA chip with an integrated AFDX protocol that provides a flexible alternative for communication in airplanes.

The customizable CS1 enables users to build AFDX-based communication systems independent of a form factor. The new FPGA can be installed directly on the boards of an AFDX end system. This eliminates the need of an additional module to integrate the AFDX protocols, which send information between avionics subsystems in airborne applications. </ … Read More → "Flexible FPGA Chip with Integrated AFDX Protocol Available from MEN Micro"

Telesoft Technologies Selects Achronix Speedster22i FPGAs for Dual 100GbE MPAC6200

January 20, 2015

Santa Clara, Calif., Jan 20, 2015 – Achronix Semiconductor Corporation today announced that Telesoft Technologies has selected Achronix Speedster22i HD1000 FPGAs for the MPAC6200, industry’s first dual 100GbE PCIe card for cyber security, monitoring and analytics.

Based on Intel’s 22nm Tri-Gate technology, Speedster22i devices contain a wide range of embedded hard IP including 100G Ethernet, Interlaken, PCI Express Gen3 with integrated DMA engine and DDR3. This range of hard IP, combined with industry-leading density and cost, enables significant advantages in 100G optical networking applications. The combination of robust, hardened IP together with 86 Mbits of on-chip memory, … Read More → "Telesoft Technologies Selects Achronix Speedster22i FPGAs for Dual 100GbE MPAC6200"

Embedded Virtual Prototype Kits Offer Unified HW-SW Debug and Analysis

January 20, 2015

WILSONVILLE, Ore., January 20, 2015 —Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of Mentor® Embedded Virtual Prototype Kits (VPKs) in the Mentor Graphics® Vista™ and Sourcery™ CodeBench Virtual Edition products. This enables embedded developers to integrate, execute, validate and optimize software on various platforms. This solution is ideal for automotive in-vehicle infotainment (IVI), electronic control unit (ECU) networks, medical and industrial, networking, and military and aerospace product development.

Software debug and analysis, particularly for multicore heterogeneous systems, requires understanding complex hardware and … Read More → "Embedded Virtual Prototype Kits Offer Unified HW-SW Debug and Analysis"

Avnet Joins OpenPOWER Foundation

January 19, 2015

PHOENIX—January 15, 2015—Avnet, Inc. (NYSE: AVT), a leading global technology distributor, … Read More → "Avnet Joins OpenPOWER Foundation"

STARCHIP® Announces Its Third Generation of SIM Controllers

January 19, 2015

StarChip®, experts in designing, qualifying and industrializing Smart Card integrated circuits (IC), today announced the addition of a new generation of controllers intended for SIM/USIM/M2M applications. The SCFXXXI series is the third generation of StarChip controllers optimized through enhanced design features providing tremendous cost-savings. These devices bring the best power, cost, and performance trade-off to the Telecom market. The SCF400I, the first member of the SCFXXXI, is designed to aggressively tackle 3G Java applications that require more powerful, cost-effective and energy-efficient chips. It will be followed by many other devices, under qualification or development, which … Read More → "STARCHIP® Announces Its Third Generation of SIM Controllers"

Ambiq Micro’s Apollo microcontrollers redefine ‘low power’ with up to 10x reduction in energy consumption

January 19, 2015

Austin, TX (19 January 2015) Ambiq Micro, a leader in ultra-low power integrated circuits, today announced the Apollo family of four 32-bit ARM® Cortex-M4F microcontrollers (MCUs). In real-world applications, their energy consumption is typically 5 to 10 times lower than that of MCUs of comparable performance, resulting in far longer battery life in wearable electronics and other battery-powered applications. The dramatic reduction in energy consumption is achieved using Ambiq’s patented Subthreshold Power Optimized Technology (SPOT) platform.

Wearable devices that might otherwise run for days … Read More → "Ambiq Micro’s Apollo microcontrollers redefine ‘low power’ with up to 10x reduction in energy consumption"

TI’s NexFET™ N-channel power MOSFETs achieve industry’s lowest resistance

January 19, 2015

DALLAS (January 19, 2015) – Texas Instruments (TI) (NASDAQ: TXN) today introduced 11 new N-channel power MOSFETs to its NexFET™ product line, including the 25-V CSD16570Q5B and 30-V CSD17570Q5B for hot swap and ORing applications with the industry’s lowest on-resistance (Rdson) in a QFN package. In addition, TI’s new 12-V FemtoFET™ CSD13383F4 for low-voltage battery-powered applications achieves the lowest resistance at 84-percent below competitive devices in a tiny 0.6 mm by 1 mm package. For more information, samples or a reference design, visit Read More → "TI’s NexFET™ N-channel power MOSFETs achieve industry’s lowest resistance"

Aldec Delivers Unprecedented Scalability and Verification Acceleration with the Latest Release of HES-DVM™

January 19, 2015

Henderson, NV – January 15, 2015 – Aldec, Inc. delivers new functionality to existing hardware resources and enables unprecedented scalability with the latest release of its hardware emulation solution software, HES-DVM™ 2014.12. The unique emulation solution, which can be used with in-house developed boards or off-the-shelf solutions such as HES-7™SoC and ASIC prototyping boards, offers a higher speed of emulation and ease of use via System Verilog DPI interface that enables scalability and acceleration of verification process for modern SoC projects.

HES-DVM delivers significant improvements to SCE-MI Function Based emulation flows. Users can now enable hardware emulation into their OVM/UVM … Read More → "Aldec Delivers Unprecedented Scalability and Verification Acceleration with the Latest Release of HES-DVM™"

SmarTune™ RF MEMS Tuners Surpass 100 Billion Cycles Lifetime Testing

January 16, 2015

San Jose, Calif. – January 14, 2015 – Cavendish Kinetics, the leader in high-performance RF MEMS tuning solutions for mobile and wearable devices, today announced that the company’s SmarTune™ RF MEMS tuners have surpassed 100 billion cycle lifetime testing, without a single part failure.

“Passing 100 Billion cycle lifetime testing has proven that our RF MEMS SmarTune products have the reliability required for large-scale adoption,” said Lars Johnsson, Vice President Product Marketing, Cavendish Kinetics. “The commercial launch of the nubia Z7 LTE Smartphone for China Mobile in October has highlighted our accomplishments in 2014, and we’ … Read More → "SmarTune™ RF MEMS Tuners Surpass 100 Billion Cycles Lifetime Testing"

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