News – Page 1191 – EEJournal

Silicon Labs Collaborates with Microsoft to Accelerate Internet of Things Solutions — Verified Hardware and Software Enhance Interoperability and Allow Faster Time to Production

September 6, 2017

AUSTIN, Texas – Sept. 5, 2017 – Silicon Labs (NASDAQ: SLAB) today announced that it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services. Microsoft Azure Certified for IoT allows businesses to reach customers where they are, working with an ecosystem of devices and platforms, allowing faster time to production.

Silicon Labs is a leading provider of silicon, software and cloud-based solutions for the IoT, with more than 20 years of expertise in delivering connectivity … Read More → "Silicon Labs Collaborates with Microsoft to Accelerate Internet of Things Solutions — Verified Hardware and Software Enhance Interoperability and Allow Faster Time to Production"

Synopsys Experts, Customers and Partners to Present the Latest Trends and Technologies in Embedded Processor Solutions

ARC Processor Summit Attendees Will Learn about Solutions to Address Design Challenges in IoT Security, Automotive Safety and Embedded Vision Applications

September 6, 2017

MOUNTAIN VIEW, Calif., Sept. 6, 2017 /PRNewswire/ —

WHEN: Tuesday, September 26 from 8:30 a.m. to 7:00 p.m.

WHERE: Santa Clara Marriott, 2700 Mission College Boulevard, Santa Clara, CA

REGISTER: Read More → "Synopsys Experts, Customers and Partners to Present the Latest Trends and Technologies in Embedded Processor Solutions"

58VIN, 24W, Inverting µModule Regulator Is EN55022 Class B Compliant

September 6, 2017

MILPITAS, CA & NORWOOD, MA – September 6, 2017 – Analog Devices, Inc., which recently acquired Linear Technology Corporation, announces the LTM4651, a nonisolated inverting output µModule® regulator that can generate –26.5V to –0.5V output from a positive input supply voltage. The LTM4651 operates over a 3.6V to 58V input voltage range and is housed in a 15mm x 9mm x 5.01mm BGA package, a compact solution, providing –5VOUT, –12VOUT, –15VOUT and –24VOUT from industrial standard 5VIN, 12VIN or 24VIN supplies. The LTM4651 is designed to meet the EN55022 Class B EMC standard for Information Technology Equipment. The combination of a wide voltage range … Read More → "58VIN, 24W, Inverting µModule Regulator Is EN55022 Class B Compliant"

Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects

September 6, 2017

Geneva, September 6, 2017 – To help product innovators streamline prototyping and development of connected smart objects, STMicroelectronics has created the SPBTLE-1S ready-to-use Bluetooth^® Low Energy (BLE) module that integrates all the components needed to … Read More → "Qualified Bluetooth® Low Energy Application Processor Module from STMicroelectronics Accelerates Time-to-Market for Connected Smart Objects"

Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications

Ultra-high Resolution Pressure Sensing Uses Matrices of Vertical Piezoelectric Nanowire To Reconstruct the Smallest Features of Human Fingerprints

September 5, 2017

GRENOBLE, France – Sept. 5, 2017 – Leti today announced that the European R&D project known as PiezoMAT has developed a pressure-based fingerprint sensor that enables resolution more than twice as high as currently required by the U.S. Federal Bureau of Investigation (FBI).

The project’s proof of concept demonstrates that a matrix of interconnected piezoelectric zinc-oxide (ZnO) nanowires grown on silicon can reconstruct the smallest features of human fingerprints at 1,000 dots per inch (DPI).

“The pressure-based fingerprint sensor derived from the integration of piezo-electric ZnO nanowires grown on silicon opens the path to ultra-high resolution … Read More → "Leti and Partners in PiezoMAT Project Develop New Fingerprint Technology for Highly Reliable Security and ID Applications"

Flex Logix Joins TSMC IP Alliance Program

September 5, 2017

Mountain View, Calif., September 5, 2017 – Flex Logixä Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC’s Open Innovation Platform®.

Flex Logix has worked closely with TSMC since Flex Logix was founded in 2014 and now has its EFLXÒ Embedded FPGA IP and software tools available for … Read More → "Flex Logix Joins TSMC IP Alliance Program"

Samsung SARC Selects Synopsys as Primary Verification Solution for Advanced Mobile Processor Designs

Comprehensive Synopsys Platform Enables Accelerated Verification of High-Performance, Low-Power CPU, GPU and System IP for Mobile SoCs

September 5, 2017

MOUNTAIN VIEW, Calif., Sept. 5, 2017 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS) today announced that Samsung SARC has selected the Synopsys Verification Continuum™ platform as its primary verification solution for their high-performance, low-power CPU, GPU and system IP designs. Samsung SARC has deployed the Verification Continuum platform for emulation, simulation, verification IP, debug, static … Read More → "Samsung SARC Selects Synopsys as Primary Verification Solution for Advanced Mobile Processor Designs"

IAR Systems joins STMicroelectronics Partner Program to further accelerate customer time-to-market

Continues to bring leading compiler and debugger technology to ST’s products, technologies, and solutions

September 5, 2017

Uppsala, Sweden—September 5, 2017—IAR Systems®, the future-proof supplier of software tools and services for embedded development, announces that it has joined the STMicroelectronics Partner Program to enable accelerated product development and continued innovation for embedded developers worldwide. IAR Systems is also exhibiting at the ST Developers Conference, September 6 in Santa Clara, CA, United States.

STMicroelectronics (ST), a global semiconductor leader serving customers across the spectrum of electronics applications, has created the ST Partner Program to … Read More → "IAR Systems joins STMicroelectronics Partner Program to further accelerate customer time-to-market"

LETI Launches Emulator Service to Boost ROI and Speed Time to Market for European Chipmakers

Anchored by Mentor Veloce Emulator Machine, Leti’s Offer Includes Support for Design, Debug and Analysis of Results

September 5, 2017

GRENOBLE, France – Aug. 31, 2017 – Leti, a technology research institute of CEA Tech, and Mentor®, a Siemens business,, today announced Leti will provide access to the Mentor Veloce® emulator to SMEs and startups and will introduce emulation technology to global companies beginning Q3 2017.The Veloce emulator is Mentor’s high-capacity, high-speed, multi-application tool for emulation of system-on chip (SoC) designs that was installed at Leti in 2013.

Emulation is a vital process for more efficient development of complex digital circuits that includes debugging the design at early stages and validating the upstream, onboard software operation.

STMicroelectronics Cooperating with MediaTek to Integrate Industry-Leading NFC Technology into Mobile-Platform Designs

September 5, 2017

Collaboration delivers complete mobile payment platform
Independent solutions provide secure sourcing for OEMs and include an NFC controller with an optional embedded Secure Element

Geneva, September 5, 2017 — STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the integration of its contactless NFC technology with MediaTek’s mobile platforms. This creates a complete solution for handset developers to design next-generation smartphones capable of supporting tightly integrated NFC mobile services.

Mobile payments are expected to see triple-digit growth in the coming years^[1], with contactless … Read More → "STMicroelectronics Cooperating with MediaTek to Integrate Industry-Leading NFC Technology into Mobile-Platform Designs"

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