industry news
Subscribe Now

Flex Logix Joins TSMC IP Alliance Program

Mountain View, Calif., September 5, 2017 – Flex Logixä Technologies, Inc., the leading supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC’s Open Innovation Platform®.

Flex Logix has worked closely with TSMC since Flex Logix was founded in 2014 and now has its EFLXÒ Embedded FPGA IP and software tools available for TSMC 16FFC/FF+, TSMC 28HPM/HPC and TSMC 40ULP/LP. For each EFLX IP core in each process, Flex Logix has designed, fabricated and validated a validation chip to demonstrate full-speed, high utilization performance and power specs over the full temperature and voltage operating ranges. Flex Logix has worked with TSMC to ensure its documentation, design methodology, validation chip architecture and testing all meet TSMC’s rigorous standards to become an IP Alliance Member.

EFLX embedded FPGA arrays are available on these TSMC processes in a wide range of sizes from 100 LUTs to >100,000 LUTs with options for DSP/MAC and any type/size RAM. Flex Logix will implement EFLX embedded FPGA on any additional TSMC process node as TSMC customers request. Over time, Flex Logix expects EFLX to be available on every node from 180nm to 7nm.

“Flex Logix offers high density, high performance, scalable embedded FPGA,” said Suk Lee, TSMC Senior Director, Design Infrastructure Marketing Division. “We see good customer activity and interest in this emerging Semiconductor IP category and are pleased to have Flex Logix as an IP Alliance Member.”

Embedded FPGA is a new type of semiconductor IP enabling high-volume chip designers to incorporate reconfigurable logic to allow chips to be updated even in-system to adapt to new standards, new protocols, new algorithms and to customize chips for customers faster and more cost effectively than mask changes. Applications for embedded FPGA exist for networking, wireless base station, data center, deep learning, microcontroller, IoT, aerospace/defense and a range of other markets.

“We are proud to be joining the TSMC IP Alliance and appreciate TSMC’s support in helping us achieve membership,” said Geoff Tate, CEO of Flex Logix. “Our customers are in fab, in design, and in evaluation of EFLX embedded FPGA for a wide range of applications and our IP Alliance membership will enable us to support them even better going forward.”

 

About Flex Logix

Flex Logix, founded in March 2014, provides solutions for reconfigurable RTL in chip and system designs using embedded FPGA IP cores and software. The company’s technology platform delivers significant customer benefits by dramatically reducing design and manufacturing risks, accelerating technology roadmaps, and bringing greater flexibility to customers’ hardware. Flex Logix has raised more than $12 million of venture capital. It is headquartered in Mountain View, California and has sales rep offices in China, Europe, Israel, Japan, Taiwan and Texas. More information can be obtained at http://www.flex-logix.com or follow on Twitter at @efpga.

Leave a Reply

featured blogs
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Autonomous Robotics Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
Connectivity solutions for autonomous robotic applications need to include a variety of orientations, stack heights, and contact systems. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec explore trends in autonomous robotic connectivity solutions and the benefits that Samtec interconnect solutions bring to these applications.
Jan 22, 2024
14,036 views