News – Page 1079 – EEJournal

Sensera’s MEMS Mimic Human Organs Through Bioengineering

June 5, 2018

Woburn, MA, June 4, 2018 – Sensera Inc., a leading provider of MEMS devices, isadapting its technology for new applications in bioengineering. The company’s MEMS, or MicroElectroMechanical Systems, technology is now being used at Harvard University in the creation of microfluidic devices, which mimic the functions of living human organs, including the lung, intestine, kidney, skin, bone marrow and blood-brain barrier.

“Sensera is a … Read More → "Sensera’s MEMS Mimic Human Organs Through Bioengineering"

Automotive CoolSiC™ Schottky diodes: combining performance and robustness

June 4, 2018

Munich, Germany – 4 June 2018 – At this year’s PCIM Europe trade fair in Nuremberg (June 5 to June 7) Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) presents the first products of its automotive Silicon Carbide portfolio: the CoolSiC™ Schottky diode family is now ready for current and future on-board charger (OBC) applications in hybrid and electric vehicles. Infineon has designed the diodes specifically to meet the high requirements of the automotive industry regarding reliability, quality and … Read More → "Automotive CoolSiC™ Schottky diodes: combining performance and robustness"

Three new Class-D amplifiers solve smart-home audio design challenges

TI provides premium sound and integrated protection for smart speakers and sound bars

June 4, 2018

DALLAS (June 4, 2018) – Texas Instruments (TI) (NASDAQ:TXN) today introduced three new digital-input Class-D audio amplifiers that enable engineers to deliver high-resolution audio in more smart-home and voice-enabled applications. By combining first-of-its-kind integration, real-time protection and new modulation schemes, TI’s new audio devices allow designers to reduce board space and overall bill of material (BOM) cost. These new amplifiers are designed for personal electronics applications with any power level, including smart speakers, sound bars, TVs, notebooks, projectors and Internet-of-Things (IoT) applications. For more information, see Read More → "Three new Class-D amplifiers solve smart-home audio design challenges"

Vishay’s New High Current Planar Choke Inductor Delivers Same Performance as Wirewounds in Fraction of Space

Highly Customizable IPLA 32 Targets Automotive and Embedded High Current, High Power Density DC/DC Converters

June 4, 2018

MALVERN, Pa. — June 4, 2018 — A new high current planar choke inductor that offers the same performance as wirewound devices in a fraction of the space was announced today by Vishay Intertechnology, Inc. (NYSE: VSH). The new IPLA 32 measures just 31 mm by 43 mm by 22.2 mm but is rated for currents up to 110 A, allowing high power density DC/DC converters to occupy a significantly smaller footprint.

With a recommended frequency range of 100 kHz to 800 kHz, the IPLA 32 will enable more compact and lightweight DC/DC circuitry in electric and hybrid cars, off-road vehicles including forklifts, and all manner of … Read More → "Vishay’s New High Current Planar Choke Inductor Delivers Same Performance as Wirewounds in Fraction of Space"

STMicroelectronics’ NFC Technology Chosen to Distinguish TCL Communication’s Alcatel 3V Smartphone through Outstanding Contactless User Experience

June 4, 2018

ST’s integrated NFC controller certified to GSMA, EMVCo and NFC Forum standards minimizes time to market

v ST and TCL Communication intend to cooperate on digital security for next-generation TCL Communication products

Geneva, June 4, 2018 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has revealed its Near-Field Communication (NFC) technology is powering the contactless features of TCL Communication’s newly launched Alcatel 3V smartphone for the European market^[1].

Prioritizing enhanced user experience and convenience through Alcatel 3 … Read More → "STMicroelectronics’ NFC Technology Chosen to Distinguish TCL Communication’s Alcatel 3V Smartphone through Outstanding Contactless User Experience"

Si2 Launches Effort to Standardize New IC Design Language

OPAL Offers New Approach to Rapidly Finding, Eliminating Design Flaws

June 1, 2018

AUSTIN–Silicon Integration Initiative Inc. (Si2), a research and development joint venture providing standard interoperability solutions for IC design tools, has launched a working group to standardize a new, formal declarative language that greatly simplifies finding and correcting design flaws in complex, leading-edge chip designs early in a design flow.

Named OPAL (Open Pattern Analysis for Layout), the new language has the potential to cut manufacturing costs by identifying and correcting yield-detracting patterns too complex and ambiguous to describe using conventional, design-rule checking technologies.

Jerry Frenkil, the Si2 program director of OpenStandards, said that existing … Read More → "Si2 Launches Effort to Standardize New IC Design Language"

Increase System Performance in Closed-loop Control Applications with New PIC® and AVR® MCUs

Create more efficient systems with Core Independent Peripherals

June 1, 2018

CHANDLER, Ariz., May 31, 2018 — From pool pumps to air handling units, closed-loop control is one of the most fundamental tasks performed by embedded systems. Advancements in the architecture of PIC^® and AVR^® 8-bit microcontrollers (MCUs) have optimized the devices for implementing closed-loop control, enabling systems to offload the Central Processing Unit (CPU) to manage more tasks and save power. To help designers maximize performance and efficiency in these systems, Microchip Technology Inc. (NASDAQ: MCHP) has introduced the new PIC18 Q10 and ATtiny1607 families, featuring multiple intelligent Core Independent Peripherals (CIPs) that simplify development and … Read More → "Increase System Performance in Closed-loop Control Applications with New PIC® and AVR® MCUs"

IAR Systems simplifies development of event-driven embedded systems with updated design and code generation tool

Version 9.1 of IAR Visual State speeds up time to market and increases team efficiency

June 1, 2018

Uppsala, Sweden—May 30, 2018—IAR Systems®, the future-proof supplier of software tools and services for embedded development, has launched version 9.1 of the graphical modeling tool IAR Visual State®. The new version further speeds up and simplifies development when working in teams.

The design and code generation tool … Read More → "IAR Systems simplifies development of event-driven embedded systems with updated design and code generation tool"

Arm announces new suite of IP for premium mobile experiences

June 1, 2018

Arm announces new suite of IP for premium mobile experiences
New client IP platform solutions includes CPU, GPU, and video processor technology built to increase productivity, immersive AR/VR and gaming, AI/ML, and UHD 8K viewing
CPU design delivers 35 percent more performance year-over-year

Over the last five years, Arm has seen CPU performance on smartphones increase an average of 20+ percent every year without compromising battery life. However, the same cannot be said for laptops, which have struggled to adapt to a slowing Moore’s Law over the … Read More → "Arm announces new suite of IP for premium mobile experiences"

Bottos Launches its Mainnet and the Bottos Data Marketplace

The Bottos Data Marketplace marks the first step in creating a new AI ecosystem

June 1, 2018

San Francisco, Calif. – May 31, 2018 – Today Bottos announces the launch of its mainnet and the Bottos Data Marketplace, a global data marketplace designed to foster innovation in artificial intelligence. As the first AI-dedicated public blockchain, Bottos aims to be a distributed artificial intelligence platform, and ultimately a new AI ecosystem.

The Bottos Data Marketplace was created to eliminate the … Read More → "Bottos Launches its Mainnet and the Bottos Data Marketplace"

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