industry news
Subscribe Now

Bottos Launches its Mainnet and the Bottos Data Marketplace

The Bottos Data Marketplace marks the first step in creating a new AI ecosystem

San Francisco, Calif. – May 31, 2018 – Today Bottos announces the launch of its mainnet and the Bottos Data Marketplace, a global data marketplace designed to foster innovation in artificial intelligence. As the first AI-dedicated public blockchain, Bottos aims to be a distributed artificial intelligence platform, and ultimately a new AI ecosystem.

The Bottos Data Marketplace was created to eliminate the barriers to growth in AI projects through a simple equation: Blockchain + Data x AI. The users of the marketplace are classified into three categories: data providers, data requesters and data service providers (data validators, data taggers, and data cleaners). Each of the users play an important role in maintaining the ecosystem of the Bottos blockchain.

“We launched Bottos with the goal of making data more accessible and affordable”, said Bottos co-founder Xin Song. “Artificial intelligence will no doubt increase productivity in the future, and our Data Marketplace is blockchain-based technology to connect AI companies and data providers.”

Data is a barrier to development for many AI companies; data acquisition can take up 50-60 percent of the budget for AI development, and model training can take up to 70 percent of a project’s time. Global giants like Facebook, Google and Amazon own huge amounts of data and sell it through limited agencies at a very high price.

Bottos anticipates that its Data Marketplace will expand the opportunities for data and reduce data costs by as much as 30 percent in some cases, helping level the playing field for small and mid-size AI companies.

Data security is a priority for Bottos, and the company is using several measures to protect data integrity, including encryption, digital signatures, community governance and distributed intelligent storage. When data is hashed and placed on the blockchain, it is sliced into thousands of pieces, and each of those pieces is stored in different places. Bottos also offers data verification services.

The Bottos Data Marketplace is the company’s first DApp. In early June, Bottos will open source a portion of the codes for Bottos’ public blockchain, allowing developers to build any kind of AI-related DApp, including model marketplaces, data storage sharing networks and computing power sharing networks.

Bottos utilizes a multi-token system, with BTO as base tokens, DTO as data tokens and STO as resource tokens.

“We aim to be a pioneer in the multi-token system,” said Song. “We see significant advantages over single-token systems, including less vulnerability to hacking and other cybersecurity problems.”

Bottos transactions will involve smart contracts using BTO tokens, which can also be used for third-party services like data verification or cleaning.

The BTO token is currently listed on ten exchanges, including Gate.io, Bibox, Bit-Z, LBank and CoinEgg.

For more information on Bottos, please visit www.bottos.org and follow Bottos on Twitter at @bottos_ai. Bottos 3.0 is available for download via Github.

About Bottos

Bottos is building the infrastructure for AI development through blockchain technology in order to create a new decentralized AI ecosystem. The Bottos Data Marketplace provides a way to connect artificial intelligence companies and data providers. It is also a consensus-based, one-stop platform to implement the registration, distribution and transformation of data among different participants within the broad-based artificial intelligence ecosystem. Bottos is out to build the world’s most efficient data sharing network to enhance AI innovation and competitiveness.  Bottos utilizes BTO tokens and smart contracts for its blockchain-based transactions.

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

PIC32CX-BZ2 and WBZ451 Multi-Protocol Wireless MCU Family
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Shishir Malav from Microchip explore the benefits of the PIC32CX-BZ2 and WBZ45 Multi-protocol Wireless MCU Family and how it can make IoT design easier than ever before. They investigate the components included in this multi-protocol wireless MCU family, the details of the software architecture included in this solution, and how you can utilize these MCUs in your next design.
May 4, 2023
40,870 views