Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment
SAN JOSE, Calif., 02 Oct 2018
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital tools and advanced IC packaging solutions support the new TSMC InFO_MS (InFO with Memory on Substrate) packaging technology. Support for this TSMC packaging technology enables mutual customers to create new, complex chips using 3D stacking techniques to bring innovative new products to market much faster than ever before.
For more information on the Cadence® solutions that support the TSMC InFO_MS advanced packaging technology, visit < … Read More → "Cadence Expands its Cloud Portfolio with Delivery of TSMC OIP Virtual Design Environment"

