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Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families

Düsseldorf, October 25, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018. The new MCUs are designed to address the real-time performance and enhanced stability required by motor … Read More → "Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families"

Embedded Studio 4.10 for ARM released – Putting the executable on a diet!

Monheim, Germany – October 25th, 2018

“Bigger is better” is not true when it comes to program size of Embedded Computing Systems. Less is more. A smaller executable can get the same thing done with less program memory (Flash), resulting in the ability to use smaller Microcontrollers and potentially massive cost savings.

After a successful beta period, SEGGER has added the new Linker and Link-Time Optimization (LTO) to the latest release build of their powerful cross-platform integrated development environments, Embedded Studio for ARM and Embedded Studio for Cortex-M.

The new product version delivers on the … Read More → "Embedded Studio 4.10 for ARM released – Putting the executable on a diet!"

ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018

eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will deliver two DFT-related presentations at the International Test Conference (ITC) in Phoenix, Arizona on October 30 and 31, 2018.

Who
Joseph Reynick, director, DFT Solutions, eSilicon

What
Mentor’s Diamond Supporter Session
Test for the Autonomous Age
The presentations will focus on three key test challenges IC vendors face as they make the promises of the autonomous age a reality. Speakers: Joseph Reynick, eSilicon; Janusz Rajski, Mentor, A … Read More → "ITC 2018: eSilicon to present on DFT for deep learning ICs and DFT for large 2.5D/3D devices October 30-31, 2018"

DDC-I to Sponsor NXP Workshop on Multicore for Avionics

Phoenix, AZ – October 22, 2018.  DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced that it will sponsor NXP’s Multicore for Avionics (MCFA) Workshop. At the workshop, DDC-I will showcase its safety-critical Deos real-time operating system, which is optimized for developing, deploying, and certifying DO-178 avionics software for NXP multicore processors hosting the most demanding I/O, networking, control, multimedia, and display requirements. The MCFA workshop will be held October 23-24 at the Hyatt Lost Pines in Lost Pines, Texas.

In conjunction with the … Read More → "DDC-I to Sponsor NXP Workshop on Multicore for Avionics"

Highly accurate digital temperature sensors provide unparalleled simplicity for RTD-based and medical designs

DALLAS (Oct. 25, 2018) – Texas Instruments (TI) (NASDAQ:TXN) today introduced a new temperature sensor family that offers ±0.1°C accuracy across a wide temperature range and helps simplify system design for industrial and medical applications. The TMP117 is the first single-chip temperature sensor to offer similar performance to platinum resistance temperature detectors (RTDs) while significantly reducing design complexity and power consumption, and the TMP117M, a digital temperature sensor for medical applications, supports requirements for medical thermometers. The new devices enable engineers to more quickly develop highly accurate, ultra-low-power patient monitoring, field transmitter and metering applications. For more information, see < … Read More → "Highly accurate digital temperature sensors provide unparalleled simplicity for RTD-based and medical designs"

Reflex Photonics launches midboard LightVISION optical transceiver with MPO interface for increased design flexibility and performance in high-bandwidth communication application.

Kirkland (Montréal), October 24, 2018: Reflex Photonics is proud to introduce the LightVISION™ midboard optical transceiver solution for high-density servers and tactical data centers. The LightVISION was developed specifically as an alternative to the SNAP12 optical transceiver in response to the demand for higher bandwidth optical communication, higher operating temperatures, more rugged design, and more compact size.

The innovative Read More → "Reflex Photonics launches midboard LightVISION optical transceiver with MPO interface for increased design flexibility and performance in high-bandwidth communication application."

UltraSoC and ResilTech partner to further functional safety in automotive systems

CAMBRIDGE, UK – 25 October 2018

UltraSoC and ResilTech today announced a collaboration that brings together their expertise and technologies to further the functional safety compliance of automotive systems, focusing particularly on the ISO26262 standard. UltraSoC’s embedded analytics technology provides a powerful platform for developers who need to verify and validate the security and functional safety of their products, and to incorporate hardware-supported safety and security features such as anomaly detection and prevention of malicious intrusion.

UltraSoC’s approach is well matched with ResilTech’s significant experience in the design and validation of high integrity critical systems … Read More → "UltraSoC and ResilTech partner to further functional safety in automotive systems"

Sharing your own car via an app: Infineon and XAIN to collaborate on bringing blockchain into the car

Munich, Germany – 25 October 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and XAIN have agreed to work together on bringing blockchain technology into the car. The Munich semiconductor maker and the Berlin-based start-up have signed a corresponding Memorandum of Understanding at Infineon’s 1st Automotive Cybersecurity Forum, taking place today in Munich. The goal of the collaboration is to test possible applications and develop suitable ones to market maturity. A first demonstrator shows how access rights, e.g. for car sharing, can be granted decentrally with a smartphone app.

“Cybersecurity is … Read More → "Sharing your own car via an app: Infineon and XAIN to collaborate on bringing blockchain into the car"

Rohde & Schwarz significantly increases functionality of R&S ELEKTRA EMC test software

Munich, October 24, 2018 — EMC market leader Rohde & Schwarz introduces additional options for the existing R&S ELEKTRA EMC test software family to cover even more applications.

Thanks to the extensive automated execution of EMI tests, R&S ELEKTRA helps lab operators and EMC engineers who work in a wide variety of industries or for test houses and regulatory authorities save time and effort in the development and certification of commercial, automotive and A&D products.

With software options for conducted and radiated EMS testing in line with commercial standards, R&S … Read More → "Rohde & Schwarz significantly increases functionality of R&S ELEKTRA EMC test software"

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