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SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC

Hsinchu, Taiwan, – CEVA Technology Symposium – October 29, 2018 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that SigmaStar Technology Corp., a wholly-owned subsidiary of MStar Semiconductor Inc., has licensed and deployed the CEVA-XM6 computer vision and deep learning platform to enable advanced computer vision and neural-network based applications in its SAV538 Artificial Intelligence (AI) camera System-on-Chip (SoC).

< … Read More → "SigmaStar Deploys CEVA Computer Vision and Deep Learning Platform in its Intelligent Camera SoC"

Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2

TOKYO, Japan, October 29, 2018― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is accelerating the development of robotics systems to deliver intelligence at the industrial endpoint by extending the features of Renesas’ high-performance, 32-bit RX65N Series of microcontrollers (MCUs) to support the DDS-XRCE (Data-Distribution Service for Extremely Resource Constrained Environments™), one of the upcoming protocol standards for ROS 2 communication. Renesas’ support of the DDS-XRCE framework enables the development of software that controls the sensors and actuators that will be embedded at robotics system endpoints, such as welfare, safe guard, reception, cleaning, household robots, and … Read More → "Renesas Electronics RX65N Microcontrollers Support DDS-XRCE Communication Protocol for ROS 2"

Pentek’s New Quartz RFSoC Development Platform Speeds Application Design

Low-cost, single-slot 3U VPX development chassis
Supports Pentek’s Quartz RFSoC FPGA products
Dual MPO optical interfaces support 100 GigE high-speed data streaming
Ideal for defense, radar, wireless, SIGINT and DRFM applications

UPPER SADDLE RIVER, NJ-October 29, 2018-Pentek, Inc., today introduced the Model 8257 3U VPX development chassis for Pentek’s new Quartz RFSoC FPGA product line. Developed specifically for Pentek’s Model 5950 Zynq UltraScale+ RFSoC 3U VPX processor, the Model 8257 chassis features a single-slot backplane, power supply, forced-air cooling and connectors to support all functions of the 5950. With eight 4 GHz 12-bit A/Ds and eight 6.4 GHz 14 … Read More → "Pentek’s New Quartz RFSoC Development Platform Speeds Application Design"

Always-On Inertial Measurement Unit from STMicroelectronics Improves Accuracy, Optimizes System Power

Geneva, October 29, 2018 — The LSM6DSO iNEMO™ Inertial Measurement Unit (IMU) from STMicroelectronics is an always-on 3D accelerometer and 3D gyroscope system-in-package that is, by itself, extremely power efficient and … Read More → "Always-On Inertial Measurement Unit from STMicroelectronics Improves Accuracy, Optimizes System Power"

LoRa Alliance™ Enhances LoRaWAN™ Protocol with New Specifications to Support Firmware Updates Over the Air

TOKYO – October 25, 2018 – The LoRa Alliance™, the global association of companies backing the open LoRaWAN™ protocol for Internet of Things (IoT) low-power wide-area networks (LPWANs), today announced the public availability of three new specifications. Together, the new specifications support and standardize firmware updates over the air (FUOTA), a capability unique to LoRaWAN among LPWANs.

These major enhancements to the protocol are accompanied by significant growth in … Read More → "LoRa Alliance™ Enhances LoRaWAN™ Protocol with New Specifications to Support Firmware Updates Over the Air"

Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families

TOKYO, Japan, October 25, 2018 – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’ new RX microcontroller (MCU) families that begin rolling out at the end of 2018. The new MCUs are designed to address the real-time performance and enhanced stability required by motor control and industrial applications in next-generation smart factory, smart home and smart infrastructure equipment.

The innovative RXv3 core boosts the proven Renesas RX CPU core architecture with up … Read More → "Renesas Unveils RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families"

Maxim Delivers Industry’s Widest Voltage Range and Smallest Footprint with Himalaya uSLIC Family Additions

SAN JOSE, Calif.—Oct. 24, 2018—Now engineers designing into applications in factory automation, medical, communications and consumer markets can tap into four new micro-system-level IC (“uSLIC™”) modules from Maxim Integrated Products, Inc. (NASDAQ: MXIM). The MAXM17552, MAXM15064, MAXM17900 and MAXM17903 step-down DC-DC power modules join Maxim’s extensive portfolio of Himalaya power solutions, providing the widest input voltage range (4 to 60V) with the smallest solution sizes.  

Rohde & Schwarz and Huawei successfully perform LTE-V interoperability tests to make connected vehicles reality

Rohde & Schwarz and Huawei have successfully tested the interoperability of LTE-V connected vehicles with the R&S CMW500 wideband radio communication tester using the embedded Huawei Balong 765 IC as an LTE-V UE. The solution verified multiple test scenarios for internet of vehicles (IoV) communications based on 3GPP Release 14 Mode 4.

Munich and Shenzhen, October 26, 2018 — LTE-V is a cellular IoV technology standard based on device to device (D2D) and existing LTE technologies. In the R&D phase, interoperability testing between terminals from different providers verifies connectivity and compliance with the standard. Testing the conformance of … Read More → "Rohde & Schwarz and Huawei successfully perform LTE-V interoperability tests to make connected vehicles reality"

Leti Middleware Will Be Core of Fog Platform for Decentralized Cloud-to-Edge AI

GRENOBLE, France – Oct. 25, 2018 – Leti, a research institute at CEA-Tech, today announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development in an EU-Korean project that will empower emerging artificial intelligence (AI) applications with on-demand computing at the edge of networks.

Decentralization from the cloud to the edge is a key challenge of AI technologies applied to large heterogeneous systems, including ensuring timely and effective responses that are critical (e.g. braking).

The joint project, called Read More → "Leti Middleware Will Be Core of Fog Platform for Decentralized Cloud-to-Edge AI"

u-blox announces multiradio and gateway modules with concurrent Wi-Fi and dual-mode Bluetooth connectivity

Thalwil, Switzerland – October 24, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the NINA-W15 ( https://www.u-blox.com/product/nina-w15-series) multiradio and gateway module series, which can simultaneously support both Wi-Fi 802.11 b/g/n connections and dual-mode Bluetooth connectivity. This includes support for both Bluetooth low energy and Bluetooth BR/EDR. Concurrent support … Read More → "u-blox announces multiradio and gateway modules with concurrent Wi-Fi and dual-mode Bluetooth connectivity"

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