News – Page 1026 – EEJournal

Sensera further expands fabrication capabilities with dicing, wafer bonding and electroplating technologies

November 5, 2018

Sensera Inc. (ASX: SE1), a leading provider of MEMS devices and Internet of Things (IoT) solution provider that delivers sensor-based products transforming real-time data into meaningful information, action and value, is pleased to announce it has acquired and qualified additional thin-film processing equipment including a dicing saw, a wafer bonder and an electroplating cell to meet the growing customer demand in this segment.

Matrox Imaging Reveals New Addition to Matrox Concord Family of GigE Vision Adaptor Cards

Matrox Concord PoE with ToE delivers trigger-over-Ethernet capabilities to support multi-camera installation

November 5, 2018

MONTREAL, Quebec, 2 November 2018 — Matrox® Imaging today announces the Matrox Concord PoE with ToE, a new addition to the Matrox Concord family of network adaptor cards for use with GigE … Read More → "Matrox Imaging Reveals New Addition to Matrox Concord Family of GigE Vision Adaptor Cards"

Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers

New system combines high sensitivity, repeatability and throughput to deliver the industry’s best performance and cost-of-ownership for inspection of critical wafer zones

November 2, 2018

Wilmington, Mass. (November 1, 2018)—Rudolph Technologies, Inc. (NYSE: RTEC) today announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans to ship multiple systems totaling more than $3M by year end to fill existing orders from two customers. The new system is the result of a multi-year collaboration with bare wafer manufacturing partners that require one inspection tool capable of detecting defects near the wafer’s edge, bevel, back-side and notch. The NovusEdge system meets the stringent new requirements for defect control at the edge and … Read More → "Rudolph Technologies Releases NovusEdge System for Edge, Notch and Backside Inspection of Unpatterned Wafers"

Panasonic Industry Europe expands its Conductive Polymer Hybrid Capacitor portfolio

New ZS-Series pushes the boundaries of the Hybrid Polymer Electrolytic segment with higher capacitance and ripple current ratings

November 2, 2018

Munich, November 2018: Panasonic Industry Europe is expanding its Conductive Polymer Hybrid Capacitors portfolio for the second time this year with the addition of a sixth series. The new ZS-Series not only expands the capacitance range and doubles ripple current capability, but it is also rated at 4,000 hours endurance at 125°C. The ZS Series brings new case sizes, keeping the same footprint (ø10mm) and the first tranche of the launch introduces hybrid capacitors that are 16mm in length.< … Read More → "Panasonic Industry Europe expands its Conductive Polymer Hybrid Capacitor portfolio"

Pixus Releases New Development Chassis for 3U OpenVPX Boards

November 2, 2018

Waterloo, Ontario — Nov 01, 2018 – Pixus Technologies, a provider of embedded computing and enclosure solutions, has released 3U versions of its low-cost open frame development platform for OpenVPX and other architecture backplane systems.

The VPXD0500 series accepts up to 8 slots of 3U OpenVPX backplanes in a 1.0” pitch. Other 3U backplanes such as CompactPCI or VME can also be utilized in the enclosure. Versions with VITA 66 for optional contacts and/or VITA 67 for RF contacts are available. A 600W or 1200W modular power supply for … Read More → "Pixus Releases New Development Chassis for 3U OpenVPX Boards"

Mouser Signs Global Distribution Agreement with Sudo Systems to Stock High-Performance SudoProc SoM for IoT Designs

November 2, 2018

October 31, 2018 – Mouser Electronics, Inc. announces that it has entered into a distribution agreement with Read More → "Mouser Signs Global Distribution Agreement with Sudo Systems to Stock High-Performance SudoProc SoM for IoT Designs"

Reflex Photonics’ SpaceABLE radiation-resistant optical transceivers to successfully reach more than 4000 h of accelerated life test for GEO 20 years life applications.

November 1, 2018

Kirkland (Montréal), October 30, 2018: Reflex Photonics is proud to announce that its SpaceABLE™ SM radiation-resistant transceivers have exceeded the minimal requirement of 2500 h of accelerated life test for GEO 20 years in-satellite operation with no performance degradation outside measurement uncertainty.

These modules are on their way to successfully complete 4000 h of the same test; … Read More → "Reflex Photonics’ SpaceABLE radiation-resistant optical transceivers to successfully reach more than 4000 h of accelerated life test for GEO 20 years life applications."

HCC Expands its Fail-Safe Flash Translation Layer for NAND to Include Deterministic Operation for Automotive, Aerospace, and Industrial Applications

November 1, 2018

Budapest, Hungary – 16 October 2018 – HCC Embedded (HCC), long-time experts in fail-safe and reliable NAND flash software, has extended its existing flash translation layer (FTL) solution for NAND with the addition of deterministic execution control. Engineers integrating NAND flash into safety-based systems in automotive, aerospace, and industrial applications can use HCC’s SafeFTL to ensure stable and predictable operation of the NAND flash. HCC’s new deterministic SafeFTL has been fully verified both in simulated environments and on real NAND flash arrays.

Traditionally, NOR flash has been the dominant … Read More → "HCC Expands its Fail-Safe Flash Translation Layer for NAND to Include Deterministic Operation for Automotive, Aerospace, and Industrial Applications"

OmniVision Announces Industry’s First Single-Chip 1080p LCOS Microdisplay With Integrated Driver for AR/VR and Projector Designs

October 31, 2018

SANTA CLARA, Calif. – Oct. 30, 2018 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OP02220—the industry’s first 1080p liquid crystal on silicon (LCOS) microdisplay with integrated driver functions and memory. This compact, low-power and cost-effective microdisplay is especially valuable for augmented reality (AR) applications such as glasses and head-mounted displays that need durability, compactness and lightweight. This is a burgeoning market as consumer demand for wearable AR microdisplays is growing for both gaming and industrial applications, including virtual product evaluation and on-the-job training.

“A single-chip LCOS architecture … Read More → "OmniVision Announces Industry’s First Single-Chip 1080p LCOS Microdisplay With Integrated Driver for AR/VR and Projector Designs"

TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0

Industrial-grade Sitara™ AM6x processors offer advanced industrial communications, enhanced security, high reliability and functional safety features

October 31, 2018

DALLAS (Oct. 30, 2018) – Texas Instruments (TI) (NASDAQ: TXN) today announced the industry’s first multiprotocol gigabit (Gb) time-sensitive networking (TSN)-enabled processor family. The new, highly integrated Sitara™ AM6x processor family provides industrial-grade reliability, with quad and dual Arm^® Cortex^®-A53 core variants built to meet the rapidly evolving needs of Industry 4.0 in factory automation, motor drives and grid infrastructure. For more information about Sitara AM6x processors, see Read More → "TI introduces first multiprotocol gigabit TSN-enabled processors for Industry 4.0"