News – Page 1025 – EEJournal

Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing

November 6, 2018

SAN JOSE, Calif., October 31, 2018—Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced the Cadence^®Tensilica^®HiFi 5 DSP for audio and voice, the first IP core optimized for high-performance far-field processing and artificial intelligence (AI)-based speech recognition processing. This fifth-generation HiFi DSP offers 2X audio processing and 4X neural network (NN) processing improvements versus the HiFi 4 DSP, making it ideal for voice-controlled user interfaces in digital home assistants and automotive infotainment.

For more information, visit http://www.cadence.com/go/hifi5.

Following … Read More → "Cadence Introduces the Tensilica HiFi 5 DSP, the First DSP Optimized for AI Speech and Audio Processing"

AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution

November 6, 2018

MOUNTAIN VIEW, Calif., Nov 5, 2018 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) and Advanced Micro Foundry (AMF) today announced that a new, production-ready process design kit (PDK) based on AMF’s silicon photonics (SiP) process is now available in the Read More → "AMF Photonics SiP Process Design Kit Available for Synopsys OptoDesigner Photonic IC Layout Solution"

u-blox’s first multi-band GNSS timing receiver meets 5G’s stringent accuracy requirements

The ZED-F9T timing module offers nanosecond-level timing accuracy and concurrent reception of GNSS signals for global coverage.

November 6, 2018

Thalwil, Switzerland – November 5, 2018 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the ZED-F9T (https://www.u-blox.com/product/zed-f9t-module) high accuracy timing (Read More → "u-blox’s first multi-band GNSS timing receiver meets 5G’s stringent accuracy requirements"

Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption

November 6, 2018

Louvain-la-Neuve, Belgium – November 5, 2018 – Silex Insight, leading provider of IP cores for secure computing, presents a new version of its Chacha20-Poly1305 hardware crypto engine that is geared towards high-throughput applications. The RFC7539-compliant IP core offers customers future-proof authenticated encryption between highly networked applications, for example in IoT or cloud computing. The new IP core is available for ASIC and FPGA designs. With simple, straightforward interfaces, it is easy to integrate and highly scalable, hallmarks of all Silex Insight’s cores.

The new IP core – codename BA420 – is used to verify the data integrity and the authenticity … Read More → "Silex Insight unveils high-throughput version of Chacha20-Poly1305 authenticated encryption"

Full-Bridge 600V/3.5A System-in-Package from STMicroelectronics Delivers Space Savings with Flexibility and Safety

November 6, 2018

Geneva, November 5, 2018 — STMicroelectronics’ PWD5F60 high-density power driver is the second in a new series of power-driver systems-in-package addressing high-voltage brushed DC and single-phase brushless motor … Read More →

SiTime Launches the Emerald Platform, a Game-changing MEMS Timing Solution for 5G Infrastructure

Enables 5G Equipment to be Deployed Anywhere, in Any Environment

November 6, 2018

Solves critical timing challenges for 5G infrastructure

Sets new performance benchmarks–20 times better–in the $1.5 billion telecom and networking timing market
Unprecedented ease-of-use and programmability reduces design complexity and accelerates time to revenue

SANTA CLARA, Calif., November 5, 2018 – SiTime Corporation, a leading provider of MEMS timing, today announced the Read More → "SiTime Launches the Emerald Platform, a Game-changing MEMS Timing Solution for 5G Infrastructure"

UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series

November 5, 2018

November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its UF3C FAST series of 650 V and 1200 V high-performance silicon carbide FETs in a standard TO-247-3L package. The FAST Series offers increased switching speeds and higher efficiency levels than their existing UJC3 Series.

Based on UnitedSiC’s proprietary cascode configuration, ( https://unitedsic.com/cascodes/</ … Read More → "UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series"

OmniVision’s New 16-MP Image Sensor Brings Top Performance and High Resolution to Mainstream Smartphone Market

Best-in-Class 1.12-micron Sensor Enables Fast Advanced Autofocus and Excellent Low-Light Performance for Best User Experience

November 5, 2018

SANTA CLARA, Calif. – Oct. 31, 2018 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV16E10—the latest generation of its high-performance 16-megapixel (MP) image sensor family. Built on OmniVision’s latest 1.12-micron PureCel^®Plus stacked die technologywith world-class sensitivity and QE performance, the 1/2.8” OV16E10 sensor comes with advanced imaging features to deliver industry-leading performance for both single- and multi-camera applications.

“With 16-MP cameras moving into a greater variety of smartphones, consumers at all price points expect their phones to deliver high-quality images and video,” said … Read More → "OmniVision’s New 16-MP Image Sensor Brings Top Performance and High Resolution to Mainstream Smartphone Market"

Netronome Announces Open Chiplet Architecture for Advanced SoC Designs

November 5, 2018

Democratizes Production of Integrated Silicon Products for High-Performance Machine Learning, Security and Networking Applications by Enabling Integration of Best-of-Breed Components While Significantly Reducing Development Costs and Accelerating Time to Revenue

Calls for Industry Collaboration and Design Contribution in the Open Domain-Specific Accelerator (ODSA) Workgroup Jointly Initiated by Seven Silicon Companies

LINLEY FALL PROCESSOR CONFERENCE, SANTA CLARA, CA, October 31, 2018 – Netronome, a leader in high-performance intelligent networking solutions, today announced an open architecture for domain-specific accelerators designed to significantly reduce the burgeoning cost of silicon development as demanded by modern data … Read More → "Netronome Announces Open Chiplet Architecture for Advanced SoC Designs"

Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth

Represents new line of business for Flex Logix to enable performance edge inferencing by slashing DRAM cost and power

November 5, 2018

Mountain View, Calif., October 31, 2018 – Flex Logixâ Technologies, Inc. today announced that it has leveraged its core patent-protected interconnect technology from its embedded FPGA (eFPGA) line of business to launch a completely new product line focused on neural inferencing. Unveiled today in a presentation at the Linley Processor Conference in Santa Clara, the Flex Logix NMAXÔNeural Inferencing Engine delivers 1 to >100 TOPS of neural inferencing capacity in … Read More → "Flex Logix Launches NMAX Neural Inferencing Engine that Delivers 1 to 100+ TOPS Performance Using 1/10th the Typical DRAM Bandwidth"