industry news archive
Subscribe Now

Renesas Electronics Sub-Gigahertz Wireless Solution Selected as Candidate of Standard Test Bed Unit for Wi-SUN FAN Specifications

Düsseldorf, November 6, 2018 – Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that Wi-SUN Alliance1 has adopted Renesas’ sub-gigahertz (Sub-G) wireless solution as a candidate of the interoperability test bed units2 (TBUs) for the Wi-SUN FAN (Field Area Network) Certification Program. … Read More → "Renesas Electronics Sub-Gigahertz Wireless Solution Selected as Candidate of Standard Test Bed Unit for Wi-SUN FAN Specifications"

RS Components augments portfolio of powerful processing solutions with FPGA and SoC modules from Trenz Electronic

LONDON, UK, 6 November, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has added a new portfolio of advanced modules based on FPGAs and system-on-chip (SoC) ICs from Trenz Electronic, a leading developer and manufacturer of module-based solutions for the industrial and science market sectors.

The ability of FPGAs and other powerful semiconductor devices to perform efficient processing in parallel is becoming very important to meet the demands of applications that are gathering and storing increasing amounts of data – and these are rapidly mounting in number with trends such as the … Read More → "RS Components augments portfolio of powerful processing solutions with FPGA and SoC modules from Trenz Electronic"

First 100Gb-Capable COTS FPGA Board, for High-Bandwidth Applications

Annapolis Micro Systems, a leading FPGA board and systems supplier, is now shipping its first COTS FPGA board with 100Gb capability. The WILDSTAR 6XB2 6U OpenVPX FPGA Processor’s superior bandwidth and performance is designed to address the most challenging real-time data digitization, processing, and storage applications.

The 6XB2 integrates two Xilinx … Read More → "First 100Gb-Capable COTS FPGA Board, for High-Bandwidth Applications"

Alliance Memory Releases New x8, x16, and x32 512Mb Monolithic CMOS SDRAMs in 54-Pin and 86-Pin TSOP II Packages

SAN CARLOS, Calif. — Nov. 6, 2018 — Alliance Memory today extended its offering of 512Mb high-speed CMOS SDRAMs with new monolithic 64M x 8 (AS4C64M8SC-7TIN) and 32M x 16 (AS4C32M16SC-7TIN) devices in the 54-pin 400-mil plastic package, and a 16M x 32 (AS4C16M32SC-7TIN) device in the 86-pin TSOP II package. The new SDRAMs are among the products Alliance Memory will feature next week at electronica 2018 in Stand B5 526.

Featuring a LVTTL interface, the SDRAMs released today operate from a single +3.3-V (± 0.3 V) power supply, feature a power down mode to lower … Read More → "Alliance Memory Releases New x8, x16, and x32 512Mb Monolithic CMOS SDRAMs in 54-Pin and 86-Pin TSOP II Packages"

Image sensor for machine vision sets new standard for image quality and frame rate in 1” optical format

Premstaetten, Austria (6 November, 2018) — ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today introduced a new global shutter image sensor for machine vision and Automated Optical Inspection (AOI) equipment which offers better image quality and higher throughput than any previous device that supports the 1” optical format.

The new CSG14k image sensor features a 3840 x 3584 pixel array, giving 14Mpixel resolution at a frame rate considerably higher than any comparable device on the market offers today. The CSG14k’s 12-bit output provides sufficient dynamic range to handle wide variations in … Read More → "Image sensor for machine vision sets new standard for image quality and frame rate in 1” optical format"

STMicroelectronics Extends Best-In-Class Powerline-Communication Chipset into Non-Utility Applications and Emerging Protocol Standards

Geneva, November 5, 2018 — The STMicroelectronics ST8500 is the first powerline-communication (PLC) solution to feature a G3-PLC CENELEC B certified protocol stack for industrial applications beyond utility metering, such as in … Read More → "STMicroelectronics Extends Best-In-Class Powerline-Communication Chipset into Non-Utility Applications and Emerging Protocol Standards"

EFCO Announces SmartSL Plus With PoE

San Diego, California  – November 5, 2018  EFCO, a world-class supplier of industrial computer, Gaming and EMS solutions, today introduced its latest embedded box computer, SmartSL Plus, which offers power-over-ethernet (PoE) capability. Powered by the 3rd Gen (Bay Trail) Intel® Atom™ or Celeron® Processor, the compact and fanless design of the SmartSL Plus is equipped with a Qseven module, and is particularly ideal for machine vision and video applications.

“QSeven-based systems are breaking new ground with power-over-ethernet applications,” stated Ron Mazza, CEO of EFCO. “This proven, modular approach allows our industrial computer … Read More → "EFCO Announces SmartSL Plus With PoE"

MEMS sensors from Bosch make driving safer, more fun, and more relaxed

  • Sensor optimizes ESP®, driver assistance systems, and sophisticated driving dynamics applications
  • Yaw rate, roll-rate, and acceleration measurement in a single compact package
  • SMI860 is especially robust for withstanding vibrations

Munich and Reutlingen, Germany – Stable vehicle handling under all weather conditions and traffic situations makes car driving not only safer and more comfortable but also delivers a higher degree of enjoyment and dynamics to the driving experience. At the electronica exhibition in Munich, Bosch reveals for the first time its SMI860 five-axis inertial sensor. This extremely robust MEMS … Read More → "MEMS sensors from Bosch make driving safer, more fun, and more relaxed"

DDC-I Announces First Partitioned DO-178C Safety-Critical Multicore COTS RTOS for NXP i.MX 8QuadMax Multimedia Applications Processor

Phoenix, AZ – November 1, 2018.  DDC-I, a leading supplier of software and professional services for mission- and safety-critical applications, today announced the first partitioned DO-178C multicore commercial off the shelf (COTS) real-time operating system (RTOS) for the NXP i.MX 8QuadMax Applications Processor, with verification evidence to Design Assurance Level A. NXP i.MX 8QuadMax processors running Deos™ make an excellent platform for developing, deploying and certifying DO-178C avionics software with the most demanding I/O, networking, control, multimedia, and display requirements.

“Many of the same attributes that make the … Read More → "DDC-I Announces First Partitioned DO-178C Safety-Critical Multicore COTS RTOS for NXP i.MX 8QuadMax Multimedia Applications Processor"

featured blogs
Apr 24, 2026
A thought experiment in curiosity, confusion, and cosmic consequences....