industry news
Subscribe Now

STMicroelectronics Extends Best-In-Class Powerline-Communication Chipset into Non-Utility Applications and Emerging Protocol Standards

Customer solutions for smart grids, smart cities, smart railways, built around ST8500 PLC platform and its latest turn-key certified protocols on extended frequency bands, on display at European Utility Week 2018
Geneva, November 5, 2018 — The STMicroelectronics ST8500 is the first powerline-communication (PLC) solution to feature a G3-PLC CENELEC B certified protocol stack for industrial applications beyond utility metering, such as in smart cities, street lighting, renewable-energy management, railway smart tunnels and stations.
 
In addition to covering all G3-PLC standards and frequency bands, ST8500 also offers certified libraries for all PRIME standards, from PRIME 1.3.6 to PRIME 1.4 in CENELEC and FCC bands. Each of the stacks features high-performing routing algorithms to ensure superior network coverage in all application domains.
 
New products from lead customers in the smart-metering and industrial sectors featuring the ST8500 will be on display at ST’s booth (B.p19) at European Utility Week, Messe Wien, Vienna, 6-8 November.
 
Fully programmable, containing a dedicated real-time engine to handle the modulation and coding schemes of different PLC standards and a power-efficient Arm® Cortex®-M4F core for upper-layer processing and system management, the ST8500 allows product manufacturers to address multiple markets and regions with a single hardware platform, and future-proof assets in the field by remote update. Dedicated peripherals for smart-energy applications, including an AES cryptographic engine, are also integrated. Consuming less than 100mW in receive mode, the ST8500 meets the most stringent industrial specifications to minimize the grid load imposed by new smart meters.
 
With a complete Analog Front End (AFE) on-chip, the ST8500 connects directly to ST’s STLD1 line driver to create a complete single-vendor powerline-transceiver solution in the market. The STLD1 ensures reliable communication even across noisy cables, with high drive capability and high linearity over a wide output range of 18V in single-ended or 36V in differential mode. The two-chip set delivers best-in-class performance, ultra-low power consumption, flexibility, and cost-effective connectivity for smart-grid and IoT applications.
 
Driving the powerline-communication market for more than 20 years, ST is a principal member of all major PLC-protocol alliances including G3-PLC, PRIME, and Meters and More, and has supplied around 100 million powerline-modem ICs mainly for smart-metering applications.
 
The ST8500 in 7mm x 7mm x 1mm QFN56 and STLD1 in 4mm x 4mm x 1mm QFN24 are available now. Please contact your ST sales office for pricing options and sample requests.
 
Please visit www.st.com//st8500-stdl1-pr for further information.

Leave a Reply

featured blogs
Apr 24, 2024
Diversity, equity, and inclusion (DEI) are not just words but values that are exemplified through our culture at Cadence. In the DEI@Cadence blog series, you'll find a community where employees share their perspectives and experiences. By providing a glimpse of their personal...
Apr 23, 2024
We explore Aerospace and Government (A&G) chip design and explain how Silicon Lifecycle Management (SLM) ensures semiconductor reliability for A&G applications.The post SLM Solutions for Mission-Critical Aerospace and Government Chip Designs appeared first on Chip ...
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Accessing AWS IoT Services Securely over LTE-M
Developing a connected IoT design from scratch can be a complicated endeavor. In this episode of Chalk Talk, Amelia Dalton, Harald Kröll from u-blox, Lucio Di Jasio from AWS, and Rob Reynolds from SparkFun Electronics examine the details of the AWS IoT ExpressLink SARA-R5 starter kit. They explore the common IoT development design challenges that AWS IoT ExpressLink SARA-R5 starter kit is looking to solve and how you can get started using this kit in your next connected IoT design.
Oct 26, 2023
23,607 views