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VadaTech Announces new 6U OpenVPX Dual Xilinx Kintex UltraScale™ XCKU115 FPGA Board

November 12, 2018

Henderson, NV – November 8, 2018 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the VPX551 high-speed FPGA compute module for signal processing and beamforming applications.

The VPX551 provides dual Kintex UltraScale™ XCKU115 FPGAs, each providing over 1,400K logic cells, which interface directly to rear I/O via SERDES, LVDS and fiber. Each FPGA is supported by 16GB of 64-bit wide DDR4 (2 x Bank of 8GB) and 1GB flash. The rear panel fiber I/O is via six VITA 66.5 x12 modules, each of which can be populated as transmit … Read More → "VadaTech Announces new 6U OpenVPX Dual Xilinx Kintex UltraScale™ XCKU115 FPGA Board"

Renesas Electronics Introduces Innovative Safety Analysis Tool to Simplify Automotive ISO 26262 Compliance

GUI-Based Software Tool Offers Automotive System Integrators Flexibility in Evaluating Component and/or System Compliance to ISO26262 Safety Standard
November 12, 2018

TOKYO, Japan, November 8, 2018 — Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, is announcing the release of the GUI CAR (Customizable Analysis Report) Tool, an innovative safety analysis tool that will enhance customers’ ability to quickly integrate Renesas products into their safety-critical automotive systems while increasing user confidence in system compliance to the latest safety standard. The powerful new FMEDA (failure mode effects and diagnostics analysis) tool is optimized for the Read More → "Renesas Electronics Introduces Innovative Safety Analysis Tool to Simplify Automotive ISO 26262 Compliance"

Pixus Announces Fully Redundant CompactPCI Chassis with Alarm Functionality

November 12, 2018

Waterloo, Ontario  —  Nov 08, 2018 –  Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers 1U-4U CompactPCI enclosures with full hot-swappability and redundancy.  

The new Pixus enclosures feature dual redundant A and B power feeds and power supplies.  The enclosures range from 1U to 4U sizes with backplanes from 2 to 8 slots.  The backplanes have stiffeners for additional support.  The chassis platforms can be adapted for cPCI Serial or OpenVPX designs upon request.  

Read More → "Pixus Announces Fully Redundant CompactPCI Chassis with Alarm Functionality"

ZF Switches and Sensors Energy Harvesting Engine Now Paired with Bluetooth® Low Energy

November 12, 2018

Hall B3 Booth 530

Electronica 2018, Munich, November 13-16 2018

Auerbach/Munich. ZF Switches and Sensors market leading energy harvesting engine can now be combined with the RSL10 SIP –an ultra-low-power Bluetooth 5 certified System in Package from ON Semiconductor. This enables the switch to be used with the rapidly growing number of applications for Bluetooth Low Energy communications.

The SIP solution features such ultra-low-power characteristics that a low loss Schottky Diode bridge rectifier and electrolytic capacitor is enough to provide power from the switch to the Bluetooth 5 device.</ … Read More → "ZF Switches and Sensors Energy Harvesting Engine Now Paired with Bluetooth® Low Energy"

Mode-Changing MEMS Accelerometer from STMicroelectronics Combines High Measurement Resolution and Ultra-Low Power for Industrial Applications

November 10, 2018

Geneva, November 6, 2018 — The STMicroelectronics IIS2DLPC 3-axis MEMS accelerometer can change operating mode on the fly, from ultra-low power to high resolution, enabling high-accuracy measurements within a limited energy budget. The sensor can provide continuous contextual awareness to wake the host system when action is required and take highly accurate measurements before returning to ultra-low power operation.

With this extra flexibility, users can build longer-lasting battery-powered industrial sensor nodes or medical devices, tamper-proof smart meters, and smart power-saving or motion-activated functions. In addition, the opportunity for extremely low power consumption enables smart accessories for industrial machinery or … Read More → "Mode-Changing MEMS Accelerometer from STMicroelectronics Combines High Measurement Resolution and Ultra-Low Power for Industrial Applications"

UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series

November 10, 2018

November 5, 2018, Princeton, New Jersey: UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, announces the launch of its UF3C FAST series of 650 V and 1200 V high-performance silicon carbide FETs in a standard TO-247-3L package. The FAST Series offers increased switching speeds and higher efficiency levels than their existing UJC3 Series.

Based on UnitedSiC’s proprietary cascode configuration, ( https://unitedsic.com/ … Read More → "UnitedSiC introduces new UF3C “FAST” Silicon Carbide FET series"

RS Components plays a leading role in the ‘electronica Experience’ aimed at the next generation of engineers

RS to host and sponsor Hyperloop panel discussion in brand new Hall C6, as well as showcasing FIRST® LEGO® League, Sphero educational robot demos and Titan II innovation truck
November 9, 2018

LONDON, UK, 9 November, 2018 – RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel distributor, is playing a major part in the inaugural ‘electronica Experience’ at this year’s electronica trade fair in Munich. Taking place in the brand new Hall C6, the electronica Experience aims to deliver advice and a first-hand technology experience to young people to help inspire them to pursue a career in engineering.

As well as exhibiting on its main stand (Hall C5, Stand 147), RS is using its additional 224m² space in Hall C6 to present Titan II, its 35-tonne … Read More → "RS Components plays a leading role in the ‘electronica Experience’ aimed at the next generation of engineers"

Synopsys Extends Synthesis Leadership with Next-Generation Design Compiler

Design Compiler NXT Boosts Runtime by 2X, QoR by 5 Percent, and Provides Support Down to 5nm and Beyond
November 9, 2018

MOUNTAIN VIEW, Calif., Nov 6, 2018 /PRNewswire/ —

Highlights:

TE Connectivity’s high frequency nanominiature contact doubles density, reduces packaging

New NanoRF modules enable rugged embedded computing
November 9, 2018

HARRISBURG, Pa. – November 6, 2018 – TE Connectivity (TE), a world leader in connectivity and sensors, has released its new NanoRF modules and contacts, which double the density of today’s VITA 67 RF modules for VPX embedded computing applications.

This high frequency nanominiature coax contact is engineered with smaller contacts and a higher RF contact density within a multi-position module. This design enables smaller packaging and saves valuable space. Half-size modules can support up to 12 RF contacts and full-size modules can support 18 contacts or higher, with the option to customize contact count and position.

TE’s NanoRF modules … Read More → "TE Connectivity’s high frequency nanominiature contact doubles density, reduces packaging"

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