industry news
Subscribe Now

OneSpin Completes All Factory Inspections, Audits by Internationally-Recognized Testing Body TÜV SÜD

Eliminates Tool Qualification Effort for Users Targeting Functional Safety Standards ISO 26262, IEC 61508, EN 50128

MUNICH and SAN JOSE, CALIF. –– February 14, 2018 –– OneSpin® Solutions, provider of innovative formal verification solutions for highly reliable, digital integrated circuits (ICs), today announced successful completion of a series of factory inspections and audits of its organization and tool development processes by internationally-recognized testing body TÜV SÜD.

This conformance level enables OneSpin to provide certified formal verification solutions meeting tool qualification requirements set by functional safety standards (ISO 26262, IEC 61508 and EN 50128/SIL 3). As a result, OneSpin’s formal tools and solutions can reach the highest safety integrity levels (ASIL D and SIL 3).

“Achieving this level of confirmation from TÜV SÜD enables us to remove the burden of tool qualification from users for an unprecedented level of productivity and safety compliance,” affirms Dr. Raik Brinkmann, OneSpin’s president and chief CEO. “We now empower engineers facing tough technical challenges and notoriously hard-to-satisfy safety standards to seamlessly deploy the latest formal technology into their safety-critical design flows.”

The TÜV SÜD audit reviewed OneSpin’s ability to meet the requirements for the tool qualification methods “evaluation of the development process” and “validation of the software tool” defined in ISO 26262. These methods can be applied to all tool confidence levels and enable tool qualification through ASIL D, the highest automotive safety integrity level. In addition, OneSpin satisfied the requirements for T2 off-line tools, the classification required for verification tools according to IEC 61508 and EN 50128.

With this foundation, OneSpin’s certified Tool Qualification Kits ensure that a design flow or tools follow the safety manual without imposing additional requirements. The user can apply the Tool Qualification Kit directly to the tool evaluation step required by the functional safety standards with no additional tool qualification effort. This accelerates the process and eliminates the need to implement extensive tool error-detection justification or other time-consuming tool qualification methods such as “increased confidence from use.”

The first Tool Qualification Kit is available for OneSpin 360 EC-FPGA™, an automatic sequential equivalence checker that secures FPGA flows against the risk of synthesis and other implementation errors. (For more details, see accompanying news release dated February 14: “OneSpin Announces Immediate Availability of OneSpin 360 EC-FPGA Tool Qualification Kit Certified for ISO 26262, IEC 61508, EN 50128.”) Additional Tool Qualification Kits for other OneSpin tools will be announced later in the year.

To learn more about OneSpin’s Tool Qualification Kits visit onespin.com/tuv.

About OneSpin Solutions

OneSpin Solutions has emerged as a leader in formal verification through a range of advanced electronic design automation (EDA) solutions for digital integrated circuits. Headquartered in Munich, Germany, OneSpin is passionate about enabling users to address design challenges in areas where reliability really counts: safety-critical verification, SystemC/C++ high-level synthesis (HLS) code analysis and FPGA equivalence checking. OneSpin’s advanced formal verification platform and dedication to getting it right the first time have fueled dramatic growth over the past five years as the company forges partnerships with leading electronics suppliers to pursue design perfection. OneSpin: Making Electronics Reliable.

Leave a Reply

featured blogs
Jul 6, 2022
Design Automation Conference (DAC) 2022 is almost here! Explore EDA and cloud design tools, autonomous systems, AI, and more with our experts in San Francisco. The post DAC 2022: A Glimpse into the World of Design Automation from the Cloud to Cryogenic Computing appeared fir...
Jul 5, 2022
The 30th edition of SMM , the leading international maritime trade fair, is coming soon. The world of shipbuilders, naval architects, offshore experts and maritime suppliers will be gathering in... ...
Jun 28, 2022
Watching this video caused me to wander off into the weeds looking at a weird and wonderful collection of wheeled implementations....

featured video

Synopsys 112G Ethernet IP Interoperating with Optical Components & Equalizing E-O-E Link

Sponsored by Synopsys

This OFC 2022 demo features the Synopsys 112G Ethernet IP directly equalizing electrical-optical-electrical (E-O-E) channel and supporting retimer-free CEI-112G linear drive for low-power applications.

Learn More

featured paper

Addressing high-voltage design challenges with reliable and affordable isolation tech

Sponsored by Texas Instruments

Check out TI’s new white paper for an overview of galvanic isolation techniques, as well as how to improve isolated designs in electric vehicles, grid infrastructure, factory automation and motor drives.

Click to read more

featured chalk talk

"Scalable Power Delivery" for High-Performance ASICs, SoCs, and xPUs

Sponsored by Infineon

Today’s AI and Networking applications are driving an exponential increase in compute power. When it comes to scaling power for these kinds of applications with next generation chipsets, we need to keep in mind package size constraints, dynamic current balancing, and output capacitance. In this episode of Chalk Talk, Mark Rodrigues from Infineon joins Amelia Dalton to discuss the system design challenges with increasing power density for next generation chipsets, the benefits that phase paralleling brings to the table, and why Infineon’s best in class transient performance with XDP architecture and Trans Inductor Voltage Regulator can help power  your next high performance ASIC, SoC or xPU design.

Click here for more information about computing and data storage from Infineon