industry news
Subscribe Now

NXP Debuts i.MX Applications Processor with Dedicated Neural Processing Unit for Advanced Machine Learning at the Edge

The new i.MX 8M Plus heterogeneous application processor with dedicated neural network accelerator, independent real-time sub-system, dual camera ISP, high-performance DSP and GPU for edge applications

LAS VEGAS, Nevada, – (CES 2020) – January 6, 2020 – NXP Semiconductors N.V. (NASDAQ: NXPI) today expanded its industry-leading EdgeVerse portfolio with the i.MX 8M Plus application processor – the first i.MX family to integrate a dedicated Neural Processing Unit (NPU) for advanced machine learning inference at the industrial and IoT (Internet-of-Things) edge.

The i.MX 8M Plus combines a high-performance NPU delivering 2.3 TOPS (Tera Operations Per Second) with a Quad-core Arm® Cortex-A53 sub-system running at up to 2GHz, an independent real-time sub-system with an 800MHz Cortex-M7, a high-performance 800 MHz audio DSP for voice and natural language processing, dual camera Image Signal Processors (ISP), and a 3D GPU for rich graphics rendering. With the combination of high-performance Cortex-A53 cores and NPU, edge devices will be able to make intelligent decisions locally by learning and inferring inputs with little or no human intervention. The range of applications made possible with the cost-effective i.MX 8M Plus spans people and object recognition for public safety, industrial machine vision, robotics, hand gesture, and emotion detection with natural language processing for seamless human-to-device interaction with ultra-fast response time and high accuracy.

“The edge is the perfect destination to deploy machine learning applications, especially as technology advancements are enabling accurate localized decision-making,” said Martyn Humphries, vice president and general manager of i.MX application processors for consumer and industrial markets at NXP. “NXP engages with leading companies in the consumer and industrial IoT marketplace, and we look forward with great excitement to the innovative products they will introduce based on the i.MX 8M Plus. The i.MX 8M Plus is a significant milestone and a trendsetter for processing solutions that are capable of transforming the ‘smart’ edge to an ‘intelligent’ edge.”

Driving an Intelligent Breed of Edge Devices with Immersive Multi-media
Built in advanced 14nm LPC FinFET process technology, the NXP i.MX 8M Plus can execute multiple, highly-complex neural networks simultaneously, such as multi-object identification, speech recognition of 40,000+ English words, and medical imaging. The powerful NPU is capable of processing Mobilenet, a popular image classification network at over 500 images per second.

Developers can off-load machine learning inference functions to the NPU, allowing the high-performance Cortex-A and Cortex-M cores, DSP, and GPUs to execute other system-level or user applications tasks. The vision pipeline is anchored by dual integrated ISPs that support two high-definition cameras for real-time stereo vision or a single 12 MPixel resolution camera and includes High Dynamic Range (HDR) and fisheye lens correction. These features enable real-time image processing applications such as surveillance, smart retail applications, robot vision, and home health monitors.

To enable voice applications, the i.MX 8M Plus integrates a high-performance HiFi 4 DSP that enhances natural language processing with pre- and post-processing of voice streams. The powerful Cortex-M7 domain can be used to run real-time response systems while the applications processor domain executes complex non-real-time applications to reduce the overall system-level power consumption by turning off the application processor domain while keeping only the Cortex-M domain alive for wake word detection. The i.MX 8M Plus extends advanced multimedia, and video processing with a system that can compress multiple video feeds using the H.265 or H.264 HD video encoder and decoder for cloud streaming or local storage and a rich user experience enabled by 3D/2D graphics, and Immersiv3D audio with Dolby Atmos® and DTS:X®.

Elevating Intelligence for Industrial IoT
The i.MX 8M Plus advances industrial productivity and automation with machines that can inspect, measure, precisely identify objects, and enable predictive maintenance by accurately detecting anomalies in machine operation. In addition, the factory human-machine interfaces can be made more intuitive and secure by combining accurate face recognition with voice/command recognition and even gesture recognition. Supporting Industry 4.0 IT/OT convergence, the i.MX 8M Plus integrates Gigabit Ethernet with Time-Sensitive Networking (TSN), which combined with Arm Cortex® M7 real-time processing provides deterministic wired network connectivity and processing.

To meet the high quality and reliability standards required for industrial applications, the i.MX 8M Plus features Error Correction Code (ECC) for internal memories and the DDR interface. The family is expected to be qualified to meet the stringent industrial temperature range (-40C to 105C ambient), power-on profile (100 percent power-on), and is planned to be part of NXP’s industry-best longevity commitment (15 years).

Technical Specifications
•       Computation cores: Quad-core Arm® Cortex-A53 up to 2.0GHz and Cortex-M7 up to 800MHz
•       Machine Learning: Neural Processing Unit (NPU) up to 2.3 TOPS
•       Audio and Voice processing: low-power Tensilica® HiFi4 DSP running at 800 MHz
•       Dual Image Signal Processors (ISP): Resolution up to 12MP, 2x MIPI-CSI camera interfaces
•       Video Processing: 1080p Video Encode/Decode including H.265 and H.264
•       GPU: 3D/2D Graphics supporting OpenGL® ES 3.1, Vulkan®, Open CL 1.2 FP and OpenVG™ 1.1
•       Memory support: Error Correction Code (ECC) on internal memories and DDR bus, 32/16-bit DDR3L, DDR4, LPDDR4 up to 4.0GT/s
•       Multiple audio interfaces: TDM, DSD512, S/PDIF, PDM mic input, eARC, and ASRC.
•       Display: HDMI 2.0b Tx, MIPI DSI, LVDS (4/8-lane) Tx
•       Wired connectivity: 2x Gigabit Ethernet with AVB, IEEE 1588, EEE and 1x with TSN, 2x CAN-FD, 2x USB 3.0/2.0 OTG with PHY type C and PCIe Gen3
•       Power Management Solution by NXP system PMIC (PCA9450C), tailor-made and optimized for the i.MX 8M Plus applications processor.

Product Availability and Demonstration
NXP expects to begin sampling the i.MX 8M Plus applications processors to customers in 1Q 2020. The company will showcase its i.MX applications processor families at CES 2020 in its booth, CP-18, in Las Vegas between January 8-11.

For more information, please contact a local NXP sales representative.

NXP CES 2020 Press Kit: https://media.nxp.com/press-kit

About NXP Semiconductors
NXP Semiconductors N.V. enables secure connections for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 30,000 employees in more than 30 countries and posted revenue of $9.41 billion in 2018. Find out more at www.nxp.com

Leave a Reply

featured blogs
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Battery-free IoT devices: Enabled by Infineon’s NFC Energy-Harvesting
Sponsored by Mouser Electronics and Infineon
Energy harvesting has become more popular than ever before for a wide range of IoT devices. In this episode of Chalk Talk, Amelia Dalton chats with Stathis Zafiriadis from Infineon about the details of Infineon’s NFC energy harvesting technology and how you can get started using this technology in your next IoT design. They discuss the connectivity and sensing capabilities of Infineon’s NAC1080 and NGC1081 NFC actuation controllers and the applications that would be a great fit for these innovative solutions.
Aug 17, 2023
30,006 views