industry news
Subscribe Now

KIOXIA Introduces Next-Generation UFS Ver. 4.0 Devices

New 256GB, 512GB and 1TB Devices Allow Smartphones and Mobile Applications to Take Full Advantage of 5G Networks

SAN JOSE, Calif.–(BUSINESS WIRE)–Continuing to move Universal Flash Storage1 (UFS) technology forwardKIOXIA America, Inc. today announced sampling2 of new, higher performing UFS Ver. 4.0 embedded flash memory devices3. These devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation mobile applications, including leading-edge smartphones. The improved performance3 of UFS products from KIOXIA enables these applications to take advantage of 5G’s connectivity benefits, leading to faster downloads, reduced lag time and an improved user experience.

UFS Ver. 4.0 devices from KIOXIA integrate the company’s innovative BiCS FLASH™ 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 gigabits per second (Gbp/s) per lane or 46.4 Gbp/s per device. UFS 4.0 is backward compatible with UFS 3.1.

“Once again KIOXIA is maintaining its leadership in UFS, with our pipeline of newer, faster performing UFS devices,” noted Scott Beekman, vice president, Memory Business Unit, for KIOXIA America, Inc. “This is our second generation of UFS 4.0 devices, which were developed to keep pushing the performance boundaries from generation to generation.”

Key Features include:

  • Performance improvement over previous generation4: +18% sequential write, +30% random write and +13% random read.
  • Supports High Speed Link Startup Sequence (HS-LSS) features: With conventional UFS, Link Startup (M-PHY and UniPro initialization sequence) between device and host is performed at low-speed PWM-G1 (3~9 megabits per second5), but with HS-LSS, it can be performed at a faster HS-G1 Rate A (1248 megabits per second5). This is expected to reduce the time for Link Startup by approximately 70% compared to the conventional method.
  • Enhances security: By utilizing Advanced RPMB (Replay Protected Memory Block) for faster read and write access to security data, such as user credentials on RPMB area, and RPMB Purge to ensure discarded data may be sanitized securely and rapidly.
  • Supports Extended Initiator ID (Ext-IID): Intended to be used with Multi Circular Queue (MCQ) at the UFS 4.0 host controller for improved random performance.

For more information, please visit www.kioxia.com.

About KIOXIA America, Inc.

KIOXIA America, Inc. is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D flash memory technology, KIOXIA continues to pioneer innovative memory, SSD and software solutions that enrich people’s lives and expand society’s horizons. The company’s innovative BiCS FLASH™ 3D flash memory technology is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers.

Leave a Reply

featured blogs
Sep 21, 2023
Wireless communication in workplace wearables protects and boosts the occupational safety and productivity of industrial workers and front-line teams....
Sep 21, 2023
Labforge is a Waterloo, Ontario-based company that designs, builds, and manufactures smart cameras used in industrial automation and defense applications. By bringing artificial intelligence (AI) into their vision systems with Cadence , they can automate tasks that are diffic...
Sep 21, 2023
At Qualcomm AI Research, we are working on applications of generative modelling to embodied AI and robotics, in order to enable more capabilities in robotics....
Sep 21, 2023
Not knowing all the stuff I don't know didn't come easy. I've had to read a lot of books to get where I am....
Sep 21, 2023
See how we're accelerating the multi-die system chip design flow with partner Samsung Foundry, making it easier to meet PPA and time-to-market goals.The post Samsung Foundry and Synopsys Accelerate Multi-Die System Design appeared first on Chip Design....

featured video

TDK PowerHap Piezo Actuators for Ideal Haptic Feedback

Sponsored by TDK

The PowerHap product line features high acceleration and large forces in a very compact design, coupled with a short response time. TDK’s piezo actuators also offers good sensing functionality by using the inverse piezo effect. Typical applications for the include automotive displays, smartphones and tablet.

Click here for more information about PowerHap Piezo Actuators

featured paper

Intel's Chiplet Leadership Delivers Industry-Leading Capabilities at an Accelerated Pace

Sponsored by Intel

We're proud of our long history of rapid innovation in #FPGA development. With the help of Intel's Embedded Multi-Die Interconnect Bridge (EMIB), we’ve been able to advance our FPGAs at breakneck speed. In this blog, Intel’s Deepali Trehan charts the incredible history of our chiplet technology advancement from 2011 to today, and the many advantages of Intel's programmable logic devices, including the flexibility to combine a variety of IP from different process nodes and foundries, quicker time-to-market for new technologies and the ability to build higher-capacity semiconductors

To learn more about chiplet architecture in Intel FPGA devices visit: https://intel.ly/47JKL5h

featured chalk talk

Industrial Internet of Things (IIoT)
Sponsored by Mouser Electronics and Eaton
In this episode of Chalk Talk, Amelia Dalton and Mohammad Mohiuddin from Eaton explore the components, communication protocols, and sensing solutions needed for today’s growing IIoT infrastructure. They take a closer look at how Eaton's circuit protection solutions, magnetics, capacitors and terminal blocks can help you ensure the success of your next industrial internet of things design.
Jun 14, 2023
12,774 views