Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop

Indium Corporation will feature its metallic thermal interface materials (TIMs) at the Advanced Technology Workshop on Thermal Management, Nov. 6-8 in Los Gatos, California.

Indium Corporation’s metallic TIMs are easy to handle and rework. These products provide higher thermal conductivity as compared to polymer-based TIMs, making them ideal for die-attach, burn-in and test, IGBT applications, and almost any application where high performance thermal materials are required.

Metallic TIMs can be used as either a solder or compressible material:

Solder TIMs, such as Solder Preforms, reflow and melt to form a mechanical bond
Compressible TIMs, such as Heat-Spring^® or non-reflow metals, like Liquid Metal, do not require heat and support temperature-sensitive applications

Indium Corporation’s metallic TIMs can be custom-made to your specifications with a variety of materials based on your product or process needs and include Pb-free options.

See our experts at the show or visit www.indium.com to learn more.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), atwww.facebook.com/indium or @IndiumCorp.

Want early design analysis without simulation?

Sponsored by Siemens Digital Industries Software

Traditional verification methods are failing today's complex IC designs, which require a proactive, early-stage analysis approach. A shift-left methodology addresses IP block integration challenges and the limitations of traditional simulation and ERC tools. Insight Analyzer detects hard-to-find leakage issues across power domains, enabling early analysis without full simulation. Identify inefficiencies earlier to reduce rework, improve reliability, and enhance power performance.

Click to read more!

featured chalk talk

Analog Output, Isolated Current, & Voltage Sensing Using Isolation Amplifiers

Sponsored by Mouser Electronics and Vishay

In this episode of Chalk Talk, Simon Goodwin from Vishay and Amelia Dalton chat about analog output, and isolated current and voltage sensing using isolation amplifiers. Simon and Amelia also explore the fundamental principles of current and voltage sensing and the variety of voltage and current sensing solutions offered by Vishay that can get your next design up and running in no time.

Click here for more information about Vishay / Dale Reference Designs

Apr 27, 2026

6,975 views

Indium Corporation to Feature Thermal Interface Materials at Thermal Management Workshop

Related