Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.

WS-910 Flip-Chip Flux is designed to provide best-in-class residue cleaning for a water-soluble flip-chip flux, allowing for excellent compatibility with molded and capillary underfill. The new product also offers high tackiness for a flip-chip flux, which is useful when holding large die in place during the reflow process. WS-910 expands Indium Corporation’s extensive line of semiconductor assembly solutions, supporting advanced packaging and high-reliability applications.

Halogen-free WS-910 Flip-Chip Flux delivers several benefits to users, including:

• High tackiness minimizes non-wet open defects and “cold joints”
• Promotes excellent solderability onto a wide range of surfaces
• Ensures consistent yields through consistent dipping performance over extended periods
• Excellent cleaning with pure room-temperature deionized water
• Designed for Pb-free applications and suitable for all high-Sn solders
• Compatible with a wide variety of conventional ultrafiltration and modified ultrafiltration

Indium Corporation’s flip-chip flux series addresses common miniaturization challenges, including thin or warped substrates and fine-pitch, high I/O count assembly. The company offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provide a sustainable, low-residue alternative to traditional water-soluble fluxes.

To learn more about Indium Corporation’s flip-chip flux products, visit https://www.indium.com/products/fluxes/semiconductor-fluxes/flip-chip-flux/.

About Indium Corporation

Indium Corporation^® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil^®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another^® (#FOETA), at www.linkedin.com/company/indium-corporation/.